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    Structures and fabrication techniques for solid state electrochemical devices
    3.
    发明授权
    Structures and fabrication techniques for solid state electrochemical devices 失效
    固态电化学装置的结构和制造技术

    公开(公告)号：US07118777B2

    公开(公告)日：2006-10-10

    申请号：US11260009

    申请日：2005-10-26

    申请人： Steven J. Visco ,  Craig P. Jacobson ,  Lutgard C. DeJonghe

    发明人： Steven J. Visco ,  Craig P. Jacobson ,  Lutgard C. DeJonghe

    IPC分类号： B05D5/12

    CPC分类号： H01M4/8885 ,  B01D53/326 ,  B01D2257/108 ,  C25B9/00 ,  H01M4/9025 ,  H01M4/9033 ,  H01M4/905 ,  H01M4/9066 ,  H01M8/004 ,  H01M8/1213 ,  H01M8/1226 ,  H01M8/1231 ,  H01M8/1246 ,  H01M8/1253 ,  H01M8/126 ,  H01M8/1266 ,  H01M8/2425 ,  H01M8/243 ,  H01M8/2483 ,  H01M2008/1293 ,  H01M2300/0074 ,  Y02E60/525 ,  Y02P70/56 ,  Y10T29/49115

    摘要： Low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures provide solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one aspect the invention provides techniques for co-firing of device substrate (often an electrode) with an electrolyte or membrane layer to form densified electrolyte/membrane films 5 to 20 microns thick. In another aspect, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. In some cases, the substrate may be a porous metal, alloy, or non-nickel cermet incorporating one or more of the transition metals Cr, Fe and Cu, or alloys thereof.

    摘要翻译： 用于固态电化学装置的低成本，机械强度高的高电子导电多孔基材和相关结构，用于形成这些结构的技术以及结合该结构的装置提供用于形成薄电极/膜的新型组成和技术的固态电化学装置基板 /新颖或更传统的基底上的电解质涂层。 特别地，在一个方面，本发明提供了用于与电解质或膜层共同烧制器件基底（通常为电极）以形成5至20微米厚的致密化电解质/膜的技术。 在另一方面，通过约束烧结工艺可以在预烧结衬底上形成5至20微米厚的致密化电解质/膜膜。 在一些情况下，基底可以是包含一种或多种过渡金属Cr，Fe和Cu的多孔金属，合金或非镍金属陶瓷或其合金。

    Structures and fabrication techniques for solid state electrochemical devices
    4.
    发明授权
    Structures and fabrication techniques for solid state electrochemical devices 失效
    固态电化学装置的结构和制造技术

    公开(公告)号：US06605316B1

    公开(公告)日：2003-08-12

    申请号：US09626629

    申请日：2000-07-27

    申请人： Steven J. Visco ,  Craig P. Jacobson ,  Lutgard C. DeJonghe

    发明人： Steven J. Visco ,  Craig P. Jacobson ,  Lutgard C. DeJonghe

    IPC分类号： B05D512

    CPC分类号： H01M4/8885 ,  B01D53/326 ,  B01D2257/108 ,  C25B9/00 ,  H01M4/9025 ,  H01M4/9033 ,  H01M4/905 ,  H01M4/9066 ,  H01M8/004 ,  H01M8/1213 ,  H01M8/1226 ,  H01M8/1231 ,  H01M8/1246 ,  H01M8/1253 ,  H01M8/126 ,  H01M8/1266 ,  H01M8/2425 ,  H01M8/243 ,  H01M8/2483 ,  H01M2008/1293 ,  H01M2300/0074 ,  Y02E60/525 ,  Y02P70/56 ,  Y10T29/49115

    摘要： Provided are low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures. The invention provides solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one embodiment the invention provides techniques for co-firing of device substrate (often an electrode) with an electrolyte or membrane layer to form densified electrolyte/membrane films 5 to 20 microns thick. In another embodiment, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. In some cases, the substrate may be a porous metal, alloy, or non-nickel cermet incorporating one or more of the transition metals Cr, Fe, Cu and Ag, or alloys thereof.

    摘要翻译： 提供了低成本，机械强度高的电子导电多孔基底和用于固态电化学装置的相关结构，用于形成这些结构的技术以及结合该结构的装置。 本发明提供了用于在新颖或更传统的基底上形成薄电极/膜/电解质涂层的新型组成和技术的固态电化学装置基板。 特别地，在一个实施例中，本发明提供了用于通过电解质或膜层共同烧制器件衬底（通常为电极）以形成5至20微米厚的致密化电解质/膜膜的技术。 在另一个实施方案中，可以通过约束烧结工艺在预烧结衬底上形成5至20微米厚的致密化电解质/膜膜。 在一些情况下，衬底可以是掺入一种或多种过渡金属Cr，Fe，Cu和Ag的多孔金属，合金或非镍金属陶瓷，或其合金。

    Process for making dense thin films
    6.
    发明授权
    Process for making dense thin films 失效
    制造薄膜的工艺

    公开(公告)号：US06921557B2

    公开(公告)日：2005-07-26

    申请号：US10323137

    申请日：2002-12-18

    申请人： Craig P. Jacobson ,  Steven J. Visco ,  Lutgard C. DeJonghe

    发明人： Craig P. Jacobson ,  Steven J. Visco ,  Lutgard C. DeJonghe

    IPC分类号： B05D1/36 ,  B05D3/02 ,  H01M8/12

    CPC分类号： H01M8/1213 ,  H01M4/9066 ,  H01M8/1226 ,  H01M8/1246 ,  Y02E60/525 ,  Y02P70/56

    摘要： Provided are low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures. The invention provides solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one embodiment the invention provides techniques for firing of device substrate to form densified electrolyte/membrane films 5 to 20 microns thick. In another embodiment, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. In some cases, the substrate may be a porous metal, alloy, or non-nickel cermet incorporating one or more of the transition metals Cr, Fe, Cu and Ag, or alloys thereof.

    摘要翻译： 提供了低成本，机械强度高的电子导电多孔基底和用于固态电化学装置的相关结构，用于形成这些结构的技术以及结合该结构的装置。 本发明提供了用于在新颖或更传统的基底上形成薄电极/膜/电解质涂层的新型组成和技术的固态电化学装置基板。 特别地，在一个实施例中，本发明提供了用于烧制器件衬底以形成5至20微米厚的致密化电解质/膜膜的技术。 在另一个实施方案中，可以通过约束烧结工艺在预烧结衬底上形成5至20微米厚的致密化电解质/膜膜。 在一些情况下，基底可以是包含一种或多种过渡金属Cr，Fe，Cu和Ag的多孔金属，合金或非镍金属陶瓷，或其合金。

    Method of making a layered composite electrode/electrolyte
    7.
    发明授权
    Method of making a layered composite electrode/electrolyte 有权
    制备层状复合电极/电解质的方法

    公开(公告)号：US06846511B2

    公开(公告)日：2005-01-25

    申请号：US10724558

    申请日：2003-11-26

    申请人： Steven J. Visco ,  Craig P. Jacobson ,  Lutgard C. DeJonghe

    发明人： Steven J. Visco ,  Craig P. Jacobson ,  Lutgard C. DeJonghe

    IPC分类号： H01M4/86 ,  H01M4/88 ,  H01M8/12 ,  B05D5/12 ,  H01M6/00

    CPC分类号： H01M4/9066 ,  H01M4/8626 ,  H01M4/8885 ,  H01M8/1246 ,  H01M2004/8689 ,  H01M2008/1293 ,  Y02E60/525 ,  Y02P70/56 ,  Y10T29/49115

    摘要： An electrode/electrolyte structure is prepared by a plurality of methods. An unsintered (possibly bisque fired) moderately catalytic electronically-conductive or homogeneous mixed ionic electronic conductive electrode material is deposited on a layer composed of a sintered or unsintered ionically-conductive electrolyte material prior to being sintered. A layer of particulate electrode material is deposited on an unsintered (“green”) layer of electrolyte material and the electrode and electrolyte layers are sintered simultaneously, sometimes referred to as “co-firing,” under conditions suitable to fully densify the electrolyte while the electrode retains porosity. Or, the layer of particulate electrode material is deposited on a previously sintered layer of electrolyte, and then sintered. Subsequently, a catalytic material is added to the electrode structure by infiltration of an electrolcatalyst precursor (e.g., a metal salt such as a transition metal nitrate). This may be followed by low temperature firing to convert the precursor to catalyst. The invention allows for an electrode with high electronic conductivity and sufficient catalytic activity to achieve high power density in an ionic (electrochemical) device such as fuel cells and electrolytic gas separation systems.

    摘要翻译： 通过多种方法制备电极/电解质结构。 在烧结之前，在由烧结或未烧结的离子导电电解质材料构成的层上沉积未烧结（可能是烧结的）中等催化的电子导电或均匀混合的离子电子导电电极材料。 一层颗粒状电极材料沉积在电解质材料的未烧结（“绿色”）层上，电极和电解质层同时烧结，有时也被称为“共烧结”，在适合于使电解质完全致密化的条件下 电极保留孔隙度。 或者，将粒状电极材料层沉积在预先烧结的电解质层上，然后烧结。 随后，通过电催化剂前体（例如金属盐如过渡金属硝酸盐）的渗透将催化材料加入到电极结构中。 然后可以进行低温烧制，将前体转化为催化剂。 本发明允许具有高电子导电性和足够的催化活性的电极在诸如燃料电池和电解气体分离系统的离子（电化学）装置中实现高功率密度。