公开(公告)号：US11798919B2

公开(公告)日：2023-10-24

申请号：US16984511

申请日：2020-08-04

Applicant: BOE Technology Group Co., Ltd.

Inventor： Hsuanwei Mai ,  Zhanfeng Cao ,  Ke Wang ,  Haixu Li ,  Zhiwei Liang ,  Zhijun Lv

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L25/0753 ,  H01L33/0095

Abstract: Disclosed are a transfer carrier and a manufacturing method thereof, and a method for transferring a light-emitting diode chip. The transfer carrier includes: a substrate having a plurality of via holes penetrating a thickness of the substrate, the substrate having a first surface and second surface which are opposite to each other; and thermoplastic structures filling corresponding ones of the via holes, one end of the thermoplastic structures protruding from the second surface of the substrate, and the other end covering a surrounding area on the first surface, of the corresponding via holes.

公开(公告)号：US11600747B2

公开(公告)日：2023-03-07

申请号：US16959097

申请日：2019-08-16

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhiwei Liang ,  Yingwei Liu ,  Han Yue ,  Minghua Xuan ,  Hsuanwei Mai ,  Zhanfeng Cao ,  Ke Wang ,  Huijuan Wang ,  Guangcai Yuan ,  Zhijun Lv ,  Xinhong Lu

IPC: H01L33/38 ,  H01L27/15 ,  H01L33/00 ,  H01L33/62

Abstract: A display backplane includes a base, a plurality of driving electrodes disposed above the base, and a connection structure disposed on at least one of the plurality of driving electrodes. An orthographic projection of the connection structure on the base is within an orthographic projection of a corresponding driving electrode on the base; and the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode.

公开(公告)号：US11437265B2

公开(公告)日：2022-09-06

申请号：US16770655

申请日：2019-06-13

Applicant: BOE Technology Group Co., Ltd.

Inventor： Xue Dong ,  Guangcai Yuan ,  Zhijun Lv ,  Haixu Li ,  Zhiwei Liang ,  Huijuan Wang ,  Ke Wang ,  Zhanfeng Cao ,  Hsuanwei Mai

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/62

Abstract: The present disclosure discloses a mass transfer method and system for micro light emitting diodes, wherein the mass transfer method includes: providing a component substrate on which a plurality of micro light emitting diodes are formed; picking up the micro light emitting diodes on the component substrate at least once by a plurality of bonding structures on a first medium load substrate, and transferring micro light emitting diodes picked up every time to a second medium load substrate; and transferring the micro light emitting diodes on the second medium load substrate into corresponding sub-pixels on a target substrate at one time, wherein one of the micro light emitting diodes on the second medium load substrate corresponds to one of the sub-pixels on the target substrate.

公开(公告)号：US11764343B2

公开(公告)日：2023-09-19

申请号：US16982217

申请日：2019-12-19

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei Liang ,  Yingwei Liu ,  Zhijun Lv ,  Ke Wang ,  Zhanfeng Cao ,  Hsuanwei Mai ,  Guangcai Yuan ,  Muxin Di

IPC: H01L33/62 ,  H01L23/00 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/03 ,  H01L24/05 ,  H01L25/0753 ,  H01L2224/0219 ,  H01L2224/02166 ,  H01L2224/02185 ,  H01L2224/03013 ,  H01L2224/03462 ,  H01L2224/03614 ,  H01L2224/03622 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/0518 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2933/0066

Abstract: A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

公开(公告)号：US11244607B2

公开(公告)日：2022-02-08

申请号：US16850323

申请日：2020-04-16

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Han Yue ,  Hsuanwei Mai

IPC: G09G3/3225 ,  H02H9/04

Abstract: The present disclosure provides a protection circuit for protecting a light emitting element, a pixel unit including the protection circuit, a display panel, and a driving method of the protection circuit. The protection circuit for protecting the light emitting element includes: a bonding protection sub-circuit including a sacrificial metal region, configured to electrically couple the sacrificial metal region to an anode pad and a cathode pad on the backplane for bonding the light emitting element during a period of bonding the light emitting element to the backplane.