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    Method for making semiconductor package
    2.
    发明授权
    Method for making semiconductor package 有权
    制造半导体封装的方法

    公开(公告)号：US08216886B2

    公开(公告)日：2012-07-10

    申请号：US13004029

    申请日：2011-01-11

    Applicant: Bin Tian ,  Nan Xu ,  Jinzhong Yao

    Inventor： Bin Tian ,  Nan Xu ,  Jinzhong Yao

    IPC: H01L21/00

    CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A method for assembling a semiconductor package includes a rapid cooling step after post mold curing of an encapsulation material. The rapid cooling step includes blowing chilled, compressed air over the package for about two minutes. The rapid cooling step does not require any clamping pressure be simultaneously applied to the package. The rapid cooling step reduces a temperature of the encapsulation material from a curing temperature to the cooled temperature within a maximum period of less than five minutes. By using rapid cooling, as opposed to cooling the package under a clamping pressure with ambient air, package warpage due to CTE mismatches is prevented.

    Abstract translation: 一种组装半导体封装的方法包括在封装材料的后模塑固化之后的快速冷却步骤。 快速冷却步骤包括将冷却的压缩空气吹在包装上约两分钟。 快速冷却步骤不需要同时对包装施加任何夹紧压力。 快速冷却步骤将封装材料的温度从低于5分钟的最长时间内将固化温度降低到冷却温度。 通过使用快速冷却，与在环境空气下的夹紧压力下冷却封装相反，防止由于CTE错配引起的封装翘曲。

    METHOD FOR MAKING SEMICONDUCTOR PACKAGE
    3.
    发明申请
    METHOD FOR MAKING SEMICONDUCTOR PACKAGE 有权
    制造半导体封装的方法

    公开(公告)号：US20110193237A1

    公开(公告)日：2011-08-11

    申请号：US13004029

    申请日：2011-01-11

    Applicant: Bin Tian ,  Nan Xu ,  Jinzhong Yao

    Inventor： Bin Tian ,  Nan Xu ,  Jinzhong Yao

    IPC: H01L23/48 ,  H01L21/56

    CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A method for assembling a semiconductor package includes a rapid cooling step after post mold curing of an encapsulation material. The rapid cooling step includes blowing chilled, compressed air over the package for about two minutes. The rapid cooling step does not require any clamping pressure be simultaneously applied to the package. The rapid cooling step reduces a temperature of the encapsulation material from a curing temperature to the cooled temperature within a maximum period of less than five minutes. By using rapid cooling, as opposed to cooling the package under a clamping pressure with ambient air, package warpage due to CTE mismatches is prevented.

    Abstract translation: 一种组装半导体封装的方法包括在封装材料的后模塑固化之后的快速冷却步骤。 快速冷却步骤包括将冷却的压缩空气吹在包装上约两分钟。 快速冷却步骤不需要同时对包装施加任何夹紧压力。 快速冷却步骤将封装材料的温度从低于5分钟的最长时间内将固化温度降低到冷却温度。 通过使用快速冷却，与在环境空气下的夹紧压力下冷却封装相反，防止由于CTE错配引起的封装翘曲。

    SENSING METHOD AND SYSTEM FOR FRESNEL LENS
    8.
    发明申请
    SENSING METHOD AND SYSTEM FOR FRESNEL LENS 有权
    FRESNEL镜头感光方法及系统

    公开(公告)号：US20130308207A1

    公开(公告)日：2013-11-21

    申请号：US13978350

    申请日：2011-07-07

    Applicant: Xiaoping Hu ,  Bin Tian

    Inventor： Xiaoping Hu ,  Bin Tian

    IPC: G02B3/08

    CPC classification number: G02B3/08 ,  G01J1/0411 ,  G01J5/0896 ,  G01J5/54 ,  G01N21/84 ,  G02B3/0037 ,  G02B3/0043 ,  G02B3/0056 ,  G02B5/1861 ,  G02B6/0051 ,  G02B19/0009 ,  G02B21/0032 ,  G02B27/4272

    Abstract: A sensing method and system for Fresnel lenses are disclosed, the system including a first Fresnel lens unit for sensing the signal of a target object crossing a first boundary of a sensing area, a second Fresnel lens unit for sensing the signal of a target object crossing a second boundary of the sensing area, a third Fresnel lens unit for sensing the signal of a target object crossing a third boundary of the sensing area, and a sensing unit for receiving and processing the sensed signals of the Fresnel lens units. The first and second Fresnel lens units are arranged on two sides of the third Fresnel lens unit. Furthermore, it is possible to add more Fresnel lens units above, below or around the Fresnel lens units. By monitoring the boundaries of the sensing area, the sensing method and system for the Fresnel lenses improve the insufficiency of the sensing area, reduce cost and save power consumption.

    Abstract translation: 公开了一种用于菲涅尔透镜的感测方法和系统，该系统包括用于感测与感测区域的第一边界相交的目标物体的信号的第一菲涅耳透镜单元，用于感测目标物体交叉信号的第二菲涅耳透镜单元 感测区域的第二边界，用于感测与感测区域的第三边界相交的目标物体的信号的第三菲涅耳透镜单元，以及用于接收和处理感光单元的感测信号的感测单元。 第一和第二菲涅耳透镜单元布置在第三菲涅耳透镜单元的两侧。 此外，可以在菲涅耳透镜单元的上方，下方或周围添加更多的菲涅尔透镜单元。 通过监测感测区域的边界，菲涅尔透镜的感测方法和系统可以提高感测区域的不足，降低成本并节省功耗。

    METHOD AND APPARATUS FOR DETERMINING PROPAGATION DELAYS FOR USE IN WIDE AREA NETWORKS
    9.
    发明申请
    METHOD AND APPARATUS FOR DETERMINING PROPAGATION DELAYS FOR USE IN WIDE AREA NETWORKS 有权
    用于确定广域网使用的传播延迟的方法和装置

    公开(公告)号：US20120082153A1

    公开(公告)日：2012-04-05

    申请号：US13323482

    申请日：2011-12-12

    Applicant: Judd Erlenbach ,  Franklin J. Gutterman ,  Bin Tian

    Inventor： Judd Erlenbach ,  Franklin J. Gutterman ,  Bin Tian

    IPC: H04J3/06

    CPC classification number: H04W56/0045 ,  H04J3/0644 ,  H04J3/0682 ,  H04L7/08 ,  H04W56/0085

    Abstract: A system and method for determining a signal propagation delay between a transmitter and a receiver, and for adjusting a transmission time based on the propagation delay. A central station inserts a marker into a transmitted signal at a time corresponding to a received timing signal. The MCT receives the signal from the central station and determines a time difference between receipt of the marker and the detection of the time interval event. A transmission by the MCT is adjusted by an amount of time proportional to the time difference.

    Abstract translation: 一种用于确定发射机和接收机之间的信号传播延迟并且用于基于传播延迟来调整传输时间的系统和方法。 中心站在对应于接收到的定时信号的时间将标记插入发射信号。 MCT接收来自中心站的信号，并确定标记的接收和时间间隔事件的检测之间的时间差。 通过MCT的传输被调整与时间差成比例的时间量。

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