公开(公告)号：US20230326896A1

公开(公告)日：2023-10-12

申请号：US18108733

申请日：2023-02-13

申请人： CHIPBOND TECHNOLOGY CORPORATION

发明人： Sheng-Jen Wu ,  Shih-Chung Chang ,  Hsueh-Shun Yeh ,  Chun-Te Lee

IPC分类号： H01L23/00

CPC分类号： H01L24/26 ,  H01L24/32 ,  H01L24/29 ,  H01L24/05 ,  H01L2224/26125 ,  H01L2224/04026 ,  H01L2224/05558 ,  H01L2224/05573 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2924/0132 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05644 ,  H01L2224/05672 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29109 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29017 ,  H01L2224/29019 ,  H01L2224/29034 ,  H01L2224/32225

摘要： A COF package includes a substrate and a chip, composite bumps on the chip are bonded to leads on the substrate. Each of the composite bumps includes a raising strip, a UBM layer and a bonding layer. A bonding rib is formed on the bonding layer because of the raising strip and the UBM layer, and the bonding rib on each of the composite bumps can be inserted into each of the leads and surface-contact with each of the leads to increase weld length and bonding strength between the bonding layer and the leads and further reduce a force required for bonding the chip to the substrate in a flip-chip bonding process.

公开(公告)号：US20230102718A1

公开(公告)日：2023-03-30

申请号：US17860224

申请日：2022-07-08

申请人： CHIPBOND TECHNOLOGY CORPORATION

发明人： Hsueh-Shun Yeh

IPC分类号： G03F7/42 ,  G03F7/11

摘要： A method of stripping photoresist includes the steps of pattering a photoresist located on a substrate to generate an opening showing the substrate, forming a film including a first portion located on a top surface of the photoresist and a second portion located on a surface of the substrate, attaching a tape on the first portion, removing the tape and the first portion to show the top surface of the photoresist, and contacting the top surface and a lateral surface of the photoresist with a photoresist stripping solution to strip the photoresist. The photoresist can be removed completely by increasing its contacting area with the photoresist stripping solution.

公开(公告)号：US20230326894A1

公开(公告)日：2023-10-12

申请号：US18078170

申请日：2022-12-09

申请人： CHIPBOND TECHNOLOGY CORPORATION

发明人： Fei-Jain Wu ,  Sheng-Jen Wu ,  Hsueh-Shun Yeh

IPC分类号： H01L23/00 ,  H01L21/56

CPC分类号： H01L24/13 ,  H01L2224/05573 ,  H01L24/16 ,  H01L24/32 ,  H01L24/83 ,  H01L24/81 ,  H01L24/05 ,  H01L21/563 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/3011 ,  H01L2224/32225 ,  H01L2224/81201 ,  H01L2224/83201 ,  H01L2224/13007 ,  H01L2224/13019 ,  H01L2224/1319 ,  H01L2224/13541 ,  H01L2224/13553 ,  H01L2224/13562 ,  H01L2224/13582 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L24/73

摘要： In a bonding process of a flip chip bonding method, a chip is bonded to contact pads of a substrate by composite bumps which each includes a raiser, a UBM layer and a bonding layer. Before the bonding process, the surface of the bonding layer facing toward the substrate is referred to as a surface to be bonded. During the bonding process, the surface to be bonded is boned to the contact pad and become a bonding surface on the contact pad. The bonding surface has an area greater than that of the surface to be bonded so as to reduce electrical impedance between the chip and the substrate.