公开(公告)号：US20200023559A1

公开(公告)日：2020-01-23

申请号：US16509413

申请日：2019-07-11

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Hideki TAKAHASHI

IPC: B29C35/08 ,  B32B7/06 ,  B32B5/02 ,  B32B7/12 ,  B32B27/12 ,  B32B5/18 ,  B32B5/24

Abstract: A shaped object production method includes a first preparation step (S30) of preparing a molding sheet that includes a base, a thermally expansive layer laminated on a first main surface of the base, the thermally expansive layer including a thermally expandable material, and a brushed layer laminated on a surface of the thermally expansive layer on a side that is opposite to the base, the brushed layer including fiber; a first heat conversion layer laminating step (S40) of laminating a heat conversion layer that converts electromagnetic waves into heat onto a surface of the molding sheet on a side that is opposite to the brushed layer; and a first unevenness forming step (S50) of forming an unevenness on the surface of the thermally expansive layer on the side that is opposite to the base by irradiating the heat conversion layer with electromagnetic waves, thereby causing the thermally expandable material to expand.

公开(公告)号：US20190283285A1

公开(公告)日：2019-09-19

申请号：US16278165

申请日：2019-02-17

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Yoshimune MOTOYANAGI ,  Yuji HORIUCHI ,  Hideki TAKAHASHI ,  Satoshi MITSUI

IPC: B29C44/34 ,  B29C44/06 ,  B41M5/395 ,  B41M5/382 ,  B41M7/00

Abstract: A thermally expandable sheet according to the present invention includes a stress buffer layer provided on one surface of a base material and having an elastic property, a thermal expansion layer provided on the stress buffer layer and containing a first thermally expandable material that expands according to heat and a first binder, and a cover layer provided on the thermal expansion layer and having an elastic property.

公开(公告)号：US20190030943A1

公开(公告)日：2019-01-31

申请号：US15993801

申请日：2018-05-31

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Yuji HORIUCHI ,  Yoshimune MOTOYANAGI ,  Satoshi MITSUI ,  Hideki TAKAHASHI

IPC: B44C1/17 ,  B41M1/30 ,  B29C44/02 ,  B41M7/00

Abstract: A three-dimensionally shaped object forming sheet includes: a thermally expansive layer distending at a predetermined temperature or higher; a base laminated on one side thereof with the thermally expansive layer; and a photothermal conversion layer for converting absorbed light to heat, formed on at least one side, wherein the base includes a first base and a second base that are laminated; and the first base has an elasticity that is greater than an elasticity of the second base.

公开(公告)号：US20200331177A1

公开(公告)日：2020-10-22

申请号：US16958263

申请日：2018-12-20

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Hideki TAKAHASHI ,  Yuji HORIUCHI ,  Yoshimune MOTOYANAGI ,  Satoshi MITSUI

IPC: B29C44/24 ,  B29C59/02 ,  B32B3/28 ,  B32B5/18 ,  B29C35/08

Abstract: A formable resin sheet includes a base and a thermally expansive layer that contains a thermally expandable material and is formed on one surface of the base. When the thermally expansive layer is expanded, the base is deformed with expansion of the thermally expansive layer, such that the base is deformed in an embossed shape, and a deformation amount of the base is greater than an expansion height of the thermally expansive layer.

公开(公告)号：US20200070469A1

公开(公告)日：2020-03-05

申请号：US16552438

申请日：2019-08-27

Applicant: Casio Computer Co., Ltd.

Inventor： Hideki TAKAHASHI

IPC: B32B5/20 ,  B32B27/06 ,  B32B38/00

Abstract: A thermally expandable sheet includes a base and a first thermally expansive layer provided on at least a first side of the base and containing a first binder, a first thermally expandable material, and a first electromagnetic wave heat conversion material that converts electromagnetic waves into heat.

公开(公告)号：US20200047459A1

公开(公告)日：2020-02-13

申请号：US16530146

申请日：2019-08-02

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Hideki TAKAHASHI

IPC: B32B7/027 ,  B32B27/08 ,  B32B5/18 ,  B32B27/06 ,  B29C35/08 ,  B32B27/36

Abstract: A resin molded sheet includes: a base material made of resin; a first thermal expansion layer including a thermally expandable material and provided on a first surface of the base material; and a second thermal expansion layer including a thermally expandable material and provided on a second surface of the base material, wherein the first thermal expansion layer is provided at least on a first region, where the base material is deformed by the first thermal expansion layer, on the first surface of the base material, and the second thermal expansion layer is provided at least in a second region, where the base material is deformed by the second thermal expansion layer, on the second surface of the base material.

公开(公告)号：US20190291313A1

公开(公告)日：2019-09-26

申请号：US16297894

申请日：2019-03-11

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Hideki TAKAHASHI ,  Yuji HORIUCHI ,  Yoshimune MOTOYANAGI ,  Satoshi MITSUI

IPC: B29C44/34 ,  B41M5/00 ,  B41M7/00 ,  B29C44/02 ,  B29C44/04 ,  C09D11/322 ,  C09D11/38 ,  C09D11/36 ,  C09D11/037 ,  C09D11/101 ,  C09D11/033

Abstract: An ink is used for forming a photothermal conversion layer used for causing expansion of at least a portion of a thermal expansion layer of a thermally-expandable sheet. The ink includes an inorganic infrared absorbing agent having a higher absorptivity in at least one region of an infrared light spectrum than in a visible light spectrum. A base of the ink is white.

公开(公告)号：US20180272664A1

公开(公告)日：2018-09-27

申请号：US15898287

申请日：2018-02-16

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Yuji HORIUCHI ,  Yoshimune MOTOYANAGI ,  Hideki TAKAHASHI ,  Satoshi MITSUI

IPC: B32B27/06 ,  B32B7/02 ,  B32B5/18 ,  B32B27/32

CPC classification number: B32B27/065 ,  B32B5/18 ,  B32B7/02 ,  B32B27/32 ,  B32B2305/022 ,  B32B2307/75

Abstract: A thermally expandable sheet in which a thermally expansive layer that contains a thermally expandable material is formed on one side of a base, and wherethe thermally expansive layer is distended, the base deforms following distension of the thermally expansive layer and the base deforms into an embossed shape.

公开(公告)号：US20210402714A1

公开(公告)日：2021-12-30

申请号：US17469695

申请日：2021-09-08

Applicant: Casio Computer Co., Ltd.

Inventor： Hideki TAKAHASHI

IPC: B29C65/00 ,  B32B7/12 ,  B32B27/08 ,  B29C33/02

Abstract: A formable resin sheet includes a base, a thermally expansive layer provided on a first side of the base and containing a thermally expandable material, a thermal conversion layer containing an electromagnetic wave heat conversion material that converts electromagnetic waves to heat and provided on one of the thermally expansive layer and a second side of the base, and an electrically conductive layer that is electrically conductive and is provided on another one of the thermally expansive layer and the second side of the base. At least a portion of the electrically conductive layer is provided so as to be opposite at least a portion of the thermal conversion layer, with the base and the thermally expansive layer interposed therebetween.

公开(公告)号：US20210197614A1

公开(公告)日：2021-07-01

申请号：US17141826

申请日：2021-01-05

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Yuji HORIUCHI ,  Yoshimune MOTOYANAGI ,  Satoshi MITSUI ,  Hideki TAKAHASHI

IPC: B44C1/17 ,  B32B1/00 ,  B32B27/08 ,  B32B7/02 ,  B32B27/24 ,  B32B27/30 ,  B32B7/06 ,  B32B27/32 ,  B32B27/10 ,  B32B27/36 ,  B32B27/40 ,  B32B7/12 ,  B29C44/02 ,  B41M1/30 ,  B41M7/00

Abstract: A three-dimensionally shaped object forming sheet includes: a thermally expansive layer distending at a predetermined temperature or higher; a base laminated on one side thereof with the thermally expansive layer; and a photothermal conversion layer for converting absorbed light to heat, formed on at least one side, wherein the base includes a first base and a second base that are laminated; and the first base has an elasticity that is greater than an elasticity of the second base.