Method and prober for contacting a contact area with a contact tip
    1.
    发明申请
    Method and prober for contacting a contact area with a contact tip 有权
    用于将接触区域与接触尖端接触的方法和探测器

    公开(公告)号:US20050007135A1

    公开(公告)日:2005-01-13

    申请号:US10879622

    申请日:2004-06-29

    IPC分类号: G01R31/28 G01R31/02

    CPC分类号: G01R31/2886

    摘要: A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.

    摘要翻译: 接触区域与探针中的接触针尖(接触尖端)接触的方法以及这种探测器的布置的方法基于确保可靠接触和直接观察触点之间的接触的建立的目的 接触小尺寸接触垫时的接触面和接触面积。 探测器基本上包括具有移动装置的基架,该移动装置包括用于接收半导体晶片的夹持夹具以及与半导体晶片的自由表面相对布置的接触针。 接触尖端的接触最初需要半导体晶片的水平定位,使得接触面和接触尖端彼此之间并且彼此间隔一定距离,随后沿接触尖端的方向垂直移动, 直到接触尖端与接触区域的接触被建立。 该目的是通过半导体晶片的垂直移动直到达到最终位置在水平观察方向上直接观察为目的,为此目的,观察装置以这样的方式布置,使得观察轴以间隔 在自由晶片表面上方。

    Method and prober for contacting a contact area with a contact tip
    2.
    发明授权
    Method and prober for contacting a contact area with a contact tip 有权
    用于将接触区域与接触尖端接触的方法和探测器

    公开(公告)号:US07057408B2

    公开(公告)日:2006-06-06

    申请号:US10879622

    申请日:2004-06-29

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2886

    摘要: A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.

    摘要翻译: 接触区域与探针中的接触针尖(接触尖端)接触的方法以及这种探测器的布置的方法基于确保可靠接触和直接观察触点之间的接触的建立的目的 接触小尺寸接触垫时的接触面和接触面积。 探测器基本上包括具有移动装置的基架,该移动装置包括用于接收半导体晶片的夹持夹具以及与半导体晶片的自由表面相对布置的接触针。 接触尖端的接触最初需要半导体晶片的水平定位,使得接触面和接触尖端彼此之间并且彼此间隔一定距离,随后沿接触尖端的方向垂直移动, 直到接触尖端与接触区域的接触被建立。 该目的是通过半导体晶片的垂直移动直到达到最终位置在水平观察方向上直接观察为目的,为此目的,观察装置以这样的方式布置,使得观察轴以间隔 在自由晶片表面上方。

    Test apparatus with loading device
    3.
    发明授权
    Test apparatus with loading device 有权
    带装载装置的试验装置

    公开(公告)号:US07038441B2

    公开(公告)日:2006-05-02

    申请号:US10677524

    申请日:2003-10-02

    IPC分类号: G01R31/02

    摘要: The invention, which relates to a test apparatus with loading device which has a chuck, which is provided with a bearing surface for a test substrate and with a chuck drive, by means of which the chuck can be displaced with a working area, and which has a receiving means for receiving test substrates, which can be displaced from a working area of the chuck to a receiving position outside the working area, is based on the object of increasing the accuracy of the movement of the chuck. Moreover, in the case of test apparatus with a controlled atmosphere, a further object is to prevent the chuck from being exposed to the open-air atmosphere. This is achieved by virtue of the fact that a carriage, which can be displaced between a position close to the chuck, in which the chuck is located in a position inside the working area, and the receiving position, is provided, which carriage is provided with a holder, in which the test substrate can be at least indirectly inserted in such a way that the test substrate, when the carriage is in the position close to the chuck, is located above the chuck. The holder and the chuck can move vertically relative to one another when the carriage is in the position close to the chuck.

    摘要翻译: 本发明涉及具有卡盘的装载装置的测试装置,其具有用于测试基板的轴承表面和卡盘驱动装置,通过该卡盘驱动器卡盘可以移动工作区域,并且其中 具有用于接收可以从卡盘的工作区域移动到工作区域外部的接收位置的测试基板的接收装置,其基础是提高卡盘的运动精度的目的。 此外,在具有受控气氛的测试装置的情况下,另一个目的是防止卡盘暴露于露天气氛。 这是通过以下事实来实现的:提供了可以在卡盘位于工作区域内的位置的接近卡盘的位置之间移动的托架和接收位置,该托架被设置 具有保持器,其中测试基板可以至少间接地插入,使得当托架处于靠近卡盘的位置时,测试基板位于卡盘上方。 当托架位于靠近卡盘的位置时,托架和夹头可以相对于彼此垂直移动。

    Test apparatus for testing substrates at low temperatures
    4.
    发明授权
    Test apparatus for testing substrates at low temperatures 有权
    用于在低温下测试基板的测试装置

    公开(公告)号:US07046025B2

    公开(公告)日:2006-05-16

    申请号:US10677178

    申请日:2003-10-02

    IPC分类号: G01R31/02

    摘要: A test apparatuss for testing substrates at low temperatures has a chuck, which can be displaced in the working area by means of a chuck drive, the temperature of which can be controlled using heating and cooling means. The chuck has a receiving surface for receiving a test substrate and holding means for fixing a substrate carrier which receives the test substrate. Spatially and thermally defined test conditions are maintained with minimal energy and labor costs both at room temperatures and at low temperatures. This is achieved by providing a vacuum chamber which surrounds the working area of the chuck. The chuck is on one side thermally decoupled from the uncooled chuck drive and on the other side is thermally connected in a releasable manner to the test substrate. The cooled chuck and the cooled test substrate are shielded from the thermal radiation of the surrounding uncooled assemblies by means of a directly cooled thermal radiation shield.

    摘要翻译: 用于在低温下测试基板的测试装置具有卡盘,该卡盘可以通过卡盘驱动器在工作区域中移动,卡盘驱动器的温度可以使用加热和冷却装置来控制。 卡盘具有用于接收测试基板的接收表面和用于固定接收测试基板的基板载体的保持装置。 空间和热定义的测试条件在室温和低温下以最小的能量和劳动成本维持。 这通过提供围绕卡盘的工作区域的真空室来实现。 卡盘在一侧与非冷却的卡盘驱动器热分离,另一侧以可释放的方式热连接到测试基板。 通过直接冷却的热辐射屏蔽将冷却的卡盘和冷却的测试基板与周围的未冷却组件的热辐射隔离。

    Method for increasing the accuracy of the positioning of a first object relative to a second object
    5.
    发明授权
    Method for increasing the accuracy of the positioning of a first object relative to a second object 有权
    提高第一物体相对于第二物体的定位精度的方法

    公开(公告)号:US08094925B2

    公开(公告)日:2012-01-10

    申请号:US12619327

    申请日:2009-11-16

    IPC分类号: G06K9/00 G06K9/32

    CPC分类号: G06T7/74 G06T2207/30148

    摘要: A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method. The relative displacement determined at the second instant is used to correct the positioning of the first and second objects as necessary to maintain a desired position of the two objects.

    摘要翻译: 提供了一种用于增加第一物体相对于第二物体的定位精度的方法。 该方法克服了在将第一物体定位在第二物体上时第一和第二物体之间的热漂移的不利影响。 该方法在例如制造半导体部件的制造中得到应用。 该方法利用具有最小结构宽度的第二物体上的结构的识别。 在第一时刻,使用一个识别过程,第一个物体位于第二个物体上所需的位置上。 两个对象的相对位移在第一时刻和至少一个后续时刻确定。 为此目的可以使用第二识别程序。 第二识别程序可以具有与第一解析过程的分辨率精度不同的分辨率精度。 第二识别程序可以是模式识别方法。 在第二时刻确定的相对位移用于根据需要校正第一和第二物体的定位,以保持两个物体的期望位置。

    Arrangement and method for testing substrates under load
    7.
    发明申请
    Arrangement and method for testing substrates under load 审中-公开
    在负载下测试基板的布置和方法

    公开(公告)号:US20050083037A1

    公开(公告)日:2005-04-21

    申请号:US10928985

    申请日:2004-08-27

    CPC分类号: H01L21/67207 H01L21/67253

    摘要: Arrangement and method for testing a substrate under load with a prober are provided, by which the full productivity of the prober can be exploited. The arrangement includes a chuck, a chuck driver, control electronics, probe or probe card holding means, and has a loading means for applying a thermal, mechanical, electrical or other physical or chemical loading to the substrate. The substrate is subjected to a loading and then its properties are measured by means of the prober. The loading means is arranged as a separate subassembly separated from the prober and therein is connected to the latter via a handling system. The method provides for the substrate to be brought into operative connection with a loading means, subjected to the loading in this loading means, then removed from the loading means and tested in terms of its functions.

    摘要翻译: 该装置具有仅在测试期间通过处理系统(3)连接到探测器(1)的温度控制站(2)。 温度控制站向半导体晶片施加热,机械,电气,物理或其他化学载荷,然后通过处理系统将晶片转移到探测器进行进一步测试。 在负载下测试半导体晶片的方法也包括独立权利要求。

    Apparatus for testing substrates
    8.
    发明申请
    Apparatus for testing substrates 有权
    用于测试基板的装置

    公开(公告)号:US20050083036A1

    公开(公告)日:2005-04-21

    申请号:US10928975

    申请日:2004-08-27

    CPC分类号: H01L21/6719 H01L21/67173

    摘要: An apparatus for testing substrates reduces the area required and the costs which arise with the testing of substrates, in particular semiconductor wafers, during the production process. The apparatus includes testing arrangements comprising a chuck, a chuck drive, control electronics, probe or probe board holding means with a handling system, a substrate magazine station and an alignment station. The testing arrangements include at least two testing arrangements, both of which are all jointly operatively connected to the handling system, the substrate magazine station and the alignment station.

    摘要翻译: 用于测试衬底的装置减少了在制造过程中通过测试衬底,特别是半导体晶片所需的面积和成本。 该装置包括测试装置,其包括卡盘,卡盘驱动器,控制电子装置,具有处理系统的探针板或探针板保持装置,基板杂志站和对准站。 测试装置包括至少两个测试装置,这两个测试装置都共同操作地连接到处理系统,基板仓库站和对准站。

    Apparatus for testing substrates
    9.
    发明授权
    Apparatus for testing substrates 有权
    用于测试基板的装置

    公开(公告)号:US07196507B2

    公开(公告)日:2007-03-27

    申请号:US10928975

    申请日:2004-08-27

    IPC分类号: G01R31/28

    CPC分类号: H01L21/6719 H01L21/67173

    摘要: An apparatus for testing substrates reduces the area required and the costs which arise with the testing of substrates, in particular semiconductor wafers, during the production process. The apparatus includes testing arrangements comprising a chuck, a chuck drive, control electronics, probe or probe board holding means with a handling system, a substrate magazine station and an alignment station. The testing arrangements include at least two testing arrangements, both of which are all jointly operatively connected to the handling system, the substrate magazine station and the alignment station.

    摘要翻译: 用于测试衬底的装置减少了在制造过程中通过测试衬底,特别是半导体晶片所需的面积和成本。 该装置包括测试装置,其包括卡盘,卡盘驱动器,控制电子装置,具有处理系统的探针板或探针板保持装置,基板杂志站和对准站。 测试装置包括至少两个测试装置,这两个测试装置都共同操作地连接到处理系统,基板仓库站和对准站。

    Method For Increasing The Accuracy Of The Positioning Of A First Object Relative To A Second Object
    10.
    发明申请
    Method For Increasing The Accuracy Of The Positioning Of A First Object Relative To A Second Object 审中-公开
    提高第一个对象相对于第二个对象的定位精度的方法

    公开(公告)号:US20080298671A1

    公开(公告)日:2008-12-04

    申请号:US12170848

    申请日:2008-07-10

    IPC分类号: G06K9/00

    CPC分类号: G06T7/74 G06T2207/30148

    摘要: A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method. The relative displacement determined at the second instant is used to correct the positioning of the first and second objects as necessary to maintain a desired position of the two objects.

    摘要翻译: 提供了一种用于增加第一物体相对于第二物体的定位精度的方法。 该方法克服了在将第一物体定位在第二物体上时第一和第二物体之间的热漂移的不利影响。 该方法在例如制造半导体部件的制造中得到应用。 该方法利用具有最小结构宽度的第二物体上的结构的识别。 在第一时刻,使用一个识别过程,第一个物体位于第二个物体上所需的位置上。 两个对象的相对位移在第一时刻和至少一个后续时刻确定。 为此目的可以使用第二识别程序。 第二识别程序可以具有与第一解析过程的分辨率精度不同的分辨率精度。 第二识别程序可以是模式识别方法。 在第二时刻确定的相对位移用于根据需要校正第一和第二物体的定位,以保持两个物体的期望位置。