LOAD PORT MODULE
    1.
    发明申请
    LOAD PORT MODULE 审中-公开
    负载端口模块

    公开(公告)号:US20140369793A1

    公开(公告)日:2014-12-18

    申请号:US14472678

    申请日:2014-08-29

    Abstract: A substrate loading device having a frame, a cassette support, and a user interface. The frame is connected to a substrate processing apparatus. The frame has a transport opening through which substrates are transported between the device and processing apparatus. The cassette support is connected to the frame for holding at least one substrate holding cassette. The user interface is arranged for inputting information, and is mounted to the frame so that the user interface is integral with the frame.

    Abstract translation: 具有框架,盒支架和用户界面的基板装载装置。 框架连接到基板处理装置。 框架具有输送开口,基板通过该输送开口在装置和处理装置之间传送。 盒支撑件连接到框架,用于保持至少一个基板保持盒。 用户界面被布置用于输入信息,并且被安装到框架,使得用户界面与框架一体。

    Position feedback for sealed environments

    公开(公告)号:US10742092B2

    公开(公告)日:2020-08-11

    申请号:US14540058

    申请日:2014-11-13

    Abstract: A transport apparatus including a housing, a drive mounted to the housing, and at least one transport arm connected to the drive, where the drive includes at least one rotor having at least one salient pole of magnetic permeable material and disposed in an isolated environment, at least one stator having at least one salient pole with corresponding coil units and disposed outside the isolated environment where the at least one salient pole of the at least one stator and the at least one salient pole of the rotor form a closed magnetic flux circuit between the at least one rotor and the at least one stator, at least one seal partition configured to isolate the isolated environment, and at least one sensor including a magnetic sensor member connected to the housing, at least one sensor track connected to the at least one rotor where the at least one seal partition is disposed between and separates the magnetic sensor member and the at least one sensor track so that the at least one sensor track is disposed in the isolated environment and the magnetic sensor member is disposed outside the isolated environment.

    SUBSTRATE HANDLING SYSTEM FOR ALIGNING AND ORIENTING SUBSTRATES DURING A TRANSFER OPERATION

    公开(公告)号:US20170301576A1

    公开(公告)日:2017-10-19

    申请号:US15634957

    申请日:2017-06-27

    Inventor: Matthew W. Coady

    CPC classification number: H01L21/68 H01L21/68707

    Abstract: A system for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor calculates the location of the center and the notch of the wafer based on measurements by the sensor(s) and generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

    POSITION FEEDBACK FOR SEALED ENVIRONMENTS
    5.
    发明申请
    POSITION FEEDBACK FOR SEALED ENVIRONMENTS 审中-公开
    密封环境的位置反馈

    公开(公告)号:US20160164382A1

    公开(公告)日:2016-06-09

    申请号:US14540058

    申请日:2014-11-13

    Abstract: A transport apparatus including a housing, a drive mounted to the housing, and at least one transport arm connected to the drive, where the drive includes at least one rotor having at least one salient pole of magnetic permeable material and disposed in an isolated environment, at least one stator having at least one salient pole with corresponding coil units and disposed outside the isolated environment where the at least one salient pole of the at least one stator and the at least one salient pole of the rotor form a closed magnetic flux circuit between the at least one rotor and the at least one stator, at least one seal partition configured to isolate the isolated environment, and at least one sensor including a magnetic sensor member connected to the housing, at least one sensor track connected to the at least one rotor where the at least one seal partition is disposed between and separates the magnetic sensor member and the at least one sensor track so that the at least one sensor track is disposed in the isolated environment and the magnetic sensor member is disposed outside the isolated environment.

    Abstract translation: 一种运输装置,包括壳体,安装到壳体的驱动器和连接到驱动器的至少一个输送臂,其中驱动器包括至少一个转子,该转子具有至少一个磁性可渗透材料的凸极并且设置在隔离环境中, 至少一个定子具有至少一个具有对应的线圈单元的凸极并且设置在所述隔离环境的外部,其中所述至少一个定子的至少一个凸极和所述转子的所述至少一个凸极形成闭合磁通电路, 所述至少一个转子和所述至少一个定子,被配置为隔离所述隔离环境的至少一个密封分隔件,以及包括连接到所述壳体的磁性传感器构件的至少一个传感器,连接到所述至少一个的至少一个传感器轨道 转子,其中所述至少一个密封分隔件设置在所述磁性传感器构件和所述至少一个传感器轨道之间,并且使所述至少一个感测体 r轨道设置在隔离环境中,并且磁传感器构件设置在隔离环境的外部。

    Substrate handling system for aligning and orienting substrates during a transfer operation

    公开(公告)号:US09691651B2

    公开(公告)日:2017-06-27

    申请号:US14089439

    申请日:2013-11-25

    Inventor: Matthew W. Coady

    CPC classification number: H01L21/68 H01L21/68707

    Abstract: A system for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor calculates the location of the center and the notch of the wafer based on measurements by the sensor(s) and generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

    SUBSTRATE HANDLING SYSTEM FOR ALIGNING AND ORIENTING SUBSTRATES DURING A TRANSFER OPERATION

    公开(公告)号:US20160240418A9

    公开(公告)日:2016-08-18

    申请号:US14089439

    申请日:2013-11-25

    Inventor: Matthew W. Coady

    CPC classification number: H01L21/68 H01L21/68707

    Abstract: A system for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor calculates the location of the center and the notch of the wafer based on measurements by the sensor(s) and generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

    SUBSTRATE HANDLING SYSTEM FOR ALIGNING AND ORIENTING SUBSTRATES DURING A TRANSFER OPERATION
    8.
    发明申请
    SUBSTRATE HANDLING SYSTEM FOR ALIGNING AND ORIENTING SUBSTRATES DURING A TRANSFER OPERATION 有权
    用于在转移操作期间对准和定向基板的基板处理系统

    公开(公告)号:US20150147148A1

    公开(公告)日:2015-05-28

    申请号:US14089439

    申请日:2013-11-25

    Inventor: Matthew W. Coady

    CPC classification number: H01L21/68 H01L21/68707

    Abstract: A system for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor calculates the location of the center and the notch of the wafer based on measurements by the sensor(s) and generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

    Abstract translation: 一种用于在自动晶片处理过程中感测,定向和输送晶片的系统,其减少了颗粒和污染物的产生,从而提高了晶片产量。 该系统包括用于将晶片从一个站移动到目的地站的机器人臂,以及连接到机器人臂的端部用于接收晶片的端部执行器。 末端执行器包括用于夹持晶片的机构,用于旋转晶片夹持机构的直接驱动马达以及用于感测晶片的位置和取向的至少一个传感器。 控制处理器基于传感器的测量值来计算晶片的中心位置和凹口的位置,并产生用于旋转晶片夹持机构的对准信号,使晶片定向在末端执行器上的预定位置 而机器人手臂正在移动到另一个车站。

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