公开(公告)号：US20170114462A1

公开(公告)日：2017-04-27

申请号：US15290029

申请日：2016-10-11

Applicant: Applied Materials, Inc.

Inventor： Lin ZHANG ,  Xuesong LU ,  Andrew V. LE ,  Zheng YUAN ,  Jang Seok OH ,  Joseph Jamil FARAH ,  Rongping WANG

IPC: C23C16/455 ,  C23C16/50 ,  C23C16/458 ,  H01L21/67

CPC classification number: C23C16/45565 ,  C23C16/458 ,  C23C16/50 ,  C23C16/5096 ,  H01J37/32899 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201

Abstract: Embodiments of the present disclosure generally relate to a cluster tool for processing semiconductor substrates. In one embodiment, a cluster tool includes a plurality of process chambers connected to a transfer chamber and each process chamber may simultaneously process four or more substrates. In order to reduce cost, each process chamber includes a substrate support for supporting four or more substrates, single showerhead disposed over the substrate support, and a single radio frequency power source electrically coupled to the showerhead. The showerhead may include a first surface facing the substrate support and a second surface opposite the first surface. A plurality of gas passages may be formed in the showerhead extending from the first surface to the second surface. Process uniformity is improved by increasing the density of the gas passages from the center of the showerhead to the edge of the showerhead.