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公开(公告)号：US20130093069A1
公开(公告)日：2013-04-18
申请号：US13273247
申请日：2011-10-14
申请人： BAU-RU LU , JENG-JEN LI , CHIANG KAIPENG
发明人： BAU-RU LU , JENG-JEN LI , CHIANG KAIPENG
IPC分类号： H01L23/495 , H01L21/768
CPC分类号： H01L23/49861 , H01L23/13 , H01L23/49524 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L24/83 , H01L25/16 , H01L2224/2919 , H01L2224/29339 , H01L2224/32257 , H01L2224/45144 , H01L2224/48245 , H01L2224/48247 , H01L2224/83192 , H01L2224/83411 , H01L2224/83439 , H01L2224/83447 , H01L2224/83851 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： The invention discloses a package structure made of the combination of a metallic substrate and a lead frame. In one embodiment, a recess is formed in the metallic substrate and a first conductive element having at least one first I/O terminal is bonded in the recess. A lead frame is formed on the metallic substrate and comprises a plurality of electrical connections to connect with said at least one first I/O terminal of the first conductive element. In another embodiment, another conductive element is disposed in the vacancy of the lead frame. The invention also discloses a method for manufacturing a package structure made of the combination of a metallic substrate and a lead frame.
摘要翻译： 本发明公开了一种由金属基底和引线框组合而成的封装结构。 在一个实施例中，在金属基板中形成凹部，并且具有至少一个第一I / O端子的第一导电元件接合在凹部中。 引线框架形成在金属基板上并且包括多个电连接以与第一导电元件的所述至少一个第一I / O端子连接。 在另一个实施例中，另一导电元件设置在引线框架的空位中。 本发明还公开了一种用于制造由金属基底和引线框的组合制成的封装结构的方法。
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公开(公告)号：US20140042610A1
公开(公告)日：2014-02-13
申请号：US13571378
申请日：2012-08-10
申请人： JENG-JEN LI , BAU-RU LU
发明人： JENG-JEN LI , BAU-RU LU
CPC分类号： H01L24/19 , H01L23/13 , H01L23/49816 , H01L23/5389 , H01L24/20 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/24101 , H01L2224/24155 , H01L2224/244 , H01L2224/2518 , H01L2924/12042 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/00
摘要： The invention discloses a package structure with at least one portion of a first conductive element disposed in a through-opening of a first substrate. A conductive structure is disposed on the first substrate and the first conductive element, wherein the conductive structure is electrically connected to the first substrate and said at least one first I/O terminal of the first conductive element. The conductive structure comprises at least one of a second conductive element, a second substrate or a conductive pattern.
摘要翻译： 本发明公开了一种封装结构，其具有设置在第一基板的通孔中的第一导电元件的至少一部分。 导电结构设置在第一基板和第一导电元件上，其中导电结构电连接到第一基板和第一导电元件的所述至少一个第一I / O端子。 导电结构包括第二导电元件，第二基板或导电图案中的至少一个。
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公开(公告)号：US20130213704A1
公开(公告)日：2013-08-22
申请号：US13401853
申请日：2012-02-22
申请人： BAU-RU LU , JENG-JEN LI , KUN-HONG SHIH , KAIPENG CHIANG
发明人： BAU-RU LU , JENG-JEN LI , KUN-HONG SHIH , KAIPENG CHIANG
CPC分类号： H01L23/49537 , H01L21/563 , H01L23/13 , H01L23/49506 , H01L23/49534 , H01L23/49548 , H01L23/49575 , H01L23/49827 , H01L23/49833 , H01L24/16 , H01L2224/16225 , H01L2924/13055 , H01L2924/13091 , H01L2924/15321 , H05K1/021 , H05K1/186 , Y10T29/49124 , H01L2924/00
摘要： The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.
摘要翻译： 本发明公开了一种由装置载体和可修改基底的组合制成的封装结构。 在一个实施例中，在器件载体中形成凹部，并且导电元件设置在衬底上，其中衬底设置在器件载体上，并且导电元件位于器件载体的凹部中。 衬底中的导电图案电连接到器件载体和第一导电元件的I / O端子。 本发明还公开了一种用于制造由器件载体和可修改基底的组合制成的封装结构的方法。 在一个实施例中，衬底中的导电图案的一部分可以被修改。
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