公开(公告)号：US11848220B2

公开(公告)日：2023-12-19

申请号：US17180570

申请日：2021-02-19

Applicant: Applied Materials, Inc.

Inventor： Earl Hunter ,  Russell Duke ,  Amitabh Puri ,  Steven M. Reedy

IPC: H01L21/67 ,  G05B19/04 ,  G05B19/41 ,  B24B1/00 ,  B24B37/20 ,  B24B37/30 ,  G05B19/042 ,  G05B19/418 ,  G06K7/10 ,  H04L9/40 ,  H04W12/06 ,  B24B37/005 ,  B24B7/20

CPC classification number: H01L21/67294 ,  G05B19/0425 ,  G05B19/4183 ,  G06K7/10366 ,  H04L63/0492 ,  H04W12/06 ,  B24B1/00 ,  B24B7/20 ,  B24B37/005 ,  B24B37/30 ,  G05B2219/31322 ,  G05B2219/45031

Abstract: Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components, including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example, radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.

公开(公告)号：US20190011967A1

公开(公告)日：2019-01-10

申请号：US16044431

申请日：2018-07-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Ronald Vern Schauer ,  Mark Roger Covington ,  Suresh Kumaraswami ,  Amitabh Puri

IPC: G06F1/26 ,  H02J4/00 ,  G06F13/10 ,  G06F9/455 ,  G05B19/02

Abstract: Embodiments of the invention are directed toward systems and methods that execute legacy semiconductor applications using a non-legacy controller. In some embodiments a hardware abstraction layer and/or an emulator can be used to provide communication between a non-legacy operating system and legacy components including legacy applications. In some embodiments various methods and/or devices can be used to emulate and/or translate communications between legacy and non-legacy components.

公开(公告)号：US10037064B2

公开(公告)日：2018-07-31

申请号：US15194270

申请日：2016-06-27

Applicant: APPLIED MATERIALS, INC.

Inventor： Ronald Vern Schauer ,  Mark Roger Covington ,  Suresh Kumaraswami ,  Amitabh Puri

IPC: G06F1/30 ,  G06F1/26 ,  G06F9/455 ,  G06F13/10 ,  G05B19/02 ,  H02J4/00

CPC classification number: G06F1/263 ,  G05B19/02 ,  G06F9/45508 ,  G06F13/105 ,  H02J4/00 ,  Y10T307/406

Abstract: Embodiments of the invention are directed toward systems and methods that execute legacy semiconductor applications using a non-legacy controller. In some embodiments a hardware abstraction layer and/or an emulator can be used to provide communication between a non-legacy operating system and legacy components including legacy applications. In some embodiments various methods and/or devices can be used to emulate and/or translate communications between legacy and non-legacy components.

公开(公告)号：US20140044503A1

公开(公告)日：2014-02-13

申请号：US13961538

申请日：2013-08-07

Applicant: Applied Materials, Inc.

Inventor： Eric A. Englhardt ,  Steve Szudarski ,  Andrew Scott Cornelius ,  Amitabh Puri ,  Michael Robert Rice ,  Jeffrey C. Hudgens ,  Steven V. Sansoni ,  Robert Irwin Decottignies ,  Dean C. Hruzek ,  Peter Irwin ,  Nir Merry

IPC: H01L21/677

CPC classification number: H01L21/67739 ,  H01L21/67161 ,  H01L21/67184

Abstract: In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.

Abstract translation: 在一些实施例中，提供了一种链接的加工工具系统，其包括（1）具有至少第一传送室的第一处理工具，所述第一传送室被配置为耦合到多个处理室; （2）具有至少第二传送室的第二处理工具，所述第二传送室被配置为耦合到多个处理室; （3）耦合在所述第一和第二处理工具之间并被配置为在所述第一和第二处理工具之间传送衬底的第三传送室; 以及（4）单个定序器，其控制所述连接的处理工具系统的第一处理工具，第二处理工具和第三传送室之间的衬底传送操作。 提供了许多其他方面。

公开(公告)号：US20250038024A1

公开(公告)日：2025-01-30

申请号：US18814094

申请日：2024-08-23

Applicant: Applied Materials, Inc.

Inventor： Douglas Brian Baumgarten ,  Russell Kaplan ,  Amitabh Puri ,  Paul B. Reuter

IPC: H01L21/673 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C23C16/52 ,  C23C16/54 ,  H01L21/67 ,  H01L21/677

Abstract: Disclosed are implementations for efficient purging of substrate carriers (and content held therein) and preventing external contaminants from entering a gas purge apparatus by coupling the gas purge apparatus to a substrate carrier, performing a first gas purging session of an environment of the substrate carrier, receiving a first signal of a first signal type, responsive to receiving the first signal, keeping the gas purge apparatus coupled to the substrate carrier, performing a second gas purging session of the environment of the substrate carrier, receiving a second signal of a second signal type, and, responsive to receiving the second signal, decoupling the purge apparatus from the substrate carrier.

公开(公告)号：US20220010427A1

公开(公告)日：2022-01-13

申请号：US16946872

申请日：2020-07-09

Applicant: Applied Materials, Inc.

Inventor： Douglas Brian Baumgarten ,  Russell Kaplan ,  Amitabh Puri ,  Paul B. Reuter

IPC: C23C16/458 ,  C23C16/44 ,  H01L21/677 ,  H01L21/67 ,  C23C16/455 ,  C23C16/52

Abstract: Disclosed are implementations for efficient purging of substrate carriers (and content held therein) and preventing external contaminants from entering a gas purge apparatus by coupling the gas purge apparatus to a substrate carrier, performing a first gas purging session of an environment of the substrate carrier, receiving a first signal of a first signal type, responsive to receiving the first signal, keeping the gas purge apparatus coupled to the substrate carrier, performing a second gas purging session of the environment of the substrate carrier, receiving a second signal of a second signal type, and, responsive to receiving the second signal, decoupling the purge apparatus from the substrate carrier.

公开(公告)号：US11188926B2

公开(公告)日：2021-11-30

申请号：US16412146

申请日：2019-05-14

Applicant: Applied Materials, Inc.

Inventor： Earl Hunter ,  David Ganon ,  Amitabh Puri ,  Gerard Crean

IPC: G06Q30/00 ,  G06K7/14 ,  G06K7/10 ,  H04L9/06

Abstract: Implementations described herein generally relate to improved part authentication. In one implementation, a method includes acquiring information related to a part. The information may include identification information of the part and a unique code. The method further includes determining, using a stored algorithm, whether the unique code comprises a result of applying the stored algorithm to the identification information. The method further includes, responsive to determining that the unique code comprises the result of applying the stored algorithm to the identification information, activating a feature of the part or a feature of process equipment associated with the part.

公开(公告)号：US10930535B2

公开(公告)日：2021-02-23

申请号：US15810628

申请日：2017-11-13

Applicant: Applied Materials, Inc.

Inventor： Earl Hunter ,  Russell Duke ,  Amitabh Puri ,  Steven M. Reedy

IPC: G05B19/04 ,  G05B19/41 ,  H04W12/06 ,  B24B37/20 ,  H01L21/67 ,  G05B19/042 ,  G05B19/418 ,  G06K7/10 ,  H04L29/06 ,  B24B1/00 ,  B24B37/005 ,  B24B37/30

Abstract: Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.

公开(公告)号：US12074045B2

公开(公告)日：2024-08-27

申请号：US18474116

申请日：2023-09-25

Applicant: Applied Materials, Inc.

Inventor： Douglas Brian Baumgarten ,  Russell Kaplan ,  Amitabh Puri ,  Paul B. Reuter

IPC: H01L21/673 ,  C23C16/44 ,  C23C16/458 ,  C23C16/52 ,  C23C16/54 ,  H01L21/67 ,  H01L21/677 ,  C23C16/455

CPC classification number: H01L21/67389 ,  C23C16/54 ,  H01L21/67242 ,  H01L21/67772 ,  C23C16/4408 ,  C23C16/45563 ,  C23C16/458 ,  C23C16/52 ,  H01L21/67775 ,  Y10T137/0402

Abstract: Disclosed are implementations for efficient purging of substrate carriers (and content held therein) and preventing external contaminants from entering a gas purge apparatus by coupling the gas purge apparatus to a substrate carrier, performing a first gas purging session of an environment of the substrate carrier, receiving a first signal of a first signal type, responsive to receiving the first signal, keeping the gas purge apparatus coupled to the substrate carrier, performing a second gas purging session of the environment of the substrate carrier, receiving a second signal of a second signal type, and, responsive to receiving the second signal, decoupling the purge apparatus from the substrate carrier.

公开(公告)号：US20240014056A1

公开(公告)日：2024-01-11

申请号：US18474116

申请日：2023-09-25

Applicant: Applied Materials, Inc.

Inventor： Douglas Brian Baumgarten ,  Russell Kaplan ,  Amitabh Puri ,  Paul B. Reuter

IPC: H01L21/673 ,  H01L21/67 ,  H01L21/677 ,  C23C16/54

CPC classification number: H01L21/67389 ,  H01L21/67242 ,  H01L21/67772 ,  C23C16/54 ,  C23C16/458

Abstract: Disclosed are implementations for efficient purging of substrate carriers (and content held therein) and preventing external contaminants from entering a gas purge apparatus by coupling the gas purge apparatus to a substrate carrier, performing a first gas purging session of an environment of the substrate carrier, receiving a first signal of a first signal type, responsive to receiving the first signal, keeping the gas purge apparatus coupled to the substrate carrier, performing a second gas purging session of the environment of the substrate carrier, receiving a second signal of a second signal type, and, responsive to receiving the second signal, decoupling the purge apparatus from the substrate carrier.