CO-INTEGRATION OF MULTI-GATE FET WITH OTHER FET DEVICES IN CMOS TECHNOLOGY
    1.
    发明申请
    CO-INTEGRATION OF MULTI-GATE FET WITH OTHER FET DEVICES IN CMOS TECHNOLOGY 审中-公开
    CMOS技术中多栅极FET与其他FET器件的集成

    公开(公告)号:US20090289304A1

    公开(公告)日:2009-11-26

    申请号:US12296402

    申请日:2007-03-30

    摘要: The present invention relates to a CMOS circuit device on a SOI substrate with an oriented silicon surface, comprising on a first substrate region a FET that has a FET channel region of a first conductivity type, and comprising on a second substrate region a FinFET that has a FinFET channel region of a second conductivity type which is opposite to the first conductivity type. The invention also relates to a method for fabricating such a CMOS circuit device. The fabrication of the multi-gate planar FET comprises, at an intermediate step, forming a FET channel stack with an alternating sequence of layers of a FET material and of a sacrificial material and containing main FET-channel faces, which have the same orientation as the oriented silicon surface. According to the invention, a co-integration of multi-gate FET devices is achieved that ensures high carrier mobilities for both NMOS and PMOS FETs.

    摘要翻译: 本发明涉及具有取向硅表面的SOI衬底上的CMOS电路器件,在第一衬底区域上包括具有第一导电类型的FET沟道区的FET,并且在第二衬底区域上包括具有 与第一导电类型相反的第二导电类型的FinFET沟道区。 本发明还涉及制造这种CMOS电路器件的方法。 多栅平面FET的制造包括在中间步骤中,形成具有FET材料和牺牲材料的层的交替序列并且包含主FET沟道面的FET沟道堆叠,其具有与 定向硅表面。 根据本发明,实现了多栅极FET器件的共同集成,确保了NMOS和PMOS FET的高载流子迁移率。