THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE
    3.
    发明申请
    THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE 有权
    三维半导体存储器件

    公开(公告)号:US20130051146A1

    公开(公告)日:2013-02-28

    申请号:US13584847

    申请日:2012-08-14

    IPC分类号: G11C16/26 G11C16/04

    CPC分类号: H01L27/11582 G11C16/0483

    摘要: A three-dimensional (3D) semiconductor memory device comprises memory cell strings each comprising at least one selection transistor and at least one memory cell, a first pass transistor group sharing a first well region and comprising a first selection line pass transistor connected to the selection transistor and a first world line pass transistor connected to the memory cell, a second pass transistor group sharing a second well region and comprising a second selection line pass transistor connected to the selection transistor, and a controller that controls the first pass transistor group and the second pass transistor group. The controller applies selected voltages to the first and second well regions during read operation.

    摘要翻译: 三维(3D)半导体存储器件包括存储单元串,每个存储单元串包括至少一个选择晶体管和至少一个存储单元,共享第一阱区的第一级晶体管组,并且包括连接到选择的第一选择线传输晶体管 晶体管和连接到存储单元的第一世界线传输晶体管,第二传输晶体管组共享第二阱区并且包括连接到选择晶体管的第二选择线传输晶体管,以及控制器,其控制第一传输晶体管组和 二级晶体管组。 控制器在读取操作期间将选择的电压施加到第一和第二阱区。