公开(公告)号：US20120264864A1

公开(公告)日：2012-10-18

申请号：US13503337

申请日：2010-10-18

申请人： Caroll Vergelati ,  Olivier Andres ,  Vincent Schanen ,  Ludovic Odoni ,  Paul Sotta ,  Didier Long

发明人： Caroll Vergelati ,  Olivier Andres ,  Vincent Schanen ,  Ludovic Odoni ,  Paul Sotta ,  Didier Long

IPC分类号： C08K5/13 ,  C07C39/12

CPC分类号： C08G8/04 ,  C08L61/06 ,  C08L77/00 ,  C08L2666/16

摘要： The use of a phenolic compound for producing a modified polyamide having enhanced mechanical properties is described. A polyamide composition including at least such phenolic compound and optionally reinforcing or filler loads is also described. The composition is preferably a composition for molding, for example in the form of granules or powder, that can be used for the production of articles by injection-molding.

摘要翻译： 描述了使用酚类化合物制备具有增强的机械性能的改性聚酰胺。 还描述了包含至少这种酚类化合物和任选的增强或填料负载的聚酰胺组合物。 组合物优选是用于模制的组合物，例如以颗粒或粉末的形式，可用于通过注射成型制备制品。

公开(公告)号：US08609785B2

公开(公告)日：2013-12-17

申请号：US13503337

申请日：2010-10-18

申请人： Caroll Vergelati ,  Olivier Andres ,  Vincent Schanen ,  Ludovic Odoni ,  Paul Sotta ,  Didier Long

发明人： Caroll Vergelati ,  Olivier Andres ,  Vincent Schanen ,  Ludovic Odoni ,  Paul Sotta ,  Didier Long

IPC分类号： C08L77/00

CPC分类号： C08G8/04 ,  C08L61/06 ,  C08L77/00 ,  C08L2666/16

摘要： The use of a phenolic compound for producing a modified polyamide having enhanced mechanical properties is described. A polyamide composition including at least such phenolic compound and optionally reinforcing or filler loads is also described. The composition is preferably a composition for molding, for example in the form of granules or powder, that can be used for the production of articles by injection-molding.

摘要翻译： 描述了使用酚类化合物制备具有增强的机械性能的改性聚酰胺。 还描述了包含至少这种酚类化合物和任选的增强或填料负载的聚酰胺组合物。 组合物优选是用于模制的组合物，例如以颗粒或粉末的形式，可用于通过注射成型制备制品。

公开(公告)号：US20120088873A1

公开(公告)日：2012-04-12

申请号：US13260265

申请日：2010-04-08

申请人： Caroll Vergelati ,  Olivier Andres ,  Ludovic Odoni ,  Didier Long ,  Paul Sotta

发明人： Caroll Vergelati ,  Olivier Andres ,  Ludovic Odoni ,  Didier Long ,  Paul Sotta

IPC分类号： C08L77/06 ,  C08J3/20 ,  C08L61/10 ,  C08K5/435

CPC分类号： C08L77/00 ,  C08K5/435 ,  C08L61/04 ,  C08L61/06 ,  C08L2666/16

摘要： Polyamide materials having high barrier properties to fluids, gases and liquids are described. These materials can especially be used for the manufacture of articles intended to contain or to transport a fluid such as, for example, pipes, ducts or tanks.

摘要翻译： 描述了对流体，气体和液体具有高阻隔性的聚酰胺材料。 这些材料可特别用于制造用于容纳或输送诸如管道，管道或罐的流体的物品。

公开(公告)号：US08080286B2

公开(公告)日：2011-12-20

申请号：US12064062

申请日：2006-08-16

申请人： Yves Giraud ,  Carol Vergelatti ,  Didier Tupinier ,  Ludovic Odoni ,  Charlotte Basire ,  Lise Trouillet

发明人： Yves Giraud ,  Carol Vergelatti ,  Didier Tupinier ,  Ludovic Odoni ,  Charlotte Basire ,  Lise Trouillet

IPC分类号： B05D3/02 ,  C08J7/18

CPC分类号： H01L21/316 ,  C09D183/04 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  Y10T428/249953 ,  Y10T428/265 ,  C08L83/00

摘要： The present invention concerns a process for the preparation of a silicone coating of low dielectric constant, comprising the following essential steps: a) a film-forming silicone composition is deposited on the surface of a substrate, said silicone composition comprising: (i) at least one crosslinkable film-forming silicone resin, (ii) at least one α,ω-hydroxylated, essentially linear silicone oil capable of degrading under the action of heat, and (iii) at least one solvent capable of rendering the silicone resin (i) compatible with the silicone oil (ii), b) the solvent (iii) is removed, preferably by heating, and, simultaneously or sequentially, c) the film-forming silicone composition is cured by heating. The invention deals also with a silicone coating obtained by this process and an integrated circuit comprising such a silicone coating as an electrical insulator.

摘要翻译： 本发明涉及一种制备低介电常数硅氧烷涂层的方法，包括以下必要步骤：a）成膜硅氧烷组合物沉积在基材表面上，所述有机硅组合物包括：（i） 至少一种交联性成膜硅氧烷树脂，（ii）能够在热作用下降解的至少一种α，ω-羟基化，基本上直链的硅油，和（iii）至少一种能够使硅树脂（i ），b）优选通过加热，同时或顺序地除去溶剂（iii），c）通过加热固化成膜硅氧烷组合物。 本发明还涉及通过该方法获得的硅氧烷涂层和包括这种作为电绝缘体的硅氧烷涂层的集成电路。

公开(公告)号：US20090309195A1

公开(公告)日：2009-12-17

申请号：US12064062

申请日：2006-08-16

申请人： Yves Giraud ,  Carol Vergelatti ,  Didier Tupinier ,  Ludovic Odoni ,  Charlotte Basire ,  Lise Trou llet

发明人： Yves Giraud ,  Carol Vergelatti ,  Didier Tupinier ,  Ludovic Odoni ,  Charlotte Basire ,  Lise Trou llet

IPC分类号： H01L29/06 ,  B05D5/12 ,  C08L83/04 ,  B32B27/28 ,  B32B3/26

CPC分类号： H01L21/316 ,  C09D183/04 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  Y10T428/249953 ,  Y10T428/265 ,  C08L83/00

摘要： The present invention concerns a process for the preparation of a silicone coating of low dielectric constant, comprising the following essential steps: a) a film-forming silicone composition is deposited on the surface of a substrate, said silicone composition comprising: (i) at least one crosslinkable film-forming silicone resin, (ii) at least one α,ω-hydroxylated, essentially linear silicone oil capable of degrading under the action of heat, and (iii) at least one solvent capable of rendering the silicone resin (i) compatible with the silicone oil (ii), b) the solvent (iii) is removed, preferably by heating, and, simultaneously or sequentially, c) the film-forming silicone composition is cured by heating. The invention deals also with a silicone coating obtained by this process and an integrated circuit comprising such a silicone coating as an electrical insulator.

摘要翻译： 本发明涉及一种制备低介电常数硅氧烷涂层的方法，包括以下必要步骤：a）成膜硅氧烷组合物沉积在基材表面上，所述有机硅组合物包括：（i） 至少一种交联性成膜硅氧烷树脂，（ii）能够在热作用下降解的至少一种α，ω-羟基化，基本上线性的硅油，和（iii）至少一种能够使硅树脂（i ），b）优选通过加热，同时或顺序地除去溶剂（iii），c）通过加热固化成膜硅氧烷组合物。 本发明还涉及通过该方法获得的硅氧烷涂层和包括这种作为电绝缘体的硅氧烷涂层的集成电路。