公开(公告)号：US11651987B2

公开(公告)日：2023-05-16

申请号：US17672507

申请日：2022-02-15

申请人： Applied Materials, Inc.

发明人： Stephen Donald Prouty ,  Andreas Schmid ,  Jonathan Simmons ,  Sumanth Banda

IPC分类号： H01T23/00 ,  H01L21/683 ,  H01L21/673

CPC分类号： H01L21/6833 ,  H01L21/67376

摘要： A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned in a groove formed in the cooling base and configured to form a seal between the cooling base and one or both of the porous plug and the body of the electrostatic chuck.

公开(公告)号：US11373893B2

公开(公告)日：2022-06-28

申请号：US16997300

申请日：2020-08-19

申请人： Applied Materials, Inc.

发明人： Yogananda Sarode Vishwanath ,  Steven E. Babayan ,  Stephen Donald Prouty ,  Alvaro Garcia De Gorordo ,  Andreas Schmid ,  Andrew Antoine Noujaim

IPC分类号： H01L21/683 ,  H01J37/32

摘要： Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a base channel disposed therein, and a facility plate having a facility channel disposed therein. The facility plate includes a plate portion and a wall portion. The plate portion is coupled to the ESC base assembly and the wall portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the wall portion of the facility plate, and the seal assembly.

公开(公告)号：US11380572B2

公开(公告)日：2022-07-05

申请号：US16857082

申请日：2020-04-23

申请人： Applied Materials, Inc.

发明人： Stephen Donald Prouty ,  Andreas Schmid ,  Jonathan Simmons ,  Sumanth Banda

IPC分类号： H01T23/00 ,  H01L21/683 ,  H01L21/673

摘要： A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned adjacent to the porous plug and is configured to form one or more of a radial seal between the porous plug and the cavity and an axial seal between the porous plug and the cooling base.

公开(公告)号：US11646183B2

公开(公告)日：2023-05-09

申请号：US16825466

申请日：2020-03-20

申请人： Applied Materials, Inc.

发明人： Stephen Donald Prouty ,  Alvaro Garcia De Gorordo ,  Andreas Schmid ,  Andrew Antoine Noujaim

IPC分类号： H01J37/32 ,  H01L21/67 ,  H01L21/683

CPC分类号： H01J37/32798 ,  H01J37/3244 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67069 ,  H01L21/6833 ,  H01J2237/002 ,  H01J2237/2007 ,  H01J2237/334

摘要： Semiconductor chamber components are described herein that includes one or more conduits for carrying a fluid between powered and grounded portions of the chamber component, the conduit configure to be less prone to arcing as compared to conventional components. In one example, a semiconductor chamber component is provided that includes a powered region, a grounded region, and a fluid conduit. The fluid conduit is disposed within the semiconductor chamber component and passes through the powered and grounded regions. The fluid conduit has an end to end electrical resistance of between 0.1 to 100 MΩ.

公开(公告)号：US11569114B2

公开(公告)日：2023-01-31

申请号：US17174591

申请日：2021-02-12

申请人： Applied Materials, Inc.

发明人： Yogananda Sarode Vishwanath ,  Steven E. Babayan ,  Andreas Schmid ,  Stephen Donald Prouty ,  Andrew Antoine Noujaim

IPC分类号： B29C65/00 ,  H01L21/683 ,  H05K7/20 ,  B29C65/56 ,  B29C65/02 ,  B29C65/48

摘要： Embodiments described herein relate to a substrate support assembly. The substrate support assembly includes an ESC base assembly having a base channel disposed therein, a facility plate, the facility plate coupled to the ESC base assembly with a vacuum region therebetween, and a seal assembly. The seal assembly includes an upper flange coupled to the base channel of the ESC base assembly, the upper flange disposed in the facility plate, a lower flange coupled to the upper flange, the lower flange disposed in the facility plate, a gasket disposed between the upper flange and the lower flange, and an insulator tube coupled to the lower flange. A passage is connected to the base channel, the passage is defined by connected openings of the upper flange, the gasket, the lower flange, the insulator tube, and the base assembly.

公开(公告)号：US11764041B2

公开(公告)日：2023-09-19

申请号：US16901797

申请日：2020-06-15

申请人： Applied Materials, Inc.

发明人： Alvaro Garcia De Gorordo ,  Daniel Sang Byun ,  Andreas Schmid ,  Stephen Donald Prouty ,  Andrew Antoine Noujaim

IPC分类号： H01J37/32 ,  H01L21/683 ,  C23C16/46 ,  C23C16/458

CPC分类号： H01J37/32724 ,  C23C16/4581 ,  C23C16/466 ,  H01J37/321 ,  H01L21/6833 ,  H01J2237/002 ,  H01J2237/3341

摘要： Embodiments described herein relate to a substrate support assembly which enables adjustment of the thermal conductivity therein. The substrate support assembly has heater and cooling channel. An adjustable thermal break disposed between the heater and the cooling channel. The adjustable thermal break has one or more fluid conduits coupled thereto and configured to flow a fluid into and out of the adjustable thermal break for variant the thermal conductivity between the heater and the cooling channel.

公开(公告)号：US11437261B2

公开(公告)日：2022-09-06

申请号：US16217036

申请日：2018-12-11

申请人： Applied Materials, Inc.

发明人： Yogananda Sarode Vishwanath ,  Steven E. Babayan ,  Stephen Donald Prouty ,  Álvaro García De Gorordo ,  Andreas Schmid ,  Andrew Antoine Noujaim

IPC分类号： H05B3/68 ,  H01L21/683 ,  H01L21/67

摘要： Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a refrigerant channel disposed therein, and a facility plate having a coolant channel disposed therein. The facility plate includes a plate portion and a flange portion. The plate portion is coupled to the ESC base assembly and the flange portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the flange portion of the facility plate, and the seal assembly.