公开(公告)号：US11848220B2

公开(公告)日：2023-12-19

申请号：US17180570

申请日：2021-02-19

申请人： Applied Materials, Inc.

发明人： Earl Hunter ,  Russell Duke ,  Amitabh Puri ,  Steven M. Reedy

IPC分类号： H01L21/67 ,  G05B19/04 ,  G05B19/41 ,  B24B1/00 ,  B24B37/20 ,  B24B37/30 ,  G05B19/042 ,  G05B19/418 ,  G06K7/10 ,  H04L9/40 ,  H04W12/06 ,  B24B37/005 ,  B24B7/20

CPC分类号： H01L21/67294 ,  G05B19/0425 ,  G05B19/4183 ,  G06K7/10366 ,  H04L63/0492 ,  H04W12/06 ,  B24B1/00 ,  B24B7/20 ,  B24B37/005 ,  B24B37/30 ,  G05B2219/31322 ,  G05B2219/45031

摘要： Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components, including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example, radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.

公开(公告)号：US11856706B2

公开(公告)日：2023-12-26

申请号：US16702031

申请日：2019-12-03

申请人： Applied Materials, Inc.

发明人： Hsui Yang ,  Yao-Hung Yang ,  Jeevan Shanbhag ,  Chien-Min Liao ,  Earl Hunter ,  David Ganon ,  Mariana Luigi ,  Siamak Salimian ,  Tom K. Cho ,  Chun-Chung Chen

IPC分类号： H05K13/08 ,  H01L21/67

CPC分类号： H05K13/087 ,  H01L21/67276 ,  H01L21/67294

摘要： The present disclosure is directed to a system and method to identify and track parts of a semiconductor processing chamber, as well as the status of the parts, and store status information in a centralized location as status changes over time.

公开(公告)号：US11188926B2

公开(公告)日：2021-11-30

申请号：US16412146

申请日：2019-05-14

申请人： Applied Materials, Inc.

发明人： Earl Hunter ,  David Ganon ,  Amitabh Puri ,  Gerard Crean

IPC分类号： G06Q30/00 ,  G06K7/14 ,  G06K7/10 ,  H04L9/06

摘要： Implementations described herein generally relate to improved part authentication. In one implementation, a method includes acquiring information related to a part. The information may include identification information of the part and a unique code. The method further includes determining, using a stored algorithm, whether the unique code comprises a result of applying the stored algorithm to the identification information. The method further includes, responsive to determining that the unique code comprises the result of applying the stored algorithm to the identification information, activating a feature of the part or a feature of process equipment associated with the part.

公开(公告)号：US10930535B2

公开(公告)日：2021-02-23

申请号：US15810628

申请日：2017-11-13

申请人： Applied Materials, Inc.

发明人： Earl Hunter ,  Russell Duke ,  Amitabh Puri ,  Steven M. Reedy

IPC分类号： G05B19/04 ,  G05B19/41 ,  H04W12/06 ,  B24B37/20 ,  H01L21/67 ,  G05B19/042 ,  G05B19/418 ,  G06K7/10 ,  H04L29/06 ,  B24B1/00 ,  B24B37/005 ,  B24B37/30

摘要： Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.