公开(公告)号：US20200157699A1

公开(公告)日：2020-05-21

申请号：US16616353

申请日：2018-05-17

Applicant: BASF SE

Inventor： Sebastian Wagner ,  Simon Kniesel ,  Wen LU ,  Tobias Urban ,  Frank Richter

IPC: C25D5/56 ,  C23C18/24 ,  C23C18/16 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C08L77/00 ,  C08L39/06 ,  C08L31/04 ,  C08K3/013

Abstract: An article including a polymer body and a metal plating is provided. In this article, the metal plating is attached to the polymer body and the polymer body includes as components at least one polyamide (A), at least one filler (B), at least one poly-N-vinyllactam polymer (C) and, optionally, at least one additive (D). Also provided is the process for producing this article and the use of this article e.g. as a door handle in automotive applications. Further provided is the use of the polymer body for producing metal-plated articles.

公开(公告)号：US10822703B2

公开(公告)日：2020-11-03

申请号：US15748278

申请日：2016-07-21

Applicant: BASF SE

Inventor： Axel Kirste ,  Tobias Urban ,  Fabio Nicolini ,  Simone Lutter ,  Frank Richter ,  Andre Cezanne

IPC: C23C28/02 ,  C23C18/20 ,  C23C18/26 ,  C25D5/56 ,  C08J7/06 ,  C23C18/30 ,  C08J7/12 ,  C23C18/16 ,  C23C18/34 ,  C23C18/40 ,  C25D3/04 ,  C25D3/12 ,  C25D3/38 ,  C25D5/54

Abstract: The invention relates to a process for coating plastics or plastic surfaces with metals, especially plastics composed of acrylonitrile/butadiene/styrene copolymers (ABS) and composed of mixtures of these copolymers with other plastics (e.g. ABS blends), wherein the process comprises the pretreatment of the plastic surfaces with a composition C (etch solution) comprising at least two different ionic liquids IL1 and IL2.

公开(公告)号：US12071700B2

公开(公告)日：2024-08-27

申请号：US17909030

申请日：2021-03-03

Applicant: BASF SE

Inventor： Tobias Urban ,  Paul Klingelhoefer ,  Sophie Maitro-Vogel ,  Yvonne Schriefers ,  Frank Richter ,  Manfred Bichler

IPC: C25D3/02 ,  C25D3/38 ,  C25D5/00 ,  C25D21/12

CPC classification number: C25D21/12 ,  C25D3/38

Abstract: The present invention relates to a process for depositing a metal layer on a substrate by contacting the substrate with a metal plating bath comprising a metal ion source and a suppressor, and applying a current density to the substrate, where the suppressor is a polycarboxylate ether as described below. The invention further relates to a metal plating bath comprising a metal ion source and the suppressor which is a polycarboxylate ether; and to a use of the polycarboxylate ether in a metal plating bath for depositing a metal layer on a substrate.