公开(公告)号：US20200234993A1

公开(公告)日：2020-07-23

申请号：US16747271

申请日：2020-01-20

Applicant: Brewer Science, Inc.

Inventor： Luke Prenger ,  Arthur O. Southard ,  Qi Wu ,  Xiao Liu

IPC: H01L21/683 ,  C08G73/02 ,  B32B43/00 ,  H01L21/56

Abstract: Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

公开(公告)号：US10304720B2

公开(公告)日：2019-05-28

申请号：US15650535

申请日：2017-07-14

Applicant: Brewer Science Inc.

Inventor： Christina R. Matos-Perez ,  Tony D. Flaim ,  Arthur O. Southard ,  Lisa M. Kirchner ,  Deborah Blumenshine

IPC: H01L21/762 ,  B41C1/10 ,  C07C65/21 ,  C07C65/30 ,  C07C243/12 ,  C08G69/38 ,  C08G18/76 ,  C08G12/06 ,  C08G73/02 ,  C08G18/38

Abstract: Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.

公开(公告)号：US11610801B2

公开(公告)日：2023-03-21

申请号：US16747271

申请日：2020-01-20

Applicant: Brewer Science, Inc.

Inventor： Luke Prenger ,  Arthur O. Southard ,  Qi Wu ,  Xiao Liu

IPC: H01L21/683 ,  C08G73/02 ,  H01L21/56 ,  B32B43/00

Abstract: Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

公开(公告)号：US20250132283A1

公开(公告)日：2025-04-24

申请号：US18921261

申请日：2024-10-21

Applicant: Brewer Science, Inc.

Inventor： Xin Li ,  Yongqing Grace Jiang ,  Ruimeng Zhang ,  Arthur O. Southard ,  Luke M. Prenger

IPC: H01L23/00

Abstract: A dual-layer temporary bonding system for semiconductor manufacturing including first and second bonding layers is provided. The first bonding layer includes a bond line adhesion promoter that acts as a bond line adhesion promoter during the bonding process. The second bonding layer includes one or more functionalities that will react with the bond line adhesion promoter during the bonding process. The materials and methods of this system can provide increased, precisely controlled, bond line adhesion while at the same time also satisfying other desired performance criteria.

公开(公告)号：US20230187257A1

公开(公告)日：2023-06-15

申请号：US18162028

申请日：2023-01-31

Applicant: Brewer Science, Inc.

Inventor： Luke Prenger ,  Arthur O. Southard ,  Qi Wu ,  Xiao Liu

IPC: H01L21/683 ,  C08G73/02 ,  H01L21/56 ,  B32B43/00

CPC classification number: H01L21/6835 ,  C08G73/026 ,  H01L21/568 ,  B32B43/006 ,  B32B2457/00

Abstract: Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

公开(公告)号：US20220262755A1

公开(公告)日：2022-08-18

申请号：US17672020

申请日：2022-02-15

Applicant: Brewer Science, Inc.

Inventor： Chia-Hsin Lee ,  Alice Guerrero ,  Arthur O. Southard ,  Chen-Yu Wu ,  Xiao Liu

IPC: H01L23/00

Abstract: Achieving homogeneous and heterogeneous integration for 2.5D and 3D integrated circuit, chip-to-wafer, chip-to-substrate, or wafer-to-wafer bonding is an essential technology. The landing wafer or substrate is bonded with a carrier by using a temporary bonding material before thinning the landing wafer to the desired thickness. Upon completion of redistribution layer formation, Cu pad formation, or other backside processing, dies or wafers with through-silicon vias are stacked onto the landing substrate before molding and singulation. As the landing wafer usually has interconnection metals in the bond line, and those interconnection metals are typically made from lead-free solder alloys, deformation of those solder alloys during thermocompression bonding becomes an issue for manufacturers. To address this issue, a polymeric material with desired strengths is coated on the device wafer to form a conformal protective layer on top of solder alloys, thus enabling temporary bonding and debonding processes.

公开(公告)号：US20180019156A1

公开(公告)日：2018-01-18

申请号：US15650535

申请日：2017-07-14

Applicant: Brewer Science Inc.

Inventor： Cristina R. Matos-Perez ,  Tony D. Flaim ,  Arthur O. Southard ,  Lisa M. Kirchner ,  Deborah Blumenshine

IPC: H01L21/762 ,  C07C65/30 ,  B41C1/10 ,  C07C65/21 ,  C08G69/38 ,  C07C243/12

CPC classification number: H01L21/762 ,  B41C1/1033 ,  C07C65/21 ,  C07C65/30 ,  C07C243/12 ,  C08G12/06 ,  C08G18/3872 ,  C08G18/7671 ,  C08G69/38 ,  C08G73/02

Abstract: Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.