公开(公告)号：US20180061856A1

公开(公告)日：2018-03-01

申请号：US15538016

申请日：2016-05-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  KA IMAGING INC.

Inventor： Feng JIANG ,  Hui TIAN ,  Xiaolong ZHANG ,  Chia Chiang LIN

IPC: H01L27/12 ,  H01L21/027 ,  H01L21/311 ,  H01L27/144 ,  G02F1/1362 ,  H01L21/768 ,  H01L31/02 ,  G02F1/1368

CPC classification number: H01L27/124 ,  G02F1/136227 ,  G02F1/1368 ,  G02F2201/121 ,  G02F2201/123 ,  H01L21/0274 ,  H01L21/3105 ,  H01L21/31133 ,  H01L21/31144 ,  H01L21/768 ,  H01L21/76816 ,  H01L27/1248 ,  H01L27/1288 ,  H01L27/1443 ,  H01L31/02005 ,  H01L31/02019

Abstract: A hole structure and a fabrication method thereof, an array substrate and a fabrication method thereof, a detection device and a display device are provided. The fabrication method of the hole structure includes: performing a first photolithography process on a first initial thin film with a pattern region of a mask to form a first thin film and a first hole located therein, and performing a second photolithography process on a second initial thin film covering the first thin film with the pattern region of the mask to form a second thin film and a second hole running through the second thin film and communicating with the first hole; a dimension of a second opening of the second hole away from a base substrate is larger than a dimension of a first opening of the second hole close to the base substrate.