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    LIGHT-MIXING MULTICHIP PACKAGE STRUCTURE
    1.
    发明申请
    LIGHT-MIXING MULTICHIP PACKAGE STRUCTURE 有权
    光混合多媒体包装结构

    公开(公告)号：US20120187865A1

    公开(公告)日：2012-07-26

    申请号：US13069276

    申请日：2011-03-22

    申请人： CHIA-TIN CHUNG ,  Shih-Neng Dai ,  Chao-Chin Wu

    发明人： CHIA-TIN CHUNG ,  Shih-Neng Dai ,  Chao-Chin Wu

    IPC分类号： H05B37/02 ,  F21V9/16

    CPC分类号： H05B33/0827 ,  F21K9/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit includes at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame respectively surrounding the first light-emitting module and the second light-emitting module. The package unit includes a transparent colloid body and a phosphor colloid body respectively covering the first light-emitting module and the second light-emitting module. Hence, when the red light source generated by matching the red light-emitting chips and the transparent colloid body and the white light source generated by matching the blue light-emitting chips and the phosphor colloid body are mixed with each other, the CRI of the light-mixing multichip package structure can be increased.

    摘要翻译： 光混合多芯片封装结构包括基板单元，发光单元，框架单元和封装单元。 发光单元包括具有红色发光芯片的至少一个第一发光模块和具有蓝色发光芯片的至少一个第二发光模块。 框架单元包括分别围绕第一发光模块和第二发光模块的至少一个第一连续胶体框架和至少一个第二连续胶体框架。 封装单元包括分别覆盖第一发光模块和第二发光模块的透明胶体和荧光体胶体。 因此，当通过使红色发光芯片和透明胶体体匹配的红色光源与通过匹配蓝色发光芯片和荧光体胶体而产生的白色光源相互混合时，CRI 可以增加光混合多芯片封装结构。

    LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND CONTROLLING LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND CONTROLLING LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME 有权
    用于增加发光效率和控制投光角度的LED封装结构及其制造方法

    公开(公告)号：US20100327294A1

    公开(公告)日：2010-12-30

    申请号：US12550699

    申请日：2009-08-31

    申请人： CHIA-TIN CHUNG ,  CHAO-CHIN WU ,  FANG-KUEI WU

    发明人： CHIA-TIN CHUNG ,  CHAO-CHIN WU ,  FANG-KUEI WU

    IPC分类号： H01L33/00 ,  H01L21/50

    CPC分类号： H01L25/0753 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space.

    摘要翻译： 用于提高发光效率和控制投光角度的LED封装结构包括基板单元，发光单元，光反射单元和封装单元。 基板单元具有设置在基板主体的上表面上的基板主体和芯片放置区域。 发光单元具有多个LED芯片，电芯设置在芯片放置区域上。 光反射单元具有通过涂覆在基板主体的上表面上周围形成的环状的反射树脂体。 环状反射树脂体围绕设置在芯片放置区域上的LED芯片，以在芯片放置区域上方形成树脂位置限制空间。 封装单元具有设置在基板主体的顶表面上的半透明封装树脂体，以覆盖LED芯片。 半透明封装树脂体的位置限制在树脂位置限制空间中。

    LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND CONTROLLING LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME
    4.
    发明申请
    LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND CONTROLLING LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME 有权
    用于增加发光效率和控制投光角度的LED封装结构及其制造方法

    公开(公告)号：US20110241035A1

    公开(公告)日：2011-10-06

    申请号：US13160679

    申请日：2011-06-15

    申请人： CHIA-TIN CHUNG ,  Chao-Chin Wu ,  Fang-Kuei Wu

    发明人： CHIA-TIN CHUNG ,  Chao-Chin Wu ,  Fang-Kuei Wu

    IPC分类号： H01L27/15

    CPC分类号： H01L25/0753 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space.

    摘要翻译： 用于提高发光效率和控制投光角度的LED封装结构包括基板单元，发光单元，光反射单元和封装单元。 基板单元具有设置在基板主体的上表面上的基板主体和芯片放置区域。 发光单元具有多个LED芯片，电芯设置在芯片放置区域上。 光反射单元具有通过涂覆在基板主体的上表面上周围形成的环状的反射树脂体。 环状反射树脂体围绕设置在芯片放置区域上的LED芯片，以在芯片放置区域上方形成树脂位置限制空间。 封装单元具有设置在基板主体的顶表面上的半透明封装树脂体，以覆盖LED芯片。 半透明封装树脂体的位置限制在树脂位置限制空间中。

    ILLUMINATING APPARATUS AND METHOD THEREOF
    6.
    发明申请
    ILLUMINATING APPARATUS AND METHOD THEREOF 有权
    照明装置及其方法

    公开(公告)号：US20130015773A1

    公开(公告)日：2013-01-17

    申请号：US13182413

    申请日：2011-07-13

    申请人： SHIH-NENG TAI ,  CHIA-TIN CHUNG

    发明人： SHIH-NENG TAI ,  CHIA-TIN CHUNG

    IPC分类号： H05B37/02 ,  H05B37/00

    CPC分类号： H05B33/0827 ,  H05B33/083

    摘要： An illuminating apparatus adapted to receive an input power which is a pulse DC includes a lighting unit, a detecting unit and a controlling unit. The lighting unit includes a plurality of lighting sets and a switching unit. The switching unit may be used to cause the lighting sets interconnected in a serial fashion and/or in a parallel manner. The detecting unit detects a state of the input power. The control unit couples the detecting unit and the lighting unit, and controls the switching unit according to the detecting unit detecting the state of the input power. As such, the turn-on voltages of the lighting unit may adjust at different stages of the input power.

    摘要翻译： 适于接收作为脉冲DC的输入功率的照明装置包括照明单元，检测单元和控制单元。 照明单元包括多个照明组和切换单元。 开关单元可以用于使得以串联方式和/或并行方式互连的照明组。 检测单元检测输入功率的状态。 控制单元耦合检测单元和照明单元，并且根据检测单元检测输入功率的状态来控制切换单元。 因此，照明单元的导通电压可以在输入功率的不同阶段进行调整。

    ILLUMINATING APPARATUS CAPABLE OF MINIMIZING OCCURRENCE OF FLICKS AND METHOD USING THE SAME
    7.
    发明申请
    ILLUMINATING APPARATUS CAPABLE OF MINIMIZING OCCURRENCE OF FLICKS AND METHOD USING THE SAME 审中-公开
    能够最小化闪光发光的照明装置和使用其的方法

    公开(公告)号：US20130106290A1

    公开(公告)日：2013-05-02

    申请号：US13286317

    申请日：2011-11-01

    申请人： CHIA-TIN CHUNG ,  SHIH-NENG TAI

    发明人： CHIA-TIN CHUNG ,  SHIH-NENG TAI

    IPC分类号： H05B37/02

    CPC分类号： H05B33/083 ,  H05B33/0845

    摘要： An illuminating apparatus is disclosed. The illuminating apparatus includes a detecting unit, an illuminating unit, and a control unit. The illuminating unit includes multiple illuminating sets and a switching unit for adjusting a connection relationship among the illuminating sets to ensure a conducting voltage of the illuminating set to swing between a minimum conducting voltage and a maximum conducting voltage. The detecting unit is for detecting an inputted power source received by the illuminating unit. The control unit based on a detected inputted power source controls an operation of the switching unit for extending a conducting time in a single period of the inputted power source.

    摘要翻译： 公开了一种照明装置。 照明装置包括检测单元，照明单元和控制单元。 照明单元包括多个照明组和用于调节照明组之间的连接关系的切换单元，以确保照明组的导通电压在最小传导电压和最大导通电压之间摆动。 检测单元用于检测由照明单元接收的输入电源。 基于检测到的输入电源的控制单元控制用于在输入的电源的单个周期中延长导通时间的开关单元的操作。

    LED LAMP CONSTRUCTION WITH INTEGRAL APPEARANCE
    9.
    发明申请
    LED LAMP CONSTRUCTION WITH INTEGRAL APPEARANCE 审中-公开
    LED灯具结构整体外观

    公开(公告)号：US20110044039A1

    公开(公告)日：2011-02-24

    申请号：US12622619

    申请日：2009-11-20

    申请人： CHIA-TIN CHUNG ,  Hsin-Yuan Peng

    发明人： CHIA-TIN CHUNG ,  Hsin-Yuan Peng

    IPC分类号： F21V7/00 ,  F21V19/00 ,  F21V29/00

    CPC分类号： F21V29/83 ,  F21K9/233 ,  F21V19/001 ,  F21V23/002 ,  F21V29/507 ,  F21V29/74 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/00014

    摘要： An LED lamp construction with integral appearance includes an outer shell unit, a conductive retaining unit, a light-emitting module, a circuit unit and a heat-dissipating unit. The outer shell unit has an integral shell body and a receiving space formed in the shell body. The conductive retaining unit is disposed on a bottom side of the shell body. The light-emitting module is disposed on a top side of the shell body. The circuit unit is received in the receiving space and electrically connected between the light-emitting module and the conductive retaining unit. The heat-dissipating unit is disposed on a bottom side of the light-emitting module. Hence, the manufacturing cost is decreased and the manufacturing method is simple in the present invention due to the integral appearance of the present invention.

    摘要翻译： 具有整体外观的LED灯构造包括外壳单元，导电保持单元，发光模块，电路单元和散热单元。 外壳单元具有整体壳体和形成在壳体中的容纳空间。 导电保持单元设置在壳体的底侧。 发光模块设置在壳体的上侧。 电路单元被容纳在接收空间中并且电连接在发光模块和导电保持单元之间。 散热单元设置在发光模块的底侧。 因此，由于本发明的整体外观，本发明的制造成本降低，制造方法简单。

    LIGHT-MIXING MULTICHIP PACKAGE STRUCTURE
    10.
    发明申请
    LIGHT-MIXING MULTICHIP PACKAGE STRUCTURE 有权
    光混合多媒体包装结构

    公开(公告)号：US20130181601A1

    公开(公告)日：2013-07-18

    申请号：US13350968

    申请日：2012-01-16

    申请人： CHIA-TIN CHUNG ,  SHIH-NENG TAI

    发明人： CHIA-TIN CHUNG ,  SHIH-NENG TAI

    IPC分类号： H01J1/63

    CPC分类号： H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a package unit, and a frame unit. The substrate unit includes a substrate body. The light-emitting unit includes a plurality of first and second light-emitting groups. The first and the second light-emitting groups are disposed on the substrate body and electrically connected to the substrate body in series. Each first light-emitting group includes a plurality of first parallel connection units electrically connected in parallel, and each first parallel connection unit includes at least one blue LED chip, and each second light-emitting group includes at least one red LED chip. The package unit includes a phosphor resin body disposed on the substrate body to cover the first and the second light-emitting groups. The frame unit includes a surrounding light-reflecting frame surrounding the first and the second light-emitting groups and the phosphor resin body.

    摘要翻译： 光混合多芯片封装结构包括基板单元，发光单元，封装单元和框架单元。 基板单元包括基板主体。 发光单元包括多个第一和第二发光组。 第一和第二发光组被布置在基板主体上并串联地电连接到基板主体。 每个第一发光组包括并联电连接的多个第一并联单元，并且每个第一并联单元包括至少一个蓝色LED芯片，并且每个第二发光组包括至少一个红色LED芯片。 封装单元包括设置在基板主体上以覆盖第一和第二发光组的荧光体树脂体。 框架单元包括围绕第一和第二发光组和荧光体树脂体的周围光反射框架。