Abstract:
An EUV collector serves for use in an EUV projection exposure apparatus. The collector guides EUV used light emitted by a plasma source region. An overall impingement surface of the collector is impinged upon by radiation emitted by the plasma source region. A used light portion of the overall impingement surface guides the EUV used light. An extraneous light portion of the overall impingement surface is impinged upon by extraneous light radiation, the wavelength of which differs from that of the used light. The used light portion and the extraneous light portion are not congruent. This EUV collector has increased efficiency can involve reduced production costs.
Abstract:
A projection objective for microlithography is used for imaging an object field in an object plane into an image field in an image plane. The projection objective comprises at least six mirrors of which at least one mirror has a freeform reflecting surface. The ratio between an overall length (T) of the projection objective and an object image shift (dOIS) can be smaller than 12. The image plane is the first field plane of the projection objective downstream of the object plane. The projection objective can have a plurality of mirrors, wherein the ratio between an overall length (T) and an object image shift (dOIS) is smaller than 2.
Abstract:
An EUV collector serves for use in an EUV projection exposure apparatus. The collector guides EUV used light emitted by a plasma source region. An overall impingement surface of the collector is impinged upon by radiation emitted by the plasma source region. A used light portion of the overall impingement surface guides the EUV used light. An extraneous light portion of the overall impingement surface is impinged upon by extraneous light radiation, the wavelength of which differs from that of the used light. The used light portion and the extraneous light portion are not congruent. This EUV collector has increased efficiency can involve reduced production costs.
Abstract:
A projection objective of a microlithographic projection exposure apparatus includes a wavefront correction device including a refractive optical element that has two opposite optical surfaces, through which projection light passes, and a circumferential rim surface extending between the two optical surfaces. A first and a second optical system are configured to direct first and second heating light to different portions of the rim surface such that at least a portion of the first and second heating light enters the refractive optical element. A temperature distribution caused by a partial absorption of the heating light results in a refractive index distribution inside the refractive optical element that corrects a wavefront error. At least the first optical system includes a focusing optical element that focuses the first heating light in a focal area such that the first heating light emerging from the focal area impinges on the rim surface.
Abstract:
An imaging optical system includes a plurality of mirrors configured to image an object field in an object plane of the imaging optical system into an image field in an image plane of the imaging optical system. An illumination system includes such an imaging optical system. The transmission losses of the illumination system are relatively low.
Abstract:
A projection objective for microlithography is used for imaging an object field in an object plane into an image field in an image plane. The projection objective comprises at least six mirrors of which at least one mirror has a freeform reflecting surface. The ratio between an overall length (T) of the projection objective and an object image shift (dOIS) can be smaller than 12. The image plane is the first field plane of the projection objective downstream of the object plane. The projection objective can have a plurality of mirrors, wherein the ratio between an overall length (T) and an object image shift (dOIS) is smaller than 2.
Abstract:
An imaging optical system includes a plurality of mirrors configured to image an object field in an object plane of the imaging optical system into an image field in an image plane of the imaging optical system. An illumination system includes such an imaging optical system. The transmission losses of the illumination system are relatively low.
Abstract:
A projection objective of a microlithographic projection exposure apparatus comprises a wavefront correction device comprising a refractive optical element that has two opposite optical surfaces, through which projection light passes, and a circumferential rim surface extending between the two optical surfaces. A first and a second optical system are configured to direct first and second heating light to different portions of the rim surface such that at least a portion of the first and second heating light enters the refractive optical element. A temperature distribution caused by a partial absorption of the heating light results in a refractive index distribution inside the refractive optical element that corrects a wavefront error. At least the first optical system comprises a focusing optical element that focuses the first heating light in a focal area such that the first heating light emerging from the focal area impinges on the rim surface.