公开(公告)号：US20120282709A1

公开(公告)日：2012-11-08

申请号：US13496059

申请日：2009-09-14

申请人： Byung Chul Lee ,  Jin Sik Kim ,  Hyun Joon Shin ,  Sang Youp Lee ,  Ji Yoon Kang

发明人： Byung Chul Lee ,  Jin Sik Kim ,  Hyun Joon Shin ,  Sang Youp Lee ,  Ji Yoon Kang

IPC分类号： G01N21/64 ,  G01N21/76 ,  C07K1/26 ,  B82Y5/00 ,  B82Y20/00

CPC分类号： C12Q1/6869 ,  C12Q2525/107 ,  C12Q2537/161 ,  C12Q2565/631

摘要： Provided are a DNA sequence analysis method of high precision providing improved optical limits by detecting wavelengths of lights emitted from labels in the state where a DNA is electrically tethered and completely stretch, and a nanodevice chip for automating the method. Also provided are a DNA sequence analysis method capable of removing binding errors through complementarily binding between a plurality of peptide nucleic acids (PNAs) labeled with labels emitting lights of different wavelengths and a target DNA to be sequenced, and resolving the limit in optical spatial resolution.

摘要翻译： 提供了一种高精度的DNA序列分析方法，其通过检测在DNA被电连接并完全拉伸的状态下从标签发射的光的波长来提供改善的光学限制，以及用于使该方法自动化的纳米设备芯片。 还提供了一种DNA序列分析方法，其能够通过在发射不同波长的光的标记的标记的多个肽核酸（PNA）和待测序的靶DNA之间的互补结合来消除结合错误，并且解决光学空间分辨率的限制 。

公开(公告)号：US20090288293A1

公开(公告)日：2009-11-26

申请号：US12232995

申请日：2008-09-26

申请人： Sang Youp Lee ,  Keung Jin Sohn ,  Joung Gul Ryu ,  Jung Hwan Park ,  Ho Sik Park ,  Jun Hyeong Park

发明人： Sang Youp Lee ,  Keung Jin Sohn ,  Joung Gul Ryu ,  Jung Hwan Park ,  Ho Sik Park ,  Jun Hyeong Park

IPC分类号： H01R43/16

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4608 ,  H05K2201/0355 ,  H05K2203/1189 ,  H05K2203/1461 ,  Y10T29/49204

摘要： A metal core package substrate and a method for manufacturing the same. A method for manufacturing a metal core package substrate may include: forming a plurality of holes in a metal core; forming a plurality of paste bumps piercing into insulation layers of a first copper foil layer and a second copper foil layer; positioning the first and second copper foil layers at positions corresponding to the holes of the metal core so that the paste bumps are opposed to each other around the metal core; allowing each paste bump to pierce into the holes of the metal core by pressing the first and second copper foil layers; and forming inner circuits in the metal core pierced with the paste bumps.

摘要翻译： 金属芯封装基板及其制造方法。 金属芯封装基板的制造方法可以包括：在金属芯中形成多个孔; 形成穿过第一铜箔层和第二铜箔层的绝缘层的多个焊料凸块; 将第一和第二铜箔层定位在与金属芯的孔对应的位置处，使得焊膏凸起彼此围绕金属芯相对; 通过按压第一和第二铜箔层，允许每个焊膏凸起穿入金属芯的孔中; 并且在金属芯中形成用该焊膏凸起的内部电路。

公开(公告)号：US08704100B2

公开(公告)日：2014-04-22

申请号：US12717855

申请日：2010-03-04

申请人： Sang Youp Lee ,  Joung Gul Ryu ,  Dong Sun Kim ,  Jae Hoon Choi ,  In Ho Seo

发明人： Sang Youp Lee ,  Joung Gul Ryu ,  Dong Sun Kim ,  Jae Hoon Choi ,  In Ho Seo

IPC分类号： H05K1/00

CPC分类号： H05K3/4007 ,  C25D5/02 ,  C25D5/12 ,  C25D5/48 ,  H01L2924/0002 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0338 ,  H05K2203/0361 ,  Y10T29/302 ,  Y10T29/417 ,  H01L2924/00

摘要： Disclosed herein is a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin.

摘要翻译： 本发明公开了一种散热基板，其特征在于，包括：散热电路层，其由形成在所述凹凸层的两面上的不锈钢层和电解铜镀层构成， 绝热层，形成在散热电路层的两侧，使得散热电路层插入在绝缘层之间; 形成在绝缘层上的第一和第二电路层; 以及将散热电路层与第一电路层连接的第一凸块和将散热电路层与第二电路层连接的第二凸块。 散热基板表现出优异的散热效率并且可以变薄。