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公开(公告)号：US20190211228A1
公开(公告)日：2019-07-11
申请号：US15866008
申请日：2018-01-09
发明人： William J. Ward , Matthew E. Carnes , Ji Cui , Kim Long
IPC分类号： C09G1/02 , C09K3/14 , H01L21/321
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1436 , H01L21/3212
摘要： The invention provides a method of chemically-mechanically polishing a substrate comprising providing a substrate comprising a tungsten layer on a surface of the substrate and a silicon oxide layer on a surface of the substrate, providing a chemical-mechanical polishing composition comprising a tungsten layer and a silicon oxide layer using a chemical-mechanical polishing composition comprising a) surface-modified colloidal silica particles, comprising a negatively-charged group on the surface of the particles, wherein the surface-modified colloidal silica particles have a negative charge, a particle size of about 90 nm to about 350 nm, and a zeta potential of about −20 mV to about −70 mV at a pH of about 2, b) an iron compound, c) a stabilizing agent, and d) an aqueous carrier, and contacting the substrate with a polishing pad and the chemical mechanical polishing composition to polish the substrate.
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公开(公告)号：US11597854B2
公开(公告)日：2023-03-07
申请号：US16513404
申请日：2019-07-16
发明人： William J. Ward , Matthew E. Carnes , Ji Cui , Helin Huang
IPC分类号： C09G1/02 , C08K3/22 , C09K13/00 , C23F1/26 , H01L21/306 , C23F3/06 , C08L39/00 , C08K9/00 , C08K3/36 , C08K3/28 , H01L21/321
摘要： The invention relates to a chemical-mechanical polishing composition comprising (a) a first abrasive comprising cationically modified colloidal silica particles, (b) a second abrasive having a Mohs hardness of about 5.5 or more, (c) a cationic polymer, (d) an iron containing activator, (e) an oxidizing agent, and (f) water. The invention also relates to a method of chemically mechanically polishing a substrate, especially a substrate comprising tungsten and barrier layers (e.g., nitrides), with the polishing composition.
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