公开(公告)号：US20050047186A1

公开(公告)日：2005-03-03

申请号：US10647981

申请日：2003-08-26

申请人： Erich Gerbsch ,  Monty Hayes ,  Robert Campbell

发明人： Erich Gerbsch ,  Monty Hayes ,  Robert Campbell

IPC分类号： G11C5/06 ,  H01L23/538 ,  H01L25/07 ,  H05K1/03 ,  H05K1/14

CPC分类号： H01L23/5385 ,  H01L25/071 ,  H01L25/074 ,  H01L2224/06181 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0306 ,  H05K1/144 ,  H01L2924/00

摘要： A vertical laminated electrical switch circuit includes a first, second, and third ceramic substrate positioned in juxtaposed relationship relative to each other. The circuit also includes a first and second electrical device electrically coupled to each other. The first electrical device is coupled to the first and second substrates and positioned there between. The second electrical device is coupled to the second and third ceramic substrates and positioned there between. In some embodiments, multiple electrical devices may be coupled to a single substrate.

摘要翻译： 垂直层压电开关电路包括相对于彼此并置设置的第一，第二和第三陶瓷衬底。 电路还包括彼此电耦合的第一和第二电气设备。 第一电气设备耦合到第一和第二基板并且定位在其间。 第二电气设备耦合到第二和第三陶瓷基板并且定位在其间。 在一些实施例中，多个电气装置可以耦合到单个衬底。

公开(公告)号：US20050280053A1

公开(公告)日：2005-12-22

申请号：US10873429

申请日：2004-06-22

申请人： Monty Hayes ,  Robert Campbell ,  John Fruth

发明人： Monty Hayes ,  Robert Campbell ,  John Fruth

IPC分类号： H01L29/423 ,  H01L29/739 ,  H01L29/76 ,  H01L29/78

CPC分类号： H01L29/4238 ,  H01L29/7393 ,  H01L29/7802

摘要： A semiconductor device includes a device body, a gate pad and a gate signal distribution runner. The device body includes a plurality of parallel cells and the gate pad is located on a top surface of the device body adjacent a corner of the device body. The gate signal distribution runner includes a peripheral gate signal distribution runner extending around the periphery of the device body from the gate pad and a diagonal gate signal distribution runner extending diagonally across the device body from the gate pad. The gate signal distribution runner provides a gate signal to a gate of each of the plurality of parallel cells.

摘要翻译： 半导体器件包括器件本体，栅极焊盘和栅极信号分配流道。 装置本体包括多个平行单元，并且该栅垫位于与装置主体的角部相邻的装置主体的顶表面上。 门信号分配器包括从栅极焊盘延伸围绕器件本体的周边的外围栅极信号分配器，以及从栅极焊盘横跨器件本体对角线延伸的对角线栅极信号分配器。 门信号分配器向多个并行单元中的每一个的栅极提供栅极信号。

公开(公告)号：US20060151785A1

公开(公告)日：2006-07-13

申请号：US11035212

申请日：2005-01-13

申请人： Robert Campbell ,  Monty Hayes ,  John Fruth

发明人： Robert Campbell ,  Monty Hayes ,  John Fruth

IPC分类号： H01L23/58

CPC分类号： H01L24/05 ,  H01L22/32 ,  H01L24/06 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/48455 ,  H01L2224/4847 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes a device body, a pad and a signal distribution runner. The device body includes a plurality of parallel cells and at least one integrated electronic component. The pad is located on a surface of the device body and includes a first portion and a second portion that are electrically isolated. The signal distribution runner is electrically coupled to and extends from the first portion of the pad. The signal distribution runner provides a signal to a same terminal of each of the plurality of parallel cells. The at least one integrated electronic component is electrically coupled to the second portion of the pad.

摘要翻译： 半导体器件包括器件本体，焊盘和信号分配器。 器件主体包括多个并联单元和至少一个集成电子元件。 垫位于装置主体的表面上，并且包括电隔离的第一部分和第二部分。 信号分配流道电耦合到垫的第一部分并从垫的第一部分延伸。 信号分配转移器向多个并行单元中的每一个的相同端子提供信号。 所述至少一个集成电子部件电耦合到所述焊盘的第二部分。