摘要:
A method for manufacturing a surface acoustic wave element having an interdigital transducer (IDT) electrode formed on a semiconductor substrate includes a) forming an insulation layer on a surface of an active side of the semiconductor substrate, b) forming a base layer on a whole surface of the insulation layer, c) planarizing a surface of the base layer, d) forming a piezoelectric member on a planarized surface of the base layer, e) forming the IDT electrode on a surface of the piezoelectric member, and f) forming a bank being higher than a height from the surface of the base layer to the surface of the IDT electrode on a peripheral of the surface of the base layer so as to surround the piezoelectric member.
摘要:
An oscillator includes: a substrate; a reference oscillation circuit including a first MEMS oscillator disposed above the substrate, the reference oscillation circuit outputting a first oscillation signal; at least one voltage-controlled oscillation circuit including a second MEMS oscillator disposed above the substrate, the oscillation frequency of the at least one voltage-controlled oscillation circuit being controlled based on a control signal, the at least one voltage-controlled oscillation circuit outputting a second oscillation signal; a frequency division circuit dividing the frequency of the second oscillation signal and outputting a frequency division signal; and a phase-comparison circuit outputting the control signal based on a phase difference between the frequency division signal and the first oscillation signal, wherein the first MEMS oscillator and the second MEMS oscillator each have a first electrode and a second electrode, the second electrode has a movable part disposed so as to face the first electrode.
摘要:
A surface acoustic wave oscillator includes: a cross-coupled circuit including first and second active elements differentially connected to first and second output terminals; first and second surface acoustic wave elements having different resonance frequencies and connected to the cross-coupled circuit in parallel; a first variable capacitance circuit including a first variable capacitance element and changing the resonance frequency of the first surface acoustic wave element; and a second variable capacitance circuit including a second variable capacitance element and changing the resonance frequency of the second surface acoustic wave element, wherein the first surface acoustic wave element is connected to the first variable capacitance circuit, the second surface acoustic wave element is connected to the second variable capacitance circuit, and oscillating outputs from combining outputs of the first and second surface acoustic wave elements are outputted by the cross-coupled circuit.
摘要:
An oscillation circuit includes a plurality of MEMS vibrators each having a first terminal and a second terminal, and having respective resonant frequencies different from each other, an amplifier circuit (an inverting amplifier circuit) having an input terminal and an output terminal, and a connection circuit adapted to connect the first terminal of one of the MEMS vibrators and the input terminal to each other, and the second terminal of the MEMS vibrator and the output terminal to each other to thereby connect the one of the MEMS vibrators and the amplifier circuit (the inverting amplifier circuit) to each other.
摘要:
An oscillation circuit includes a cross-coupled circuit having a first active element and a second active element which are differentially connected to each other. The oscillation circuit oscillates in a resonance frequency of a resonator connected between the first active element and the second active element.