EUV collector for use in an EUV projection exposure apparatus

    公开(公告)号:US10578972B2

    公开(公告)日:2020-03-03

    申请号:US16136453

    申请日:2018-09-20

    Abstract: An EUV collector serves for use in an EUV projection exposure apparatus. The collector guides EUV used light emitted by a plasma source region. An overall impingement surface of the collector is impinged upon by radiation emitted by the plasma source region. A used light portion of the overall impingement surface guides the EUV used light. An extraneous light portion of the overall impingement surface is impinged upon by extraneous light radiation, the wavelength of which differs from that of the used light. The used light portion and the extraneous light portion are not congruent. This EUV collector has increased efficiency can involve reduced production costs.

    Cooler for use in a device in a vacuum

    公开(公告)号:US10303067B2

    公开(公告)日:2019-05-28

    申请号:US15079617

    申请日:2016-03-24

    Abstract: The disclosure relates to a cooler for use in a device in a vacuum, wherein the partial pressure of the cooling medium in the vacuum environment during the operation of the cooler is less than 10−3 mbar. The cooler includes a heat sink, wherein a cavity through which the cooling medium flows is formed in the heat sink, and wherein the heat sink includes a connection element which surrounds one end of the cavity through which the cooling medium flows. The cooler also includes a connecting piece for joining a coolant line to the cavity. The connecting piece includes a jacket secured on the connection element by a thermal connecting process. An intermediate layer is between the jacket and the connection element. The jacket exerts a force in the direction of the connection element so that the intermediate layer is under compressive stress in the radial direction during operation of the cooler.

    Arrangement for an EUV lithography apparatus

    公开(公告)号:US11231658B2

    公开(公告)日:2022-01-25

    申请号:US16882511

    申请日:2020-05-24

    Abstract: An arrangement for an EUV lithography apparatus includes a reflective optical element (60) having an optically effective surface (62) configured to reflect incident EUV radiation, and a filament arrangement (65) configured to produce a reagent that cleans the optically effective surface (62). The filament arrangement (65) has at least one filament (66) configured as a glow or heating element. The at least one filament (66) is arranged along the optically effective surface (62) of the reflective optical element (60) wherein a thickness and/or positioning of the at least one filament (66) are/is chosen so as to minimize an optical influence of the at least one filament (66) in the far field of the EUV radiation reflected by the optically effective surface (62).

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