公开(公告)号：US20140159071A1

公开(公告)日：2014-06-12

申请号：US14096138

申请日：2013-12-04

申请人： Byung Yeon CHOI ,  Myeong Soo Kim ,  Hee Young Beom ,  Yong Gyeong Lee ,  Hyun Seoung Ju ,  Gi Seok Hong

发明人： Byung Yeon CHOI ,  Myeong Soo Kim ,  Hee Young Beom ,  Yong Gyeong Lee ,  Hyun Seoung Ju ,  Gi Seok Hong

IPC分类号： H01L27/15

CPC分类号： H01L27/156 ,  H01L27/15 ,  H01L33/10 ,  H01L33/145 ,  H01L33/385 ,  H01L33/42 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting device includes a substrate, light emitting cells, each of the light emitting cells including a light emitting structure including lower and upper semiconductor layers, an upper electrode, and a lower electrode, a conductive interconnection layer electrically connecting a lower electrode of a first one of the light emitting cells and an upper electrode of a second one of the light emitting cells, and a current blocking layer disposed to extend from between the upper electrode and the upper semiconductor layer, wherein each light emitting cell further includes a conductive layer arranged to electrically connect the upper electrode of the second light emitting cell to the upper semiconductor layer of the second light emitting cell.

摘要翻译： 发光装置包括基板，发光单元，每个发光单元包括包括下半导体层和上半导体层的发光结构，上电极和下电极，导电互连层，电连接 发光单元中的第一个和第二个发光单元的上电极以及从上电极和上半导体层之间延伸设置的电流阻挡层，其中每个发光单元还包括导电层 布置成将第二发光单元的上电极电连接到第二发光单元的上半导体层。

公开(公告)号：US20140124730A1

公开(公告)日：2014-05-08

申请号：US14062131

申请日：2013-10-24

申请人： Byung Yeon CHOI ,  Hee Young Beom ,  Yong Gyeong Lee ,  Ji Hwan Lee ,  Hyun Seoung Ju ,  Gi Seok Hong

发明人： Byung Yeon CHOI ,  Hee Young Beom ,  Yong Gyeong Lee ,  Ji Hwan Lee ,  Hyun Seoung Ju ,  Gi Seok Hong

IPC分类号： H01L33/10

CPC分类号： H01L27/156 ,  H01L33/06 ,  H01L33/10 ,  H01L33/145 ,  H01L33/32 ,  H01L33/40 ,  H01L33/46 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting structure includes lower and upper semiconductor layers having different conductive types, and an active layer disposed between the lower and upper semiconductor layers. The light emitting structure is provided on the substrate. A first electrode layer provided on the upper semiconductor layer includes a first adhesive layer and a first bonding layer overlapping each other. A reflective layer is not provided between the first adhesive layer and the first bonding layer.

摘要翻译： 发光结构包括具有不同导电类型的下半导体层和上半导体层，以及设置在下半导体层和上半导体层之间的有源层。 发光结构设置在基板上。 设置在上半导体层上的第一电极层包括彼此重叠的第一粘合层和第一粘合层。 在第一粘合剂层和第一粘合层之间不设置反射层。

公开(公告)号：US20140131657A1

公开(公告)日：2014-05-15

申请号：US14072070

申请日：2013-11-05

申请人： Sung Kyoon KIM ,  Hee Young BEOM ,  Hyun Seoung JU ,  Byung Yeon CHOI

发明人： Sung Kyoon KIM ,  Hee Young BEOM ,  Hyun Seoung JU ,  Byung Yeon CHOI

IPC分类号： H01L33/38 ,  H01L33/06

CPC分类号： H01L33/38 ,  H01L27/156 ,  H01L33/06 ,  H01L33/20 ,  H01L33/385 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A light emitting device includes a substrate, a plurality of light emitting cells separated from each other and disposed on the substrate, and a plurality of conductive interconnection layers electrically connecting two neighboring light emitting cells. Each light emitting cell includes a light emitting structure including a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, a first electrode, a second electrode, and an etching area. The light emitting structure further includes a first side surface and a second side surface, and if a width between the first side surface and the second side surface is defined as W, the second electrode is disposed in an area between a position separated from the first side surface by ⅕ W and a position separated from the first side surface of the light emitting structure by ½ W.

摘要翻译： 发光器件包括基板，彼此分离并设置在基板上的多个发光单元以及电连接两个相邻的发光单元的多个导电互连层。 每个发光单元包括包括第一导电型半导体层，有源层和第二导电类型半导体层，第一电极，第二电极和蚀刻区域的发光结构。 发光结构还包括第一侧表面和第二侧表面，并且如果第一侧表面和第二侧表面之间的宽度被限定为W，则第二电极设置在与第一侧表面和第二侧表面之间分离的位置之间的区域中 侧面由⅕W和从发光结构的第一侧面分开的位置½W。