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公开(公告)号：US20050197438A1
公开(公告)日：2005-09-08
申请号：US11108968
申请日：2005-04-19
IPC分类号： C08J3/22 , C08J5/00 , C08K3/00 , C08K3/26 , C08K3/36 , C08K9/04 , C08L101/00 , C08K3/34 , C08K3/22
摘要： The invention concerns thermoplastic materials with improved mechanical properties, comprising a matrix and inclusions. The materials comprise at least two families of inclusions defined by their type, shape and dimensions and optionally by their concentration. The materials can in particular be used for making molded thermoplastic articles.
摘要翻译： 本发明涉及具有改善的机械性能的热塑性材料，其包括基质和夹杂物。 这些材料包括由其类型，形状和尺寸以及任选地通过其浓度限定的至少两个夹杂物族。 该材料特别可用于制造模制的热塑性制品。
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公开(公告)号：US20100144923A1
公开(公告)日：2010-06-10
申请号：US12708990
申请日：2010-02-19
摘要： The invention concerns thermoplastic materials with improved mechanical properties, comprising a matrix and inclusions. The materials comprise at least two families of inclusions defined by their type, shape and dimensions and optionally by their concentration. The materials can in particular be used for making molded thermoplastic articles.
摘要翻译： 本发明涉及具有改善的机械性能的热塑性材料，其包括基质和夹杂物。 这些材料包括由其类型，形状和尺寸以及任选地通过其浓度限定的至少两个夹杂物族。 该材料特别可用于制造模制的热塑性制品。
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3.发明授权公开(公告)号：US08080286B2
公开(公告)日：2011-12-20
申请号：US12064062
申请日：2006-08-16
申请人： Yves Giraud , Carol Vergelatti , Didier Tupinier , Ludovic Odoni , Charlotte Basire , Lise Trouillet
发明人： Yves Giraud , Carol Vergelatti , Didier Tupinier , Ludovic Odoni , Charlotte Basire , Lise Trouillet
CPC分类号： H01L21/316 , C09D183/04 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/3122 , Y10T428/249953 , Y10T428/265 , C08L83/00
摘要： The present invention concerns a process for the preparation of a silicone coating of low dielectric constant, comprising the following essential steps: a) a film-forming silicone composition is deposited on the surface of a substrate, said silicone composition comprising: (i) at least one crosslinkable film-forming silicone resin, (ii) at least one α,ω-hydroxylated, essentially linear silicone oil capable of degrading under the action of heat, and (iii) at least one solvent capable of rendering the silicone resin (i) compatible with the silicone oil (ii), b) the solvent (iii) is removed, preferably by heating, and, simultaneously or sequentially, c) the film-forming silicone composition is cured by heating. The invention deals also with a silicone coating obtained by this process and an integrated circuit comprising such a silicone coating as an electrical insulator.
摘要翻译： 本发明涉及一种制备低介电常数硅氧烷涂层的方法，包括以下必要步骤：a）成膜硅氧烷组合物沉积在基材表面上，所述有机硅组合物包括：（i） 至少一种交联性成膜硅氧烷树脂，（ii）能够在热作用下降解的至少一种α，ω-羟基化，基本上直链的硅油，和（iii）至少一种能够使硅树脂（i ），b）优选通过加热，同时或顺序地除去溶剂（iii），c）通过加热固化成膜硅氧烷组合物。 本发明还涉及通过该方法获得的硅氧烷涂层和包括这种作为电绝缘体的硅氧烷涂层的集成电路。
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4.发明申请公开(公告)号：US20090309195A1
公开(公告)日：2009-12-17
申请号：US12064062
申请日：2006-08-16
申请人： Yves Giraud , Carol Vergelatti , Didier Tupinier , Ludovic Odoni , Charlotte Basire , Lise Trou llet
发明人： Yves Giraud , Carol Vergelatti , Didier Tupinier , Ludovic Odoni , Charlotte Basire , Lise Trou llet
CPC分类号： H01L21/316 , C09D183/04 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/3122 , Y10T428/249953 , Y10T428/265 , C08L83/00
摘要： The present invention concerns a process for the preparation of a silicone coating of low dielectric constant, comprising the following essential steps: a) a film-forming silicone composition is deposited on the surface of a substrate, said silicone composition comprising: (i) at least one crosslinkable film-forming silicone resin, (ii) at least one α,ω-hydroxylated, essentially linear silicone oil capable of degrading under the action of heat, and (iii) at least one solvent capable of rendering the silicone resin (i) compatible with the silicone oil (ii), b) the solvent (iii) is removed, preferably by heating, and, simultaneously or sequentially, c) the film-forming silicone composition is cured by heating. The invention deals also with a silicone coating obtained by this process and an integrated circuit comprising such a silicone coating as an electrical insulator.
摘要翻译： 本发明涉及一种制备低介电常数硅氧烷涂层的方法，包括以下必要步骤：a）成膜硅氧烷组合物沉积在基材表面上，所述有机硅组合物包括：（i） 至少一种交联性成膜硅氧烷树脂，（ii）能够在热作用下降解的至少一种α，ω-羟基化，基本上线性的硅油，和（iii）至少一种能够使硅树脂（i ），b）优选通过加热，同时或顺序地除去溶剂（iii），c）通过加热固化成膜硅氧烷组合物。 本发明还涉及通过该方法获得的硅氧烷涂层和包括这种作为电绝缘体的硅氧烷涂层的集成电路。
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公开(公告)号：US20100204070A1
公开(公告)日：2010-08-12
申请号：US12666812
申请日：2008-07-04
CPC分类号： C09K8/80 , B82Y30/00 , C08J5/005 , C08J5/04 , C08J2377/00 , C08K3/34 , C08K3/346 , C08K3/36 , C08K3/40 , C08L77/00
摘要： Composite propping agents of low density and of high mechanical strength are based on a thermoplastic polymer matrix, in particular having low compressive deformation at high temperatures are especially useful in the field of well fracturing for the recovery of sludges, liquids and gases present in underground reservoirs, and in particular in the field of the extraction of hydrocarbons, such as crude oil or natural gas.
摘要翻译： 低密度和高机械强度的复合支撑剂基于热塑性聚合物基质，特别是在高温下具有低的压缩变形特别可用于在井压裂领域用于回收地下储层中存在的淤泥，液体和气体 ，特别是在诸如原油或天然气的烃类的提取领域。
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