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公开(公告)号：US10822702B2
公开(公告)日：2020-11-03
申请号：US15336836
申请日：2016-10-28
发明人： Björn Atthoff , Sven Göthe
IPC分类号： C23C18/18 , C23C18/20 , C23C18/16 , C23C18/30 , B05D1/28 , B05D3/06 , C23C18/40 , C25D3/38 , C25D5/10 , C25D5/54 , H05K3/38 , H05K3/12 , H05K3/18
摘要： A method for application of a metal on a substrate comprises a) contacting at least a part of the surface of the substrate with at least one initiator, and polymerizable units with the ability to undergo a chemical reaction to form a polymer, the polymer comprising at least one charged group, wherein the contacting is achieved by contacting a pad with a plate comprising the at least one initiator and the polymerizable units and subsequently contacting the pad with the surface of the substrate, thereby transferring the at least one initiator and the polymerizable units to the surface of the substrate. Subsequently a metal layer is produced on the surface. The compactness of the applied metal layer is increased.
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公开(公告)号：US09889471B2
公开(公告)日：2018-02-13
申请号：US14533126
申请日：2014-11-05
发明人： Sven Göthe , Björn Atthoff
CPC分类号： B05D7/548 , B05D3/06 , B05D5/00 , C08J7/045 , C08J2355/02 , C08J2369/00 , C08J2433/02 , C23C18/1608 , C23C18/1612 , C23C18/182 , C23C18/1844 , C23C18/1868 , C23C18/1882 , C23C18/2006 , C23C18/204 , C23C18/2086 , C23C18/30 , Y10T428/24355
摘要： A process for application of metal on a substrate surface comprises applying a mixture of a solvent, a polymerizable monomer, and a photoinitiator on a substrate surface, wherein the photoinitiator does not form two phases together with the monomer and the solvent, i.e. it forms an amorphous mixture without any crystals. The monomer is able to polymerize to a polymer comprising at least one carboxylic group. Thereafter the solvent is evaporated. Polymerization is induced by irradiating the applied dried mixture. Ions are applied and reduced to metal and thereafter further metal can be deposited. The method can be used in industrial processes, both 2D and 3D surfaces can be coated with metal. Materials sensitive to standard grafting chemicals and/or polymers containing halogen atoms can be coated.
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公开(公告)号：US10774424B2
公开(公告)日：2020-09-15
申请号：US15336839
申请日：2016-10-28
发明人： Björn Atthoff , Sven Göthe
摘要： A method of metallizing substrate with abstractable hydrogen atoms and/or unsaturations on the surface, comprising the steps: a) contacting the substrate with a polymerizable unit, at least one initiator which can be activated by both heat and actinic radiation, and optionally at least one solvent, b) inducing a polymerization reaction c) depositing a second metal on an already applied first metal to obtain a metal coating. A first metal is added as ions and/or small metal particles during the process. Ions are reduced to the first metal. Advantages include that the adhesion is improved, the process time is shortened, blisters in the metal coating are avoided, the polymer layer below the metal coating becomes less prone to swelling for instance in contact with water.
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公开(公告)号：US20170044670A1
公开(公告)日：2017-02-16
申请号：US15336839
申请日：2016-10-28
发明人： Björn Atthoff , Sven Göthe
摘要： A method of metallizing substrate with abstractable hydrogen atoms and/or unsaturations on the surface, comprising the steps: a) contacting the substrate with a polymerizable unit, at least one initiator which can be activated by both heat and actinic radiation, and optionally at least one solvent, b) inducing a polymerization reaction c) depositing a second metal on an already applied first metal to obtain a metal coating. A first metal is added as ions and/or small metal particles during the process. Ions are reduced to the first metal. Advantages include that the adhesion is improved, the process time is shortened, blisters in the metal coating are avoided, the polymer layer below the metal coating becomes less prone to swelling for instance in contact with water.
摘要翻译： 一种在表面上具有可抽取的氢原子和/或不饱和基团金属化衬底的方法，包括以下步骤：a）使所述衬底与可聚合单元接触，所述至少一种引发剂可以通过热和光化辐射二者被激活， 一种溶剂，b）引发聚合反应c）在已经施加的第一金属上沉积第二种金属以获得金属涂层。 在该过程中，作为离子和/或小金属颗粒添加第一金属。 离子被还原成第一金属。 优点包括提高粘合性，缩短处理时间，避免金属涂层中的水泡，金属涂层以下的聚合物层变得不容易膨胀，例如与水接触。
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