公开(公告)号：US20150236219A1

公开(公告)日：2015-08-20

申请号：US14705228

申请日：2015-05-06

Applicant: CREE, INC.

Inventor： BERND KELLER ,  Thomas Cheng-Hsin Yuan ,  Nicholas W. Medendorp, JR.

IPC: H01L33/48 ,  H01L33/58 ,  H01L33/64

CPC classification number: H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package comprising a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages comprising providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.

Abstract translation: 一种LED封装，包括具有在其顶表面上具有多个顶部导电和导热元件的顶表面和底表面的底座。 顶部元件之一中包括LED，使得施加到顶部元件的电信号使得LED发光。 导电元件还将散热的LED从跨越大多数的底座顶面传播。 底部导热元件包括在所述底座的底表面上并且从底座散热，并且在LED上直接形成透镜。 一种用于制造LED封装的方法，包括提供尺寸被分成多个LED封装底座的底座面板。 顶部导电元件形成在用于多个LED封装的基座面板的一个表面上，并且LED附接到顶部元件。 在LED上模制透镜，并且衬底面板被分割成多个LED封装。

公开(公告)号：US10892383B2

公开(公告)日：2021-01-12

申请号：US14705228

申请日：2015-05-06

Applicant: CREE, INC.

Inventor： Bernd Keller ,  Thomas Cheng-Hsin Yuan ,  Nicholas W Medendorp, Jr.

IPC: H01L33/48 ,  H01L33/64 ,  H01L33/62 ,  H01L33/58 ,  H01L33/54

Abstract: An LED package comprising a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages comprising providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.