LOW TEMPERATURE BIASABLE SUBSTRATE SUPPORT
    3.
    发明申请

    公开(公告)号:US20200350195A1

    公开(公告)日:2020-11-05

    申请号:US16447518

    申请日:2019-06-20

    Abstract: Embodiments described herein relate to a substrate support and techniques for controlling a temperature of the same. The substrate support includes a heating element and an over temperature switch disposed therein. The heating element heats the substrate support and a substrate disposed thereon. The over temperature switch controls a temperature of the heating element and the substrate support. The over temperature switch is operable to switch states in response to a temperature of the substrate support exceeding a predefined temperature.

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