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公开(公告)号：US20220336706A1
公开(公告)日：2022-10-20
申请号：US17417493
申请日：2020-09-29
发明人： Junjie Ma , Haiwei Sun , Yuanda Lu , Shanwei Yang , Linxia Qi , Zhijun Xiong , Jiawei Zhao
IPC分类号： H01L33/38 , H01L33/62 , H01L25/075 , H01L33/00
摘要： A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.
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公开(公告)号：US20240322082A1
公开(公告)日：2024-09-26
申请号：US18733213
申请日：2024-06-04
发明人： Junjie Ma , Haiwei Sun , Yuanda Lu , Shanwei Yang , Linxia Qi , Zhijun Xiong , Jiawei Zhao
IPC分类号： H01L33/38 , H01L25/075 , H01L33/00 , H01L33/62
CPC分类号： H01L33/382 , H01L25/0753 , H01L33/005 , H01L33/62 , H01L2933/0016 , H01L2933/0066
摘要： A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.
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公开(公告)号：US20240339575A1
公开(公告)日：2024-10-10
申请号：US18293834
申请日：2022-11-30
发明人： Yuanda Lu , Junjie Ma , Yuanhao Sun , Jiawei Zhao , Zhijun Xiong , Xueqiao Li , Shanwei Yang , Yutian Chu , Linxia Qi
CPC分类号： H01L33/62 , H01L27/156 , H01L33/005 , H01L33/10 , H01L33/387
摘要： A light emitting diode chip, including at least two light emitting structures spaced apart and sequentially connected in series on a base substrate. At least one of the light emitting structures includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, a first insulation layer, a current spreading layer and a first electrode stacked in sequence. The at least one light emitting structure includes a first via hole in the first insulation layer, the first electrode is electrically connected to the current spreading layer, and the current spreading layer is electrically connected to the second semiconductor layer through the first via hole. An orthographic projection of the first via hole on the base substrate falls within that of the current spreading layer, and the orthographic projection of the current spreading layer on the base substrate falls within that of the second semiconductor layer.
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公开(公告)号：US12027648B2
公开(公告)日：2024-07-02
申请号：US17417493
申请日：2020-09-29
发明人： Junjie Ma , Haiwei Sun , Yuanda Lu , Shanwei Yang , Linxia Qi , Zhijun Xiong , Jiawei Zhao
IPC分类号： H01L33/38 , H01L25/075 , H01L33/00 , H01L33/62
CPC分类号： H01L33/382 , H01L25/0753 , H01L33/005 , H01L33/62 , H01L2933/0016 , H01L2933/0066
摘要： A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.
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公开(公告)号：US11131797B2
公开(公告)日：2021-09-28
申请号：US16834092
申请日：2020-03-30
发明人： Jinpeng Li , Ming Zhai , Pei Li , Zhiyuan Wang , Pengjun Cao , Jian Li , Teng Zhang , Zongying Shu , Yuanda Lu , Linxia Qi , Pei Qin
IPC分类号： F21V8/00 , F21V13/00 , F21Y115/10
摘要： Disclosed are a backlight module and a display device. The backlight module includes: a substrate and light emitting devices disposed on a side of the substrate, where each of the light emitting devices includes a light emitting diode, and a first connecting weld leg and a second connecting weld leg disposed between the light emitting diode and the substrate; the backlight module further includes a reflective layer between the substrate and the light emitting diodes; and for a same light emitting device, an orthographic projection of the reflective layer on the substrate and an area between orthographic projections of the first connecting weld leg and the second connecting weld leg on the substrate have an overlapping area.
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公开(公告)号：US20210116623A1
公开(公告)日：2021-04-22
申请号：US16834092
申请日：2020-03-30
发明人： Jinpeng Li , Ming Zhai , Pei Li , Zhiyuan Wang , Pengjun Cao , Jian Li , Teng Zhang , Zongying Shu , Yuanda LU , Linxia Qi , Pei Qin
摘要： Disclosed are a backlight module and a display device. The backlight module includes: a substrate and light emitting devices disposed on a side of the substrate, where each of the light emitting devices includes a light emitting diode, and a first connecting weld leg and a second connecting weld leg disposed between the light emitting diode and the substrate; the backlight module further includes a reflective layer between the substrate and the light emitting diodes; and for a same light emitting device, an orthographic projection of the reflective layer on the substrate and an area between orthographic projections of the first connecting weld leg and the second connecting weld leg on the substrate have an overlapping area.
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