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    Fluid-containing cooling plate for an electronic component
    1.
    发明申请
    Fluid-containing cooling plate for an electronic component 失效
    用于电子部件的含流体冷却板

    公开(公告)号：US20060000579A1

    公开(公告)日：2006-01-05

    申请号：US10883450

    申请日：2004-07-01

    申请人： Bradley Whitney ,  Randolph Cook ,  John Cennamo ,  Sukhvinder Kang

    发明人： Bradley Whitney ,  Randolph Cook ,  John Cennamo ,  Sukhvinder Kang

    IPC分类号： F28F7/00

    CPC分类号： F28F3/12 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A fluid-containing cooling plate includes a bottom plate, a top plate, and metal wire or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire is plated or otherwise coated with a brazeable or solderable alloy which bonds it to the plates when the assembly is heated, thereby sealing the chamber. To make a two-phase cooling plate, slugs of plated metal are placed in the chamber and are bonded to the plates to provide support against collapse. The chamber is provided with a wicking structure, and is partially filled with an evaporable fluid via an inlet. A partial vacuum is then drawn, and the inlet is closed off. To make a single-phase cooling plate, wire partitions serving as baffles are provided in lieu of the slugs. These partitions can be arranged to provide a serpentine flow path between the inlet and an outlet, and are likewise plated with an alloy which melts to bond them to the plates.

    摘要翻译： 含流体的冷却板包括底板，顶板和形成电路并夹在板之间的金属线或管，以形成室。 电线被镀覆或以其他方式涂覆有可钎焊或可焊接的合金，当组件被加热时将其粘合到板上，从而密封腔室。 为了制造两相冷却板，将电镀金属的块塞放置在室中并结合到板上以提供支撑以防止塌陷。 腔室设有芯吸结构，并且通过入口部分地填充有可蒸发的流体。 然后抽出部分真空，并将入口封闭。 为了制造单相冷却板，提供用作挡板的线分隔件代替s塞。 这些隔板可以布置成在入口和出口之间提供蛇形流动路径，并且同样地镀有合金，其熔化以将它们结合到板上。

    Liquid cold plate heat exchanger
    2.
    发明申请
    Liquid cold plate heat exchanger 审中-公开
    液冷板换热器

    公开(公告)号：US20060096738A1

    公开(公告)日：2006-05-11

    申请号：US11053098

    申请日：2005-02-08

    申请人： Sukhvinder Kang ,  John Cennamo

    发明人： Sukhvinder Kang ,  John Cennamo

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  F28F3/022 ,  F28F3/12 ,  F28F9/028 ,  F28F13/06 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat exchanger includes a cooling plate having a heat collection surface for fixing against an object to be cooled, an opposed heat transfer surface which may be provided with fins, and a cooling chamber over the heat transfer surface, the cooling chamber having an inlet port and an outlet port for circulating a fluid through the cooling chamber via a flow path between the ports. A flow distributor in the flow path forms a plurality of inlet channels communicating with the inlet port, a plurality of outlet channels alternating with the inlet channels and communicating with the outlet port, and a plurality of flow surfaces which are spaced from the heat transfer surface by gaps. The inlet channels communicate with the gaps so that a fluid entering the inlet channels via the inlet port will flow through the gaps, into the outlet channels, and out of the chamber via the outlet port. The gaps are dimensioned to increase fluid velocity and promote mixing of the fluid, thereby improving heat transfer.

    摘要翻译： 一种热交换器包括：冷却板，具有用于固定待冷却物体的集热面，可设置有翅片的相对的传热面，以及在所述传热面上方的冷却室，所述冷却室具有入口 以及用于使流体经由所述端口之间的流动路径使流体循环通过所述冷却室的出口。 流动路径中的流量分配器形成与入口连通的多个入口通道，与入口通道交替并与出口连通的多个出口通道以及与传热表面间隔开的多个流动表面 通过差距 入口通道与间隙连通，使得通过入口进入入口通道的流体将通过出口通道流过出口通道，并通过出口流出室。 间隙的尺寸被设计成增加流体速度并促进流体的混合，从而改善热传递。

    Heat sink assembly and connecting device
    3.
    发明申请
    Heat sink assembly and connecting device 审中-公开
    散热器组件和连接装置

    公开(公告)号：US20050072558A1

    公开(公告)日：2005-04-07

    申请号：US10955279

    申请日：2004-09-30

    申请人： Bradley Whitney ,  Sukhvinder Kang

    发明人： Bradley Whitney ,  Sukhvinder Kang

    IPC分类号： H01L23/40 ,  F28F7/00

    CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink assembly includes a heat sink with a base plate having a top surface with fins for dissipating heat and an opposed bottom surface for placing against an electronic device mounted on a printed circuit board, and at least one connecting device for loading the heat sink against the electronic device. The connector includes a mechanical fastener such as a push pin having an end which engages the circuit board, a compression spring received against a shoulder on the fastener, and a cup member which is installed in an aperture in the base plate so that a floor of the cup member provides a bearing surface for the spring which is below the bottom surface of the base plate. An alternative connector utilizes a conical spring received through the base plate and receiving the fastener therein to load the spring in tension against the electronic device.

    摘要翻译： 散热器组件包括具有基板的散热器，底板具有用于散热的散热片的顶表面和用于放置在安装在印刷电路板上的电子设备的相对的底表面，以及至少一个用于加载散热器的连接装置 针对电子设备。 连接器包括机械紧固件，例如具有接合电路板的端部的推销，抵靠在紧固件上的肩部上的压缩弹簧，以及安装在基板中的孔中的杯构件， 杯构件提供用于在基板的底表面下方的弹簧的支承表面。 替代连接器使用容纳在基板上的锥形弹簧并将紧固件接纳在其中以将弹簧加载在电子装置上。

    Temperature sensor for high power very large scale integration circuits
    6.
    发明申请
    Temperature sensor for high power very large scale integration circuits 有权
    温度传感器适用于大功率超大规模集成电路

    公开(公告)号：US20060024852A1

    公开(公告)日：2006-02-02

    申请号：US10899768

    申请日：2004-07-27

    申请人： Rajiv Joshi ,  Sukhvinder Kang

    发明人： Rajiv Joshi ,  Sukhvinder Kang

    IPC分类号： H01L21/66

    CPC分类号： H01L22/34 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed is a temperature sensor for an integrated circuit having at least one field effect transistor (FET) having a polysilicon gate, in which a current and a voltage is supplied to the polysilicon gate, changes in the current and the voltage of the polysilicon gate are monitored, wherein the polysilicon gate of the at least one FET is electrically isolated from other components of the integrated circuit, and the changes in the current or voltage are used to calculate a change in resistance of the polysilicon gate, and the change in resistance of the polysilicon gate is used to calculate a temperature change within the integrated circuit.

    摘要翻译： 公开了一种用于集成电路的温度传感器，其具有至少一个具有多晶硅栅极的场效应晶体管（FET），其中电流和电压被提供给多晶硅栅极，多晶硅栅极的电流和电压的变化是 监控，其中所述至少一个FET的多晶硅栅极与所述集成电路的其它部件电隔离，并且使用所述电流或电压的变化来计算所述多晶硅栅极的电阻变化以及所述多晶硅栅极的电阻变化 多晶硅栅极用于计算集成电路内的温度变化。