Work holder for masking
    1.
    发明授权
    Work holder for masking 失效
    掩蔽工作台

    公开(公告)号:US4920915A

    公开(公告)日:1990-05-01

    申请号:US361500

    申请日:1989-06-05

    IPC分类号: C23C14/04 C23C14/50

    CPC分类号: C23C14/50 C23C14/042

    摘要: A work holder (12) for holding a workpiece (2) while partially masking the same by use of a mask (18). The workpiece and the mask are elastically pressed against each other by an aggregate (15) of heat-resistant fiber such as metal fiber or ceramic fiber, so that the workpiece and the mask are brought into close contact with each other. This work holder is adapted to form a resistor film (9) on a part of the surface of a chip (2) to form a chip-type resistor (1), for example, by a thin film forming method such as sputtering.

    摘要翻译: 一种用于通过使用掩模(18)对工件(2)进行部分掩蔽的工件(2)的工件保持器(12)。 工件和面罩通过诸如金属纤维或陶瓷纤维的耐热纤维的骨料(15)彼此弹性地压靠,使得工件和面罩彼此紧密接触。 该工件保持器适于在芯片(2)的表面的一部分上形成电阻膜(9),以例如通过诸如溅射的薄膜形成方法形成芯片型电阻器(1)。

    Thin-film resistor
    2.
    发明授权
    Thin-film resistor 失效
    薄膜电阻

    公开(公告)号:US4737757A

    公开(公告)日:1988-04-12

    申请号:US872950

    申请日:1986-06-11

    IPC分类号: H01C1/142 H01C7/00 H01C1/012

    CPC分类号: H01C7/006 H01C1/142

    摘要: A thin-film resistor comprising a thin film of a nitride of at least one element belonging to groups III-VI of the periodic table. The thin-film resistor has a metal oxide layer comprising at least one metal oxide selected from the group consisting of manganese oxide, iron oxide, cobalt oxide, nickel oxide, zinc oxide, indium oxide, tin oxide and indium tin oxide interposed between the nitride thin film and an electrode for external connection.

    摘要翻译: 一种薄膜电阻器,其包括属于周期表第III-VI族的至少一种元素的氮化物的薄膜。 所述薄膜电阻器具有金属氧化物层,所述金属氧化物层包含选自氧化锰,氧化铁,氧化钴,氧化镍,氧化锌,氧化铟,氧化锡和铟锡氧化物中的至少一种金属氧化物,所述金属氧化物插入在所述氮化物 薄膜和用于外部连接的电极。

    Ceramic capacitor
    3.
    发明授权
    Ceramic capacitor 失效
    陶瓷电容器

    公开(公告)号:US4604676A

    公开(公告)日:1986-08-05

    申请号:US782217

    申请日:1985-09-30

    CPC分类号: H01G4/2325

    摘要: A monolithic ceramic capacitor comprises a dielectric ceramic element assembly, metal electrodes for external connection and conductive metal oxide layers formed between the ceramic element assembly and the metal electrodes for preventing reduction of metal oxide forming the dielectric ceramic material.

    摘要翻译: 单片陶瓷电容器包括介电陶瓷元件组件,用于外部连接的金属电极和形成在陶瓷元件组件和金属电极之间的导电金属氧化物层,用于防止形成电介质陶瓷材料的金属氧化物的还原。

    Electroless bismuth plating bath
    5.
    发明授权
    Electroless bismuth plating bath 失效
    无电镀铋电镀浴

    公开(公告)号:US5306335A

    公开(公告)日:1994-04-26

    申请号:US13701

    申请日:1993-02-04

    IPC分类号: C23C18/31 C23C18/52 C23C18/16

    CPC分类号: C23C18/52

    摘要: In an electroless plating bath containing bismuth trichloride, a reducing agent and complexing agents, stannous chloride is employed as the reducing agent to enable electroless plating of bismuth, which has generally been regarded as impossible. A preferable composition of the plating bath is 0.08M of bismuth trichloride, 0.34M of sodium citrate, 0.08M of EDTA, 0.20M of nitrilotriacetic acid, and 0.04M of stannous chloride. In plating treatment, the plating bath preferably has a temperature of 60.degree. C. and a pH value of 8.6 to 8.8.

    摘要翻译: 在含有三氯化铋,还原剂和络合剂的化学镀浴中,使用氯化亚锡作为还原剂,以使得通常被认为是不可能的铋化学镀。 镀浴的优选组成为0.08M三氯化铋,0.34M柠檬酸钠,0.08M EDTA,0.20M次氮基三乙酸和0.04M氯化亚锡。 在电镀处理中,电镀浴的温度优选为60℃,pH值为8.6〜8.8。

    Electroless plating bath
    7.
    发明授权
    Electroless plating bath 失效
    化学镀浴

    公开(公告)号:US5160373A

    公开(公告)日:1992-11-03

    申请号:US713782

    申请日:1991-06-12

    IPC分类号: C23C18/31 C23C18/34 C23C18/52

    CPC分类号: C23C18/52

    摘要: An electroless plating bath for depositing a metal selected from the group consisting of Ni, Zn, As, Cd, In, Sb, Pb and alloys thereof, which contains a titanium (III) compound as a reducing agent. Typical titanium (III) compounds are titanium halides, cyclopentadienyl complex compounds of titanium (III) ions, titanium sulfate, and titanium hydroxide.

    摘要翻译: 一种用于沉积选自Ni,Zn,As,Cd,In,Sb,Pb的金属和含有钛(III)化合物作为还原剂的合金的化学镀浴。 典型的钛(III)化合物是钛卤化物,钛(III)离子的环戊二烯基络合物化合物,硫酸钛和氢氧化钛。

    Method of forming copper conductor
    8.
    发明授权
    Method of forming copper conductor 失效
    形成铜导体的方法

    公开(公告)号:US4328048A

    公开(公告)日:1982-05-04

    申请号:US194980

    申请日:1980-10-08

    摘要: A structure of a copper conductor is obtained by oxidizing copper film formed on the surface of a substrate, and by heat treating the same in a reducing atmosphere, whereby only the surface layer portion of the oxidized copper film is reduced to become copper. The copper film of a conductor is formed on the surface of the substrate with the oxidized copper film interposed therebetween. As a result, an adhesion of the copper film to the surface of the substrate is enhanced.

    摘要翻译: 铜导体的结构是通过氧化形成在基板表面上的铜膜,并通过在还原气氛中进行热处理而得到的,从而只有氧化的铜膜的表层部分被还原为铜。 导电体的铜膜形成在基板的表面上,氧化的铜膜插入其间。 结果,增强了铜膜对基板表面的粘合性。

    Method of producing fine powders
    9.
    发明授权
    Method of producing fine powders 失效
    生产细粉的方法

    公开(公告)号:US5435830A

    公开(公告)日:1995-07-25

    申请号:US257268

    申请日:1994-06-09

    IPC分类号: B22F9/24

    CPC分类号: B22F9/24

    摘要: First, an aqueous solution of water soluble compounds or an aqueous solution of water soluble complexes, which is a salt of elements belonging to the 6A, 7A, 1B, 2B, 3B, 4B, 5B, 6B, or 8 group in a periodic table are prepared. The pH of the aqueous solution is adjusted and titanium trichloride is added thereto. The aqueous solution provided with titanium trichloride is stirred at temperature below the boiling point of the solution under atmospheric pressure or under high pressure. Then, by the reducing action of the titanium trichloride, a fine titanium-free powder selected from the group consisting of a metal powder, an alloy powder containing two or more of metals and non-metals, or a compound powder containing two or more of metals and non-metals is obtained.

    摘要翻译: 首先,作为元素周期表中属于6A,7A,1B,2B,3B,4B,5B,6B或8族的元素的盐的水溶性化合物的水溶液或水溶性络合物的水溶液 准备好了 调节水溶液的pH,并向其中加入三氯化钛。 提供三氯化钛的水溶液在大气压或高压下在低于溶液沸点的温度下搅拌。 然后,通过三氯化钛的还原作用,可以使用选自金属粉末,含有两种以上金属和非金属的合金粉末的微细的无钛粉末,或者含有两种以上的金属和非金属的化合物粉末 获得金属和非金属。

    Method for processing solution including heavy metal
    10.
    发明授权
    Method for processing solution including heavy metal 失效
    包括重金属在内的处理方法

    公开(公告)号:US4362629A

    公开(公告)日:1982-12-07

    申请号:US194981

    申请日:1980-10-08

    IPC分类号: C02F1/36 C02F9/00 C02F1/62

    摘要: A method for processing a waste solution used in a chemical plating process and including a heavy metal complex salt, a reducing agent, and a pH adjusting agent. The heavy metal complex salt is decomposed into a heavy metal component and a complexing agent component by applying ultrasonic vibration to the waste solution. The heavy metal component obtained by decomposition is in a powder state. Then the waste solution is filtered, so that the heavy metal component may be separated from the complexing agent component.

    摘要翻译: 一种用于处理化学镀处理中使用的废溶液的方法,包括重金属络合盐,还原剂和pH调节剂。 重金属络合盐通过对废溶液施加超声波振动而分解成重金属组分和络合剂组分。 通过分解获得的重金属组分处于粉末状态。 然后将废溶液过滤,使得重金属组分可以与络合剂组分分离。