公开(公告)号：US20240027916A1

公开(公告)日：2024-01-25

申请号：US18198073

申请日：2023-05-16

Applicant: Applied Materials, Inc.

Inventor： RUIYING HAO ,  TODD EGAN ,  EDWARD BUDIARTO ,  PAOLA DE CECCO ,  REGINA FREED ,  BEKELE WORKU ,  MADHUR SACHAN ,  LUISA BOZANO ,  KELVIN CHAN

IPC: G03F7/20 ,  G03F7/00

CPC classification number: G03F7/70491 ,  G03F7/70653 ,  G03F7/706843 ,  G03F7/70808 ,  G03F7/7085

Abstract: Embodiments disclosed herein include a method of monitoring a photoresist deposition process. In an embodiment, the method comprises depositing a photoresist layer to a first thickness over a substrate, measuring a property of the photoresist layer with a first electromagnetic (EM) radiation source, depositing the photoresist layer to a second thickness over the substrate, and measuring the property of the photoresist layer with the first EM radiation source.

公开(公告)号：US20240194484A1

公开(公告)日：2024-06-13

申请号：US18379102

申请日：2023-10-11

Applicant: Applied Materials, Inc.

Inventor： RUIYING HAO ,  PAOLA DE CECCO ,  MADHUR SACHAN ,  KWANGDUK D. LEE ,  MARTHA SANCHEZ ,  LUISA BOZANO

IPC: H01L21/033

CPC classification number: H01L21/0332 ,  G03F7/094

Abstract: Embodiments disclosed herein include a method for forming a photoresist stack. In an embodiment, the method comprises forming a first photoresist layer over a substrate, where the first photoresist layer is formed with a first dry deposition process, and forming a second photoresist layer over the first photoresist layer, where the second photoresist layer is formed with a second dry deposition process that is different than the first deposition process.

公开(公告)号：US20240012325A1

公开(公告)日：2024-01-11

申请号：US18204805

申请日：2023-06-01

Applicant: Applied Materials, Inc.

Inventor： LUISA BOZANO ,  PAOLA DE CECCO ,  BEKELE WORKU ,  LAKMAL CHARIDU KALUTARAGE ,  RUIYING HAO

IPC: G03F7/004 ,  H01L21/67 ,  G03F7/16

CPC classification number: G03F7/0043 ,  H01L21/67225 ,  G03F7/168

Abstract: Embodiments disclosed herein include a method of optimizing a post deposition bake of a photoresist layer. In an embodiment, the method comprises depositing the photoresist layer on a substrate, baking the photoresist layer, and measuring properties of the photoresist layer with an optical tool.