Abstract:
A mirror for an illumination optical unit of a projection exposure apparatus comprises a spectral filter in the form of a grating structure, wherein the grating structure has a maximum edge steepness in the range of 15° to 60°.
Abstract:
A mirror for an illumination optical unit of a projection exposure apparatus comprises a spectral filter in the form of a grating structure, wherein the grating structure has a maximum edge steepness in the range of 15° to 60°.
Abstract:
An EUV collector serves for use in an EUV projection exposure apparatus. The collector guides EUV used light emitted by a plasma source region. An overall impingement surface of the collector is impinged upon by radiation emitted by the plasma source region. A used light portion of the overall impingement surface guides the EUV used light. An extraneous light portion of the overall impingement surface is impinged upon by extraneous light radiation, the wavelength of which differs from that of the used light. The used light portion and the extraneous light portion are not congruent. This EUV collector has increased efficiency can involve reduced production costs.
Abstract:
The disclosure relates to a cooler for use in a device in a vacuum, wherein the partial pressure of the cooling medium in the vacuum environment during the operation of the cooler is less than 10−3 mbar. The cooler includes a heat sink, wherein a cavity through which the cooling medium flows is formed in the heat sink, and wherein the heat sink includes a connection element which surrounds one end of the cavity through which the cooling medium flows. The cooler also includes a connecting piece for joining a coolant line to the cavity. The connecting piece includes a jacket secured on the connection element by a thermal connecting process. An intermediate layer is between the jacket and the connection element. The jacket exerts a force in the direction of the connection element so that the intermediate layer is under compressive stress in the radial direction during operation of the cooler.
Abstract:
An arrangement for an EUV lithography apparatus includes a reflective optical element (60) having an optically effective surface (62) configured to reflect incident EUV radiation, and a filament arrangement (65) configured to produce a reagent that cleans the optically effective surface (62). The filament arrangement (65) has at least one filament (66) configured as a glow or heating element. The at least one filament (66) is arranged along the optically effective surface (62) of the reflective optical element (60) wherein a thickness and/or positioning of the at least one filament (66) are/is chosen so as to minimize an optical influence of the at least one filament (66) in the far field of the EUV radiation reflected by the optically effective surface (62).
Abstract:
The disclosure relates to an optical element, in particular for a microlithographic projection exposure apparatus. The optical element has an optical effective surface. The optical element includes a substrate, a layer system that is present on the substrate, and a protective cover extending over an edge region of the optical element that is adjacent to the optical effective surface. During operation of the optical element, the protective coating reduces an ingress of hydrogen radicals into the layer system in comparison with an analogous design without the protective cover, wherein a gap is formed between the protective cover and the layer system.
Abstract:
A method for producing a reflective optical component for an EUV projection exposure apparatus, the component having a substrate having a base body, and a reflective layer arranged on the substrate, wherein the substrate has an optically operative microstructuring, comprises the following steps: working the microstructuring into the substrate, polishing the substrate after the microstructuring has been worked into the substrate, applying the reflective layer to the substrate. A reflective optical component for an EUV projection exposure apparatus correspondingly has a polished surface between the microstructuring and the reflective layer.
Abstract:
A cost-effective method for repairing reflective optical elements for EUV lithography. These optical elements (60) have a substrate (61) and a coating (62) that reflects at a working wavelength in the range between 5 nm and 20 nm and is damaged as a result of formation of hydrogen bubbles. The method includes: localizing a damaged area (63, 64, 65, 66) in the coating (62) and covering the damaged area (63, 64, 65, 66) with one or more materials having low hydrogen permeability by applying a cover element to the damaged area. The cover element is formed of a surface structure, a convex or concave surface, or a coating corresponding to the coating of the reflective optical element, or a combination thereof. The method is particularly suitable for collector mirrors (70) for EUV lithography. After the repair, the optical elements have cover elements (71, 72, 73).
Abstract:
In order to prevent delamination of a reflective coating from the substrate under the influence of reactive hydrogen, a reflective optical element (50) for EUV lithography is provided, which has a substrate (51) and a reflective coating (54) for reflecting radiation in the wavelength range of 5 nm to 20 nm. A functional layer (60) is arranged between the reflective coating (54) and the substrate (51). With the functional layer, the concentration of hydrogen in atom % at the side of the substrate facing the reflective coating is reduced by at least a factor of 2.
Abstract:
The disclosure relates to an optical element, in particular for a microlithographic projection exposure apparatus. The optical element has an optical effective surface. The optical element includes a substrate, a layer system that is present on the substrate, and a protective cover extending over an edge region of the optical element that is adjacent to the optical effective surface. During operation of the optical element, the protective coating reduces an ingress of hydrogen radicals into the layer system in comparison with an analogous design without the protective cover, wherein a gap is formed between the protective cover and the layer system.