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    Method and apparatus for exposing semiconductor substrates
    1.
    发明授权
    Method and apparatus for exposing semiconductor substrates 有权
    曝光半导体衬底的方法和装置

    公开(公告)号：US07417709B2

    公开(公告)日：2008-08-26

    申请号：US11168527

    申请日：2005-06-29

    申请人： Sang-Ho Lee ,  Jin-Phil Choi ,  Dong-Hwa Shin ,  Seung-Ki Chae ,  Byong-Cheol Park

    发明人： Sang-Ho Lee ,  Jin-Phil Choi ,  Dong-Hwa Shin ,  Seung-Ki Chae ,  Byong-Cheol Park

    IPC分类号： G03B27/42 ,  G03B27/70 ,  G03B27/54 ,  G03B27/74 ,  G03B27/32 ,  G03C5/00

    CPC分类号： G03B27/42 ,  G03F7/70275

    摘要： Provided are methods and apparatus for exposing multiple substrates within a single exposing apparatus using only a single light source wherein a first substrate is exposed in a series of steps or shots during which light transmitted along a primary optical path is directed onto a primary surface of the substrate with the substrate being repositioned between sequential shots. A second substrate is exposed during the period of time while the first substrate is being repositioned by altering the optical path to divert the light from the light source into a secondary optical path that will expose a region on the second substrate. When the first substrate has been repositioned, the diversion of the light is terminated so that the light will again be transmitted along the primary optical path in order to expose the next sequential shot on the primary surface of the first substrate.

    摘要翻译： 提供了用于仅使用单个光源在单个曝光设备中曝光多个基板的方法和设备，其中第一基板以一系列步骤或照射曝光，在此期间沿主要光学路径传输的光被引导到 衬底，其中衬底在连续镜头之间重新定位。 第二衬底在一段时间期间被曝光，同时通过改变光路来重新定位第一衬底，以将来自光源的光转移到将暴露第二衬底上的区域的次级光路。 当第一衬底被重新定位时，光的转向被终止，使得光将再次沿着主光路传播，以便暴露第一衬底的主表面上的下一个顺序射击。

    Method and apparatus for exposing semiconductor substrates
    5.
    发明申请
    Method and apparatus for exposing semiconductor substrates 有权
    曝光半导体衬底的方法和装置

    公开(公告)号：US20060001852A1

    公开(公告)日：2006-01-05

    申请号：US11168527

    申请日：2005-06-29

    申请人： Sang-Ho Lee ,  Jin-Phil Choi ,  Dong-Hwa Shin ,  Seung-Ki Chae ,  Byong-Cheol Park

    发明人： Sang-Ho Lee ,  Jin-Phil Choi ,  Dong-Hwa Shin ,  Seung-Ki Chae ,  Byong-Cheol Park

    IPC分类号： G03B27/42

    CPC分类号： G03B27/42 ,  G03F7/70275

    摘要： Provided are methods and apparatus for exposing multiple substrates within a single exposing apparatus using only a single light source wherein a first substrate is exposed in a series of steps or shots during which light transmitted along a primary optical path is directed onto a primary surface of the substrate with the substrate being repositioned between sequential shots. A second substrate is exposed during the period of time while the first substrate is being repositioned by altering the optical path to divert the light from the light source into a secondary optical path that will expose a region on the second substrate. When the first substrate has been repositioned, the diversion of the light is terminated so that the light will again be transmitted along the primary optical path in order to expose the next sequential shot on the primary surface of the first substrate.

    摘要翻译： 提供了用于仅使用单个光源在单个曝光设备中曝光多个基板的方法和设备，其中第一基板以一系列步骤或照射曝光，在此期间沿主要光学路径传输的光被引导到 衬底，其中衬底在连续镜头之间重新定位。 第二衬底在一段时间期间被曝光，同时通过改变光路来重新定位第一衬底，以将来自光源的光转移到将暴露第二衬底上的区域的次级光路。 当第一衬底被重新定位时，光的转向被终止，使得光将再次沿着主光路传播，以便暴露第一衬底的主表面上的下一个顺序射击。

    Temperature controller for a semiconductor-fabricating tool
    6.
    发明授权
    Temperature controller for a semiconductor-fabricating tool 失效
    半导体制造工具的温度控制器

    公开(公告)号：US07155915B2

    公开(公告)日：2007-01-02

    申请号：US11023328

    申请日：2004-12-27

    申请人： Dong-Hwa Shin ,  Byong-Cheol Park ,  Sang-Ho Lee ,  Sung-Wook Park

    发明人： Dong-Hwa Shin ,  Byong-Cheol Park ,  Sang-Ho Lee ,  Sung-Wook Park

    IPC分类号： F25B21/02

    CPC分类号： H01L21/67393 ,  F25B21/02 ,  F25B2321/0212 ,  F25B2700/2107 ,  H01L21/67248

    摘要： A temperature controller for a semiconductor-fabricating tool includes a Peltier element disposed on an outer wall of the semiconductor-fabricating tool, and a battery for providing a current to the Peltier element. The Peltier element a heat-emitting plate for emitting heat by the current provided thereto, and a heat-absorbing plate for absorbing a heat. A first temperature sensor senses a temperature of the Peltier element. A second temperature sensor senses an interior temperature of the semiconductor-fabricating tool. A controller controls an amount of the current provided to the Peltier element in accordance with a temperature of the Peltier element sensed by the first temperature sensor and an interior temperature of the semiconductor-fabricating tool sensed by the second temperature sensor.

    摘要翻译： 用于半导体制造工具的温度控制器包括设置在半导体制造工具的外壁上的珀耳帖元件和用于向珀耳帖元件提供电流的电池。 珀耳帖元件是用于通过设置在其上的电流发射热量的发热板，以及用于吸收热量的吸热板。 第一温度传感器感测珀尔帖元件的温度。 第二温度传感器感测半导体制造工具的内部温度。 控制器根据由第一温度传感器感测的珀耳帖元件的温度和由第二温度传感器感测到的半导体制造工具的内部温度来控制提供给珀尔帖元件的电流量。

    Temperature controller for a semiconductor-fabricating tool
    7.
    发明申请
    Temperature controller for a semiconductor-fabricating tool 失效
    半导体制造工具的温度控制器

    公开(公告)号：US20050138935A1

    公开(公告)日：2005-06-30

    申请号：US11023328

    申请日：2004-12-27

    申请人： Dong-Hwa Shin ,  Byong-Cheol Park ,  Sang-Ho Lee ,  Sung-Wook Park

    发明人： Dong-Hwa Shin ,  Byong-Cheol Park ,  Sang-Ho Lee ,  Sung-Wook Park

    IPC分类号： H01L21/02 ,  F25B21/02 ,  H01L21/00 ,  H01L21/673

    CPC分类号： H01L21/67393 ,  F25B21/02 ,  F25B2321/0212 ,  F25B2700/2107 ,  H01L21/67248

    摘要： A temperature controller for a semiconductor-fabricating tool includes a Peltier element disposed on an outer wall of the semiconductor-fabricating tool, and a battery for providing a current to the Peltier element. The Peltier element a heat-emitting plate for emitting heat by the current provided thereto, and a heat-absorbing plate for absorbing a heat. A first temperature sensor senses a temperature of the Peltier element. A second temperature sensor senses an interior temperature of the semiconductor-fabricating tool. A controller controls an amount of the current provided to the Peltier element in accordance with a temperature of the Peltier element sensed by the first temperature sensor and an interior temperature of the semiconductor-fabricating tool sensed by the second temperature sensor.

    摘要翻译： 用于半导体制造工具的温度控制器包括设置在半导体制造工具的外壁上的珀耳帖元件和用于向珀耳帖元件提供电流的电池。 珀耳帖元件是用于通过设置在其上的电流发射热量的发热板，以及用于吸收热量的吸热板。 第一温度传感器感测珀尔帖元件的温度。 第二温度传感器感测半导体制造工具的内部温度。 控制器根据由第一温度传感器感测的珀耳帖元件的温度和由第二温度传感器感测到的半导体制造工具的内部温度来控制提供给珀尔帖元件的电流量。

    Device for recovering photoresist material exhausted from a spin coater
    10.
    发明授权
    Device for recovering photoresist material exhausted from a spin coater 失效
    用于回收从旋涂机排出的光致抗蚀剂材料的装置

    公开(公告)号：US5776250A

    公开(公告)日：1998-07-07

    申请号：US768700

    申请日：1996-12-18

    申请人： Dong-Hwa Shin ,  Young-Min Ko

    发明人： Dong-Hwa Shin ,  Young-Min Ko

    IPC分类号： H01L21/027 ,  B05C11/08 ,  B05C11/10 ,  B08B3/02 ,  G03F7/16 ,  B05B1/28 ,  B05B3/04 ,  B05C11/02 ,  B08B3/04

    CPC分类号： B05C11/08 ,  B08B3/02 ,  G03F7/162 ,  B05C11/1039 ,  Y10S134/902

    摘要： A device is for recovering superfluous photoresist material exhausted from a spin coater having a drive motor alternately operated at a high speed and a low speed at predetermined intervals. The device includes a solution collecting member into which superfluous photoresist material and cleaning solution are collected after a photoresist is coated onto a wafer and the wafer is cleaned during operation of the drive motor. The solution collecting member has a groove circumferentially formed therein to allow the superfluous photoresist material to flow therein. First and second discharge pipes communicate with the solution collecting member to drain the superfluous photoresist material and a cleaning solution and a third discharging pipe communicates with the groove formed in the solution collecting member. An actuator is provided to move a blocking member between an open position and closed position to open and close the groove.

    摘要翻译： 一种装置用于回收从具有以预定间隔以高速和低速交替操作的驱动马达的旋涂机排出的多余的光致抗蚀剂材料。 该装置包括溶液收集构件，其中在将光致抗蚀剂涂覆到晶片上之后，多余的光致抗蚀剂材料和清洁溶液被收集到其中，并且在驱动电动机的操作期间清洁晶片。 溶液收集构件具有周向形成在其中的凹槽，以允许多余的光致抗蚀剂材料在其中流动。 第一和第二排出管与溶液收集构件连通以排出多余的光致抗蚀剂材料，并且清洁溶液和第三排出管与形成在溶液收集构件中的凹槽连通。 提供致动器以使阻挡构件在打开位置和关闭位置之间移动以打开和关闭凹槽。