公开(公告)号：US06683374B2

公开(公告)日：2004-01-27

申请号：US10232172

申请日：2002-08-30

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

IPC分类号： H01L2302

CPC分类号： H01L25/0657 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to face each other. The individual solder contact areas formed on the central contact areas and corresponding with one another are opposite and aligned with one another and are electrically conductively connected.

摘要翻译： 电子部件具有至少第一半导体芯片模块，第二半导体芯片模块和用于容纳半导体芯片模块的基板。 在这种情况下，两个半导体芯片模块的有源芯片表面均具有中心接触区域，这些中心接触区域彼此相对配置。 形成在中心接触区域上并彼此对应的各个焊接区域彼此相对并且彼此对准并且导电连接。

公开(公告)号：US06953992B2

公开(公告)日：2005-10-11

申请号：US10247966

申请日：2002-09-20

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/49 ,  H01L23/48 ,  H01L23/495 ,  H01L25/52

CPC分类号： H01L24/80 ,  H01L23/3128 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012

摘要： The invention relates to an electronic component having at least one semiconductor chip and a flat chip carrier assigned to the semiconductor chip. Electrical connections between contact areas on an active chip surface of the semiconductor chip and contact terminal areas on an upper side of the chip carrier are formed by strips of material that can undergo microstructuring and that are provided with an electrically conductive coating. The invention also relates to a method for producing the electronic component.

摘要翻译： 本发明涉及一种具有至少一个半导体芯片和分配给该半导体芯片的平坦芯片载体的电子部件。 在半导体芯片的有源芯片表面上的接触区域和芯片载体的上侧上的接触端子区域之间的电连接由能够经历微结构并且具有导电涂层的材料条形成。 本发明还涉及一种电子部件的制造方法。

公开(公告)号：US06710455B2

公开(公告)日：2004-03-23

申请号：US10231881

申请日：2002-08-30

申请人： Bernd Goller ,  Gerald Ofner ,  Josef Thumbs ,  Holger Wörner ,  Robert-Christian Hagen ,  Christian Stümpfl ,  Stefan Wein

发明人： Bernd Goller ,  Gerald Ofner ,  Josef Thumbs ,  Holger Wörner ,  Robert-Christian Hagen ,  Christian Stümpfl ,  Stefan Wein

IPC分类号： H01L2348

CPC分类号： H01L24/29 ,  H01L25/0657 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83139 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012

摘要： An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate carrier which is disposed between the semiconductor chips and which produces rewirings from them to the carrier substrate. A method for fabricating the component is also described.

摘要翻译： 电子部件形成有至少两个设置在载体基板上的半导体芯片。 半导体芯片的有源芯片表面包括形成相对的焊料接触表面的中心接触表面。 这些导体连接到设置在半导体芯片之间并产生从它们到载体衬底的重新布置的中间载体。 还描述了用于制造该部件的方法。

公开(公告)号：US07683460B2

公开(公告)日：2010-03-23

申请号：US11534374

申请日：2006-09-22

申请人： Ludwig Heitzer ,  Christian Stümpfl ,  Michael Bauer

发明人： Ludwig Heitzer ,  Christian Stümpfl ,  Michael Bauer

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A module (100) comprises a component (10) and a shielding element (11), which is mounted on a main surface (12) of the component (10) and has a welding contact (13).

摘要翻译： 模块（100）包括安装在部件（10）的主表面（12）上并具有焊接接头（13）的部件（10）和屏蔽元件（11）。