Stretchable 3D Printed Circuits
    3.
    发明公开

    公开(公告)号:US20240114626A1

    公开(公告)日:2024-04-04

    申请号:US18539899

    申请日:2023-12-14

    CPC classification number: H05K3/0064 H05K1/0393 H05K3/40

    Abstract: Disclosed herein are devices comprising stretchable 3D circuits and methods for fabricating the circuits. The fabrication process includes providing in the elastomeric polymer as a substrate and providing conductive interconnects within the substrate encased in an insulating polymer, such as polyimide, to provide a stiffness gradient between the conductive interconnects and the flexible elastomeric substrate. The circuit may be fabricated as a multilayer construction using three-dimensional pillars as vias and as external interconnects to the circuit.

Patent Agency Ranking