利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

6 条记录 (耗时 0.029 秒)

    Ultra-hard low friction coating based on AlMgB14 for reduced wear of MEMS and other tribological components and system
    3.
    发明申请
    Ultra-hard low friction coating based on AlMgB14 for reduced wear of MEMS and other tribological components and system 有权
    基于AlMgB14的超硬低摩擦涂层，减少MEMS和其他摩擦组件和系统的磨损

    公开(公告)号：US20050100748A1

    公开(公告)日：2005-05-12

    申请号：US10946051

    申请日：2004-09-21

    申请人： Bruce Cook ,  Yun Tian ,  Joel Harringa ,  Alan Constant ,  Alan Russell ,  Palaniappa Molian

    发明人： Bruce Cook ,  Yun Tian ,  Joel Harringa ,  Alan Constant ,  Alan Russell ,  Palaniappa Molian

    IPC分类号： B32B15/04 ,  B81B3/00 ,  B81B7/00 ,  C23C14/06 ,  C23C14/28 ,  C23C16/00

    CPC分类号： C23C14/067 ,  B81B3/0075 ,  B81C2201/032 ,  C23C14/28 ,  Y10S428/938 ,  Y10T428/12736 ,  Y10T428/1275 ,  Y10T428/31678

    摘要： Performance and reliability of microelectromechanical system (MEMS) components enhanced dramatically through the incorporation of protective thin film coatings. Current-generation MEMS devices prepared by the LIGA technique employ transition metals such as Ni, Cu, Fe, or alloys thereof, and hence lack stability in oxidizing, corrosive, and/or high temperature environments. Fabrication of a superhard, self-lubricating coating based on a ternary boride compound AlMgB14 is described in this letter as a potential breakthrough in protective coating technology for LIGA microdevices. Nanoindentation tests show that hardness of AlMgB14 films prepared by pulsed laser deposition ranges from 45 GPa to 51 GPa, when deposited at room temperature and 573 K, respectively. Extremely low friction coefficients of 0.04-0.05, which are thought to result from a self-lubricating effect, have also been confirmed by nanoscratch tests on the AlMgB14 films. Transmission electron microscopy studies show that the as-deposited films are amorphous, regardless of substrate temperature; however, analysis of FTIR spectra suggests that the higher substrate temperature facilitates formation of the B12 icosahedral framework, therefore leading to the higher hardness.

    摘要翻译： 微机电系统（MEMS）组件的性能和可靠性通过并入保护性薄膜涂层而显着提高。 通过LIGA技术制备的当前一代MEMS器件采用过渡金属如Ni，Cu，Fe或其合金，因此在氧化，腐蚀性和/或高温环境中缺乏稳定性。 在本文中描述了基于三元硼化物AlMgB 14的超硬自润滑涂层的制造，作为LIGA微型器件的保护涂层技术的潜在突破。 纳米压痕测试显示，当分别在室温和573K下沉积时，通过脉冲激光沉积制备的AlMgB 14 N膜的硬度范围为45GPa至51GPa。 认为是由自润滑效应引起的非常低的摩擦系数0.04-0.05也已经通过AlMgB 14膜的纳米尺度试验证实。 透射电子显微镜研究表明，沉积膜是无定形的，不管基底温度如何; 然而，FTIR光谱的分析表明较高的底物温度有助于形成B 12二十面体骨架，因此导致更高的硬度。

    Ductile binder phase for use with A1MgB14 and other hard materials
    4.
    发明授权
    Ductile binder phase for use with A1MgB14 and other hard materials 有权
    用于A1MgB14和其他硬质材料的延性粘结剂相

    公开(公告)号：US06921422B2

    公开(公告)日：2005-07-26

    申请号：US10669183

    申请日：2003-09-23

    申请人： Bruce A. Cook ,  Alan Russell ,  Joel Harringa

    发明人： Bruce A. Cook ,  Alan Russell ,  Joel Harringa

    IPC分类号： C22C29/14 ,  C22C29/00 ,  C09K3/14

    CPC分类号： C22C29/14

    摘要： This invention relates to a ductile binder phase for use with AlMgB14 and other hard materials. The ductile binder phase, a cobalt-manganese alloy, is used in appropriate quantities to tailor good hardness and reasonable fracture toughness for hard materials so they can be used suitably in industrial machining and grinding applications.

    摘要翻译： 本发明涉及与AlMgB 14和其它硬质材料一起使用的延性粘合剂相。 使用延性粘合剂相，钴锰合金，以适当的量来定制硬质材料的良好的硬度和合理的断裂韧性，因此它们可以适用于工业加工和研磨应用。

    Pb-Free Sn-Ag-Cu-Mn Solder
    5.
    发明申请
    Pb-Free Sn-Ag-Cu-Mn Solder 审中-公开
    无铅Sn-Ag-Cu-Mn焊料

    公开(公告)号：US20100203353A1

    公开(公告)日：2010-08-12

    申请号：US12456853

    申请日：2009-06-23

    申请人： Iver E. Anderson ,  Joel Harringa ,  Jason K. Walleser

    发明人： Iver E. Anderson ,  Joel Harringa ,  Jason K. Walleser

    IPC分类号： B32B15/01 ,  C22C13/00

    CPC分类号： C22C13/00 ,  B23K35/0222 ,  B23K35/262 ,  Y10T428/12493 ,  Y10T428/12708

    摘要： A solder alloy comprises Sn, Ag, Cu, and Mn and has a melting temperature of about 211 degrees C. A solder joint and solder process embody the solder alloy as well as solder balls and solder paste made therefrom to provide a solidified joint that includes three different intermetallic phases and a Sn metal phase. An exemplary Sn—Ag—Cu—Mn alloy consists essentially of about 3 to about 4 weight % Ag, about 0.80 to about 1.0 weight % Cu, and about 0.05 to about 0.15 weight % Mn, and balance consisting essentially of Sn.

    摘要翻译： 焊料合金包括Sn，Ag，Cu和Mn，熔化温度约为211摄氏度。焊接接头和焊接工艺包括焊料合金以及由其制成的焊球和焊膏，以提供固化接头，其包括 三种不同的金属间相和一种Sn金属相。 示例性的Sn-Ag-Cu-Mn合金基本上由约3至约4重量％的Ag，约0.80至约1.0重量％的Cu和约0.05至约0.15重量％的Mn组成，余量基本上由Sn组成。