利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

45 条记录 (耗时 0.018 秒)

    Heating and Cooling Unit with Semiconductor Device and Heat Pipe
    2.
    发明申请
    Heating and Cooling Unit with Semiconductor Device and Heat Pipe 审中-公开
    具有半导体器件和热管的加热和冷却单元

    公开(公告)号：US20130174577A1

    公开(公告)日：2013-07-11

    申请号：US13347229

    申请日：2012-01-10

    申请人： Francis Thomas Brija ,  Ping Wu

    发明人： Francis Thomas Brija ,  Ping Wu

    IPC分类号： F25B21/02

    CPC分类号： F25B21/04 ,  A47F10/06 ,  A47J36/2483 ,  A47J36/26 ,  F25B2321/0252 ,  F25B2700/2107 ,  F25D2400/08

    摘要： Aspects of the invention support the changing of a serving surface temperature in order to cool or heat the serving surface. Heat is transferred to or from the serving surface through at least one Peltier device, a heat pipe, and a heat sink. The mode of operation is determined by changing the electrical power polarity to the at least one Peltier device. A control device may activate the at least one Peltier device from a measured temperature and a temperature setting with a hysteresis. A plurality of Peltier devices may be partitioned into different subsets so that the control device may activate a selected subset during different time intervals. When the measured temperature is outside a temperature range, all of the Peltier devices may be activated, while only a selected subset may be activated when the measured temperature is within the temperature range and until a hysteresis temperature is reached.

    摘要翻译： 本发明的方面支持服务表面温度的改变以便冷却或加热服务表面。 热量通过至少一个珀耳帖装置，热管和散热器传送到服务表面或从服务表面转​​移。 通过将电功率极性改变为至少一个珀耳帖装置来确定操作模式。 控制装置可以从测量的温度和具有滞后的温度设置激活至少一个珀耳帖装置。 多个珀耳帖装置可以被划分成不同的子集，使得控制装置可以在不同的时间间隔内激活所选择的子集。 当测量的温度在温度范围之外时，所有的珀尔帖装置都可以被激活，而当所测量的温度在温度范围内并且直到达到滞后温度时，只有一个选定的子集可以被激活。

    COOLING APPARATUS
    3.
    发明申请
    COOLING APPARATUS 审中-公开
    冷却装置

    公开(公告)号：US20110179806A1

    公开(公告)日：2011-07-28

    申请号：US12910107

    申请日：2010-10-22

    申请人： Shigetoshi Ipposhi ,  Tatsuro Hirose ,  Kazuo Kadowaki ,  Takumi Kijima ,  Takayuki Nakao

    发明人： Shigetoshi Ipposhi ,  Tatsuro Hirose ,  Kazuo Kadowaki ,  Takumi Kijima ,  Takayuki Nakao

    IPC分类号： F25B21/04 ,  F25B21/02 ,  F28D15/04 ,  F25B29/00

    CPC分类号： F28D15/0266 ,  F25B21/02 ,  F25B23/006 ,  F25B25/00 ,  F25B2321/021 ,  F25B2700/2107 ,  H01L23/38 ,  H01L23/427 ,  H01L2924/0002 ,  H01S5/02415 ,  H01S5/4093 ,  H01L2924/00

    摘要： Disclosed is a cooling apparatus including: a heat receiving plate to which a plurality of heating elements are attached; a radiator plate to which a plurality of Peltier devices are attached; a thermal transport heat pipe that couples the heat receiving plate with the radiator plate; and a heat dissipating device being provided on an exothermic side of the Peltier devices; wherein the plurality of heating elements are arranged along a longitudinal direction of the thermal transport heat pipe, and the plurality of Peltier devices are arranged along the longitudinal direction of the thermal transport heat pipe, whereby, when using a plurality of Peltier devices, reducing power consumption thereof by equalizing each operation of the respective Peltier devices.

    摘要翻译： 本发明公开了一种冷却装置，其特征在于，包括：多个加热元件安装在该受热板上; 安装有多个珀耳帖装置的散热板; 将热接收板与散热板联接的热传输热管; 以及在珀耳帖装置的放热侧设置的散热装置; 其特征在于，所述多个加热元件沿着所述热传输热管的长度方向配置，所述多个珀耳帖装置沿着所述热输送热管的长度方向配置，由此，在使用多个珀耳贴装置的情况下， 通过均衡各个珀耳帖装置的每个操作来消耗它们。

    Temperature controller for a semiconductor-fabricating tool
    4.
    发明授权
    Temperature controller for a semiconductor-fabricating tool 失效
    半导体制造工具的温度控制器

    公开(公告)号：US07155915B2

    公开(公告)日：2007-01-02

    申请号：US11023328

    申请日：2004-12-27

    申请人： Dong-Hwa Shin ,  Byong-Cheol Park ,  Sang-Ho Lee ,  Sung-Wook Park

    发明人： Dong-Hwa Shin ,  Byong-Cheol Park ,  Sang-Ho Lee ,  Sung-Wook Park

    IPC分类号： F25B21/02

    CPC分类号： H01L21/67393 ,  F25B21/02 ,  F25B2321/0212 ,  F25B2700/2107 ,  H01L21/67248

    摘要： A temperature controller for a semiconductor-fabricating tool includes a Peltier element disposed on an outer wall of the semiconductor-fabricating tool, and a battery for providing a current to the Peltier element. The Peltier element a heat-emitting plate for emitting heat by the current provided thereto, and a heat-absorbing plate for absorbing a heat. A first temperature sensor senses a temperature of the Peltier element. A second temperature sensor senses an interior temperature of the semiconductor-fabricating tool. A controller controls an amount of the current provided to the Peltier element in accordance with a temperature of the Peltier element sensed by the first temperature sensor and an interior temperature of the semiconductor-fabricating tool sensed by the second temperature sensor.

    摘要翻译： 用于半导体制造工具的温度控制器包括设置在半导体制造工具的外壁上的珀耳帖元件和用于向珀耳帖元件提供电流的电池。 珀耳帖元件是用于通过设置在其上的电流发射热量的发热板，以及用于吸收热量的吸热板。 第一温度传感器感测珀尔帖元件的温度。 第二温度传感器感测半导体制造工具的内部温度。 控制器根据由第一温度传感器感测的珀耳帖元件的温度和由第二温度传感器感测到的半导体制造工具的内部温度来控制提供给珀尔帖元件的电流量。

    Energy recovery from waste heat
    6.
    发明授权
    Energy recovery from waste heat 有权

    公开(公告)号：US11946672B2

    公开(公告)日：2024-04-02

    申请号：US15734738

    申请日：2019-05-29

    申请人： Breakthrough Technologies, LLC

    发明人： Kamal Jaffrey

    IPC分类号： F25B21/02 ,  F25B25/00 ,  H10N10/17

    CPC分类号： F25B21/02 ,  F25B25/00 ,  H10N10/17 ,  F25B2321/0212 ,  F25B2321/023 ,  F25B2339/047 ,  F25B2700/2107

    摘要： An apparatus for waste heat recovery is provided. The apparatus includes a base block disposed adjacent to a heat source, a thermoelectric generator including a first end and a second end, the first end being thermally coupled to the base block and configured to receive heat from the heat source, and a thermoelectric cooler including a third end and a fourth end, the third end being thermally coupled to the second end. The thermoelectric cooler is configured to receive an electric current, which causes the third end to cool and the fourth end to heat such that the third end conducts heat from the second end. Related apparatus, systems, techniques, and articles are also described.

    REFRIGERATOR
    7.
    发明申请
    REFRIGERATOR 审中-公开

    公开(公告)号：US20180266735A1

    公开(公告)日：2018-09-20

    申请号：US15918063

    申请日：2018-03-12

    申请人： LG ELECTRONICS INC.

    发明人： Seokhyun KIM ,  Minkyu OH ,  Heayoun SUL ,  Hyoungkeun LIM ,  Jeehoon CHOI

    IPC分类号： F25B21/04 ,  F25D17/06 ,  F25B47/02

    CPC分类号： F25B21/04 ,  F25B21/02 ,  F25B47/02 ,  F25B2321/0211 ,  F25B2321/0212 ,  F25B2321/0251 ,  F25B2700/2104 ,  F25B2700/2106 ,  F25B2700/2107 ,  F25D17/062 ,  F25D21/06 ,  F25D2700/12 ,  F25D2700/14

    摘要： A refrigerator may include a temperature sensor, a thermoelectric device module having a thermoelectric device, and at least one fan and configured to cool a storage compartment, and a controller that controls the output power of the thermoelectric device based on the temperature of the storage compartment, a set temperature, and the outside temperature. The output power of the thermoelectric device may be determined based on whether the temperature of the storage compartment is within a first temperature region including the set temperature, a second temperature region, or a third temperature region. In the first and second temperature regions, the thermoelectric device may operate at different output power and which gradually increases as the outside temperature increases. In the third temperature region, the thermoelectric device may operate at a third output power which exceeds the first output power and is greater than or equal to the second output power.