公开(公告)号：US20190323960A1

公开(公告)日：2019-10-24

申请号：US16455689

申请日：2019-06-27

Applicant: Applied Materials, Inc.

Inventor： Lin ZHANG ,  Xuesong LU ,  Andrew V. LE ,  Fa JI ,  Jang Seok OH ,  Patrick L. SMITH ,  Shawyon JAFARI ,  Ralph Peter ANTONIO

IPC: G01N21/53 ,  H01L21/67 ,  H01L21/677 ,  G01N1/22

Abstract: An FI having an in-situ particle detector and a method for particle detection therein are provided. In one aspect, the FI includes a fan, a substrate support, a particle detector, and an exhaust outlet. The fan, substrate support, and particle detector are arranged such that, in operation, the fan directs air towards the exhaust outlet and over a substrate on the substrate support to create laminar flow. The particle detector, positioned downstream from the substrate support and upstream from the exhaust outlet, analyzes the air and detects particle concentration before the particles are exhausted. The collected particle detection data may be combined with data from other sensors in the FI and used to identify the source of particle contamination. The particle detector may also be incorporated into other system components, including but not limited to, a load-lock or buffer chamber to detect particle concentration therein.

公开(公告)号：US20180156727A1

公开(公告)日：2018-06-07

申请号：US15793458

申请日：2017-10-25

Applicant: Applied Materials, Inc.

Inventor： Lin ZHANG ,  Xuesong LU ,  Andrew V. LE ,  Fa JI ,  Jang Seok OH ,  Patrick L. SMITH ,  Shawyon JAFARI ,  Ralph Peter ANTONIO

IPC: G01N21/53 ,  G01N15/02

CPC classification number: G01N21/53 ,  G01N1/22 ,  G01N1/2247 ,  G01N15/0205 ,  G01N2015/0046 ,  G01N2015/0693 ,  H01L21/67017 ,  H01L21/67253 ,  H01L21/67778

Abstract: An FI having an in-situ particle detector and a method for particle detection therein are provided. In one aspect, the FI includes a fan, a substrate support, a particle detector, and an exhaust outlet. The fan, substrate support, and particle detector are arranged such that, in operation, the fan directs air towards the exhaust outlet and over a substrate on the substrate support to create laminar flow. The particle detector, positioned downstream from the substrate support and upstream from the exhaust outlet, analyzes the air and detects particle concentration before the particles are exhausted. The collected particle detection data may be combined with data from other sensors in the FI and used to identify the source of particle contamination. The particle detector may also be incorporated into other system components, including but not limited to, a load-lock or buffer chamber to detect particle concentration therein.

公开(公告)号：US20190169743A1

公开(公告)日：2019-06-06

申请号：US16268194

申请日：2019-02-05

Applicant: Applied Materials, Inc.

Inventor： Lin ZHANG ,  Xuesong LU ,  Andrew V. LE ,  Jang Seok OH

IPC: C23C16/455 ,  H01J37/32 ,  C23C16/507 ,  C23C16/44 ,  C23C16/34 ,  C23C16/505 ,  C23C16/40

Abstract: Embodiments described herein relate to apparatus and coating methods to reduce chamber arcing, for example, in HDP-CVD, PECVD, PE-ALD and Etch chambers. The apparatus include a ring shaped gas distributor used for in-situ deposition of coating materials, and a process chamber including the same. The ring shaped gas distributor includes a ring shaped body having at least one gas entrance port disposed on a first side thereof and a plurality of gas distribution ports disposed on a first surface of the ring shaped body. The plurality of gas distribution ports are arranged in a plurality of evenly distributed rows. The plurality of gas distribution ports in a first row of the plurality of evenly distributed rows is adapted to direct gas at an exit angle different from an exit angle of the plurality of gas distribution ports in a second row of the plurality of evenly distributed rows.

公开(公告)号：US20170323768A1

公开(公告)日：2017-11-09

申请号：US15145750

申请日：2016-05-03

Applicant: Applied Materials, Inc.

Inventor： Lin ZHANG ,  Xuesong LU ,  Andrew V. LE ,  Jang Seok OH ,  Xinhai HAN

IPC: H01J37/32

CPC classification number: H01J37/32082 ,  H01J37/32862 ,  H01J2237/334 ,  H01J2237/335

Abstract: Embodiments of the disclosure include methods for in-situ chamber cleaning efficiency enhancement process for a plasma processing chamber utilized for a semiconductor substrate fabrication process. In one embodiment, a method for performing a plasma treatment process after cleaning a plasma process includes performing a cleaning process in a plasma processing chamber in absent of a substrate disposed thereon, subsequently supplying a plasma treatment gas mixture including at least a hydrogen containing gas and/or an oxygen containing gas into the plasma processing chamber, applying a RF source power to the processing chamber to form a plasma from the plasma treatment gas mixture, and plasma treating an interior surface of the processing chamber.

公开(公告)号：US20170114462A1

公开(公告)日：2017-04-27

申请号：US15290029

申请日：2016-10-11

Applicant: Applied Materials, Inc.

Inventor： Lin ZHANG ,  Xuesong LU ,  Andrew V. LE ,  Zheng YUAN ,  Jang Seok OH ,  Joseph Jamil FARAH ,  Rongping WANG

IPC: C23C16/455 ,  C23C16/50 ,  C23C16/458 ,  H01L21/67

CPC classification number: C23C16/45565 ,  C23C16/458 ,  C23C16/50 ,  C23C16/5096 ,  H01J37/32899 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201

Abstract: Embodiments of the present disclosure generally relate to a cluster tool for processing semiconductor substrates. In one embodiment, a cluster tool includes a plurality of process chambers connected to a transfer chamber and each process chamber may simultaneously process four or more substrates. In order to reduce cost, each process chamber includes a substrate support for supporting four or more substrates, single showerhead disposed over the substrate support, and a single radio frequency power source electrically coupled to the showerhead. The showerhead may include a first surface facing the substrate support and a second surface opposite the first surface. A plurality of gas passages may be formed in the showerhead extending from the first surface to the second surface. Process uniformity is improved by increasing the density of the gas passages from the center of the showerhead to the edge of the showerhead.

公开(公告)号：US20160077025A1

公开(公告)日：2016-03-17

申请号：US14521345

申请日：2014-10-22

Applicant: Applied Materials, Inc.

Inventor： Lin ZHANG ,  Shuran SHENG ,  Andrew V. LE

IPC: G01N23/201 ,  G01N23/18 ,  G01T7/08 ,  G01N23/083

CPC classification number: G01N23/201 ,  G01N23/207 ,  G01N2223/071 ,  G01N2223/602 ,  G01T7/08 ,  G03F7/70625 ,  H01L22/12

Abstract: An apparatus for integrating metrology and method for using the same are disclosed. The apparatus includes a multi-chamber system having a transfer chamber, a deposition chamber, an etch chamber and a metrology chamber, and a robot configured to transfer a substrate between the deposition chamber or etch chamber and the metrology chamber.

Abstract translation: 公开了一种用于集成度量的装置及其使用方法。 该装置包括具有传送室，沉积室，蚀刻室和计量室的多室系统，以及被配置为在沉积室或蚀刻室与计量室之间传送衬底的机器人。

公开(公告)号：US20170162370A1

公开(公告)日：2017-06-08

申请号：US15348579

申请日：2016-11-10

Applicant: Applied Materials, Inc.

Inventor： Lin ZHANG ,  Rongping WANG ,  Jian J. CHEN ,  Michael S. COX ,  Andrew V. LE

IPC: H01J37/32

CPC classification number: H01J37/32944 ,  H01J37/32082 ,  H01J37/32715

Abstract: Embodiments described herein generally relate to a plasma processing chamber and a detection apparatus for arcing events. In one embodiment, an arcing detection apparatus is disclosed herein. The arcing detection apparatus comprises a probe, a detection circuit, and a data log system. The probe positioned partially exposed to an interior volume of a plasma processing chamber. The detection circuit is configured to receive an analog signal from the probe and output an output signal scaling events present in the analog signal. The data log system is communicatively coupled to receive the output signal from the detection circuit. The data log system is configured to track arcing events occurring in the interior volume.

公开(公告)号：US20170159176A1

公开(公告)日：2017-06-08

申请号：US15334431

申请日：2016-10-26

Applicant: Applied Materials, Inc.

Inventor： Lin ZHANG ,  Xuesong LU ,  Andrew V. LE ,  Jang Seok OH

IPC: C23C16/455 ,  C23C16/40 ,  C23C16/34 ,  C23C16/505

CPC classification number: C23C16/4558 ,  C23C16/34 ,  C23C16/403 ,  C23C16/4404 ,  C23C16/45536 ,  C23C16/45544 ,  C23C16/505 ,  C23C16/507 ,  H01J37/3244 ,  H01J37/32449

Abstract: Embodiments described herein relate to apparatus and coating methods to reduce chamber arcing, for example, in HDP-CVD, PECVD, PE-ALD and Etch chambers. The apparatus include a ring shaped gas distributor used for in-situ deposition of coating materials, and a process chamber including the same. The ring shaped gas distributor includes a ring shaped body having at least one gas entrance port disposed on a first side thereof and a plurality of gas distribution ports disposed on a first surface of the ring shaped body. The plurality of gas distribution ports are arranged in a plurality of evenly distributed rows. The plurality of gas distribution ports in a first row of the plurality of evenly distributed rows is adapted to direct gas at an exit angle different from an exit angle of the plurality of gas distribution ports in a second row of the plurality of evenly distributed rows.