公开(公告)号：US20060022334A1

公开(公告)日：2006-02-02

申请号：US10900538

申请日：2004-07-28

申请人： Bruce Myers ,  Darrel Peugh ,  Lester Wilkinson ,  Erich Gerbsch

发明人： Bruce Myers ,  Darrel Peugh ,  Lester Wilkinson ,  Erich Gerbsch

IPC分类号： H01L23/34

CPC分类号： H05K1/0272 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for exhausting coolant that has passed through the micro-channels. The semiconductor device is mounted on a single or multi-layer circuit board having electrical and fluid interconnect features that mate with the electrical terminals and inlet and outlet ports of the device to define a self-contained and self-sealed micro-channel heat exchanger.

公开(公告)号：US20050047186A1

公开(公告)日：2005-03-03

申请号：US10647981

申请日：2003-08-26

申请人： Erich Gerbsch ,  Monty Hayes ,  Robert Campbell

发明人： Erich Gerbsch ,  Monty Hayes ,  Robert Campbell

IPC分类号： G11C5/06 ,  H01L23/538 ,  H01L25/07 ,  H05K1/03 ,  H05K1/14

CPC分类号： H01L23/5385 ,  H01L25/071 ,  H01L25/074 ,  H01L2224/06181 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0306 ,  H05K1/144 ,  H01L2924/00

摘要： A vertical laminated electrical switch circuit includes a first, second, and third ceramic substrate positioned in juxtaposed relationship relative to each other. The circuit also includes a first and second electrical device electrically coupled to each other. The first electrical device is coupled to the first and second substrates and positioned there between. The second electrical device is coupled to the second and third ceramic substrates and positioned there between. In some embodiments, multiple electrical devices may be coupled to a single substrate.

摘要翻译： 垂直层压电开关电路包括相对于彼此并置设置的第一，第二和第三陶瓷衬底。 电路还包括彼此电耦合的第一和第二电气设备。 第一电气设备耦合到第一和第二基板并且定位在其间。 第二电气设备耦合到第二和第三陶瓷基板并且定位在其间。 在一些实施例中，多个电气装置可以耦合到单个衬底。

公开(公告)号：US20050179123A1

公开(公告)日：2005-08-18

申请号：US10780163

申请日：2004-02-17

申请人： Roger Mock ,  Erich Gerbsch

发明人： Roger Mock ,  Erich Gerbsch

IPC分类号： H01L21/44 ,  H01L23/495 ,  H01L23/498

CPC分类号： H01L23/49833 ,  H01L23/49861 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49222 ,  H01L2924/00

摘要： An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

摘要翻译： 集成电路封装包括具有第一内表面的第一非导电衬底和具有第二内表面的第二非导电衬底。 具有第一厚度的模具设置在第一和第二内表面之间。 引线框架包括具有近端和远端的构件。 近端具有小于第一厚度的第二厚度。 远端设置在第一和第二内表面之间。 远端是起伏的，使得远端具有大于第二厚度的有效厚度。

公开(公告)号：US20070069348A1

公开(公告)日：2007-03-29

申请号：US11543605

申请日：2006-10-05

申请人： Roger Mock ,  Erich Gerbsch

发明人： Roger Mock ,  Erich Gerbsch

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49833 ,  H01L23/49861 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49222 ,  H01L2924/00

摘要： An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

摘要翻译： 集成电路封装包括具有第一内表面的第一非导电衬底和具有第二内表面的第二非导电衬底。 具有第一厚度的模具设置在第一和第二内表面之间。 引线框架包括具有近端和远端的构件。 近端具有小于第一厚度的第二厚度。 远端设置在第一和第二内表面之间。 远端是起伏的，使得远端具有大于第二厚度的有效厚度。

公开(公告)号：US20070097627A1

公开(公告)日：2007-05-03

申请号：US11262400

申请日：2005-10-28

申请人： Ralph Taylor ,  Michael Jeter ,  Erich Gerbsch ,  Jeffrey Ronning

发明人： Ralph Taylor ,  Michael Jeter ,  Erich Gerbsch ,  Jeffrey Ronning

IPC分类号： H05K7/20

CPC分类号： H05K7/20872 ,  H05K1/182 ,  H05K7/20927

摘要： An electronics assembly is provided having a substrate and at least one electronics package supported on the substrate. The electronics package also has electrical circuitry and first and second side surfaces. The assembly further includes a first heat sink device positioned in thermal communication with the first side surface of the electronics package, and a second heat sink device positioned in thermal communication with the second side surface of the electronics package.

公开(公告)号：US20050035442A1

公开(公告)日：2005-02-17

申请号：US10946184

申请日：2004-09-21

申请人： Erich Gerbsch ,  Ralph Taylor

发明人： Erich Gerbsch ,  Ralph Taylor

IPC分类号： H01L23/373 ,  H01L23/492 ,  H01L23/498 ,  H01L23/48

CPC分类号： H01L23/49833 ,  H01L23/492 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT. etc. are positioned between a pair of ceramic substrate members. Layers of solderable material are directly bonded to the inner and outer surfaces of the substrate members.

摘要翻译： 电隔离导热的双面预封装IC元件，冲压引线元件，漏极焊盘，源极焊盘，栅极流道和MOSFET，IGBT。 等位于一对陶瓷基板构件之间。 可焊接材料层直接结合到基板构件的内表面和外表面。