公开(公告)号：US20070139060A1

公开(公告)日：2007-06-21

申请号：US11548183

申请日：2006-10-10

申请人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

发明人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

IPC分类号： G01R31/02

CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R31/2886

摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

公开(公告)号：US20080094088A1

公开(公告)日：2008-04-24

申请号：US11963575

申请日：2007-12-21

申请人： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

发明人： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

IPC分类号： G01R31/26

CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

公开(公告)号：US20060238211A1

公开(公告)日：2006-10-26

申请号：US11428423

申请日：2006-07-03

申请人： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

发明人： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

IPC分类号： G01R31/02

CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

公开(公告)号：US20060001440A1

公开(公告)日：2006-01-05

申请号：US11216579

申请日：2005-08-30

申请人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

发明人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

IPC分类号： G01R31/02

CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R31/2886

摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

公开(公告)号：US20080042668A1

公开(公告)日：2008-02-21

申请号：US11877466

申请日：2007-10-23

申请人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

发明人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

IPC分类号： G01R1/073

CPC分类号： G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

摘要翻译： 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

公开(公告)号：US20060255814A1

公开(公告)日：2006-11-16

申请号：US11306515

申请日：2005-12-30

申请人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

发明人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

IPC分类号： G01R31/02

CPC分类号： G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

摘要翻译： 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在布线基板附接到加强板的其他位置处设置空间，使得布线基板相对于加强板可以膨胀和收缩。

公开(公告)号：US20070229102A1

公开(公告)日：2007-10-04

申请号：US11761912

申请日：2007-06-12

申请人： Benjamin Eldridge ,  Barbara Vasquez ,  Makarand Shinde ,  Gaetan Mathieu ,  A. Sporck

发明人： Benjamin Eldridge ,  Barbara Vasquez ,  Makarand Shinde ,  Gaetan Mathieu ,  A. Sporck

IPC分类号： G01R31/02

CPC分类号： G01R31/2889 ,  G01R1/0416 ,  G01R1/07307

摘要： A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.

摘要翻译： 晶片测试组件包括多个探针头基底，其布置成瓦片，其中连接器连接到一侧，探针支撑在相对侧上。 在一个实施例中，柔性电缆连接器将探头头瓦片上的连接器直接连接到测试头，而在另一个实施例中，柔性电缆将探头头瓦片连接到PCB，从而向测试头连接器提供水平布线。 在一个实施例中，调平销提供连接到附接到瓦片的保持元件以提供施加推挽平整力的简化支撑结构。 测试头连接器接口框架能够重新布置测试头和探针卡之间的连接器，以提供完整的晶片接触或部分晶片接触。 测试头连接器通过在轨道上滑动来重新布置，或者可插拔和可拔出，使得能够在一定范围的位置上移动。

公开(公告)号：US20070126435A1

公开(公告)日：2007-06-07

申请号：US11164737

申请日：2005-12-02

申请人： Benjamin Eldridge ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum

发明人： Benjamin Eldridge ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum

IPC分类号： G01R31/02

CPC分类号： G01R31/2891 ,  G01R31/31905

摘要： Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an orientation of the probe card assembly can be adjusted with respect to the test apparatus, such as a structural part of the test apparatus or a structural element attached to the test apparatus.

摘要翻译： 可以相对于探针卡组件的元件调整探针卡组件的探针，探针卡组件可以是探针卡组件的元件，其有助于将探针卡组件安装到测试装置。 然后可以将探针卡组件安装在测试装置中，并且可以相对于测试装置（例如测试装置的结构部分或连接到测试装置的结构元件）来调整探针卡组件的取向。

公开(公告)号：US20050277323A1

公开(公告)日：2005-12-15

申请号：US10868425

申请日：2004-06-15

申请人： Benjamin Eldridge ,  Barbara Vasquez ,  Makarand Shinde ,  Gaetan Mathieu ,  A. Sporck

发明人： Benjamin Eldridge ,  Barbara Vasquez ,  Makarand Shinde ,  Gaetan Mathieu ,  A. Sporck

IPC分类号： G01R1/04 ,  G01R1/073 ,  G01R31/28 ,  H01R11/18

CPC分类号： G01R31/2889 ,  G01R1/0416 ,  G01R1/07307

摘要： A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.

摘要翻译： 晶片测试组件包括多个探针头基底，其布置成瓦片，其中连接器连接到一侧，探针支撑在相对侧上。 在一个实施例中，柔性电缆连接器将探头头瓦片上的连接器直接连接到测试头，而在另一个实施例中，柔性电缆将探头头瓦片连接到PCB，从而向测试头连接器提供水平布线。 在一个实施例中，调平销提供连接到附接到瓦片的保持元件以提供施加推挽平整力的简化支撑结构。 测试头连接器接口框架能够重新布置测试头和探针卡之间的连接器，以提供完整的晶片接触或部分晶片接触。 测试头连接器通过在轨道上滑动来重新布置，或者可插拔和可拔出，使得能够在一定范围的位置上移动。

公开(公告)号：US20060290367A1

公开(公告)日：2006-12-28

申请号：US11165833

申请日：2005-06-24

申请人： Eric Hobbs ,  Benjamin Eldridge ,  Lunyu Ma ,  Gaetan Mathieu ,  Steven Murphy ,  Makarand Shinde ,  Alexander Slocum

发明人： Eric Hobbs ,  Benjamin Eldridge ,  Lunyu Ma ,  Gaetan Mathieu ,  Steven Murphy ,  Makarand Shinde ,  Alexander Slocum

IPC分类号： G01R31/02

CPC分类号： G01R31/2886 ,  G01R1/073 ,  G01R31/31905 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49208 ,  Y10T29/49222

摘要： A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

摘要翻译： 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针，并且每个探针衬底上的探针组合在一起组成一组探针，用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”，“y”和/或“z”方向，并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此，探针可以相对于要测试的装置上的触点对准和/或平坦化。