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公开(公告)号:US20230374195A1
公开(公告)日:2023-11-23
申请号:US18031396
申请日:2021-10-12
申请人: BASF SE
发明人: Thomas Schaub , Paul Neumann , Mona Al Batal , A. Stephen K. Hashmi , Wei Zhou , Andreas Thomas Haedler , Markus Schuette , Viktoriia Zubar
CPC分类号: C08G18/82 , C08J11/28 , B01J31/189 , B01J31/20 , C08J2375/04 , B01J2531/821 , B01J2231/641
摘要: Spent polyurethanes are returned to the value chain by hydrogenating the spent polyurethanes in a hydrogen atmosphere in the presence of at least one homogeneous transition metal catalyst complex, wherein the transition metal is selected from metals of groups 7, 8, 9 and 10 of the periodic table of elements according to IUPAC, to obtain a polyamine and a polyol. The hydrogenation is carried out at a reaction temperature of at least 120° C. in a non-reducible solvent having a dipole moment of 10-1030 C·m or less.
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2.
公开(公告)号:US12030991B2
公开(公告)日:2024-07-09
申请号:US16331415
申请日:2017-09-05
申请人: BASF SE
IPC分类号: C08G69/26 , B29C48/08 , B32B27/08 , B32B27/34 , C08G69/14 , C08G69/28 , C08G69/34 , C08G69/36 , C08J5/18 , C08L77/06 , B29C48/00 , B29K77/00
CPC分类号: C08G69/265 , B32B27/08 , B32B27/34 , C08G69/14 , C08G69/26 , C08G69/28 , C08G69/34 , C08G69/36 , C08J5/18 , B29C48/022 , B29C48/08 , B29K2077/00 , C08J2377/06
摘要: The present invention relates to a polymer film (P) contacting at least one copolyamide. The copolyamide is prepared by polymerizing a first monomer mixture (M1), containing at least one C4-C12 dicarboxylic acid and at least one C4-C12 diamine, and a second monomer mixture (M2) containing at least one C32-C40 dimer acid and at least one C4-C12 diamine. The present invention further relates to a process for producing the polymer film (P) and to the use of the polymer film (P) for high-temperature applications.
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公开(公告)号:US20220315738A1
公开(公告)日:2022-10-06
申请号:US17640198
申请日:2020-09-03
申请人: BASF SE
发明人: Tina Elisabeth Weller , Andreas Thomas Haedler , Peter Eibeck , Jens Cremer , Rebecca Sure , Peter Deglmann , Erik Gubbels , Martina Schoemer
IPC分类号: C08K5/3417 , C08K7/14
摘要: Described herein is a thermoplastic molding composition, including A) from 10 to 99.99% by weight of a thermoplastic polymer, B) from 0.01 to 20% by weight of at least one carbazole compound selected from substituted and unsubstituted carbazole and organic compounds containing at least one chemically bonded substituted or unsubstituted carbazole residue, and C) from 0 to 70% by weight of further additives, where the total of the percentages by weight of components A) to C) is 100% by weight.
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