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1.发明申请公开(公告)号：US20120113594A1
公开(公告)日：2012-05-10
申请号：US13291200
申请日：2011-11-08
摘要： An apparatus and process are disclosed that relates to a thermoelectric converter for converting thermal energy into electric energy. The apparatus includes at least one magnetic circuit including magnetic flux; at least one electric coil coupled to the at least one magnetic circuit; a magnetic switch coupled to the at least one magnetic circuit which loads the at least one electric coil with magnetic flux of the at least one magnetic circuit depending on a temperature of the magnetic switch, wherein the magnetic switch has a ferromagnetic state below a critical temperature (Tc) and a paramagnetic state above the critical temperature (Tc).
摘要翻译： 公开了一种涉及将热能转换为电能的热电转换器的装置和方法。 该装置包括至少一个包括磁通量的磁路; 耦合到所述至少一个磁路的至少一个电线圈; 耦合到所述至少一个磁路的磁开关，其根据所述磁开关的温度将所述至少一个电线圈的磁通量加载到所述至少一个磁路中，其中所述磁开关具有低于临界温度的铁磁状态 （Tc）和高于临界温度（Tc）的顺磁性状态。
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2.发明授权公开(公告)号：US09209715B2
公开(公告)日：2015-12-08
申请号：US13291200
申请日：2011-11-08
摘要： An apparatus and process are disclosed that relates to a thermoelectric converter for converting thermal energy into electric energy. The apparatus includes at least one magnetic circuit including magnetic flux; at least one electric coil coupled to the at least one magnetic circuit; a magnetic switch coupled to the at least one magnetic circuit which loads the at least one electric coil with magnetic flux of the at least one magnetic circuit depending on a temperature of the magnetic switch, wherein the magnetic switch has a ferromagnetic state below a critical temperature (Tc) and a paramagnetic state above the critical temperature (Tc).
摘要翻译： 公开了一种涉及将热能转换为电能的热电转换器的装置和方法。 该装置包括至少一个包括磁通量的磁路; 耦合到所述至少一个磁路的至少一个电线圈; 耦合到所述至少一个磁路的磁开关，其根据所述磁开关的温度将所述至少一个电线圈的磁通量加载到所述至少一个磁路中，其中所述磁开关具有低于临界温度的铁磁状态 （Tc）和高于临界温度（Tc）的顺磁性状态。
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公开(公告)号：US07957144B2
公开(公告)日：2011-06-07
申请号：US12038025
申请日：2008-02-27
CPC分类号： H05K7/20809 , H05K7/20781
摘要： A heat exchange system for blade server systems is disclosed, wherein said blade server system contains a plurality of server blades arranged in a blade center, wherein the heat exchange system comprises first heat sink associated to each of said plurality of server blades, and whereby the first heat sink are adapted to collect heat emitted from heat emitting devices on said associated server blade; means for transferring heat from the heat emitting devices to the first heat sink; and a liquid cooled second heat sink associated to said blade center, whereby said first heat sink are connected to said second heat sink by thermal coupling.
摘要翻译： 公开了一种用于刀片服务器系统的热交换系统，其中所述刀片服务器系统包含布置在刀片中心中的多个服务器刀片，其中所述热交换系统包括与所述多个服务器刀片中的每一个相关联的第一散热器， 第一散热器适于收集从所述相关联的服务器刀片上的发热装置发出的热量; 用于将热量从所述发热装置传递到所述第一散热器的装置; 以及与所述叶片中心相关联的液体冷却的第二散热器，由此所述第一散热器通过热耦合连接到所述第二散热器。
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公开(公告)号：US20080225478A1
公开(公告)日：2008-09-18
申请号：US12038025
申请日：2008-02-27
IPC分类号： H05K7/20
CPC分类号： H05K7/20809 , H05K7/20781
摘要： A heat exchange system for blade server systems is disclosed, wherein said blade server system contains a plurality of server blades arranged in a blade center, wherein the heat exchange system comprises first heat sinks associated to each of said plurality of server blades, and whereby the first heat sinks are adapted to collect heat emitted from heat emitting devices on said associated server blade; means for transferring heat from the heat emitting devices to the first heat sinks; and a liquid cooled second heat sink associated to said blade center, whereby said first heat sinks are connected to said second heat sink by thermal coupling.
摘要翻译： 公开了一种用于刀片服务器系统的热交换系统，其中所述刀片服务器系统包含布置在刀片中心的多个服务器刀片，其中所述热交换系统包括与所述多个服务器刀片中的每一个相关联的第一散热器， 第一散热器适于收集从所述相关联的服务器刀片上的发热装置发出的热量; 用于将热量从所述发热装置传送到所述第一散热器的装置; 以及与所述叶片中心相关联的液体冷却的第二散热器，由此所述第一散热器通过热耦合连接到所述第二散热器。
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5.发明申请System and method for providing cooling in a three-dimensional infrastructure for massively scalable computers 有权在三维基础设施中为大规模可扩展的计算机提供冷却的系统和方法公开(公告)号：US20050152114A1
公开(公告)日：2005-07-14
申请号：US10754971
申请日：2004-01-09
申请人： Kenneth Fernandez , Claudio Fleiner , Robert Garner , Harald Huels , Manfred Ries , Winfried Wilcke
发明人： Kenneth Fernandez , Claudio Fleiner , Robert Garner , Harald Huels , Manfred Ries , Winfried Wilcke
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , G06F2200/201 , Y10T29/49169
摘要： A three-dimensional computer infrastructure cooling system is provided. The three-dimensional computer infrastructure cooling system includes at least one compute, storage, or communications brick. In addition, the three-dimensional computer infrastructure cooling system includes at least one coldrail to facilitate the removal of heat from the at least one compute, storage, or communications brick. Also, the three-dimensional computer infrastructure includes a brick-internal carrier within the at least one compute, storage, communications brick, wherein the brick-internal carrier is attached to the at least one coldrail. Moreover, the three-dimensional computer infrastructure includes a power dissipating electronic element within the at-least-one compute, storage, or communications brick, wherein the power dissipating element is attached to the brick-internal carrier.
摘要翻译： 提供三维计算机基础设施冷却系统。 三维计算机基础设施冷却系统包括至少一个计算，存储或通信砖。 此外，三维计算机基础设施冷却系统包括至少一个冷轨，以便于从至少一个计算，存储或通信砖去除热量。 此外，三维计算机基础设施包括在至少一个计算，存储，通信砖内的砖内部载体，其中砖内部载体附接到至少一个冷轨。 此外，三维计算机基础设施包括在至少一个计算，存储或通信砖内的功率消耗电子元件，其中功率耗散元件附接到砖内部载体。
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6.发明授权System and method for providing cooling in a three-dimensional infrastructure for massively scalable computers 有权在三维基础设施中为大规模可扩展的计算机提供冷却的系统和方法公开(公告)号：US07242579B2
公开(公告)日：2007-07-10
申请号：US10754971
申请日：2004-01-09
申请人： Kenneth Richard Fernandez , Claudio Matthias Fleiner , Robert Barton Garner , Harald Huels , Manfred Ries , Winfried Wolfgang Wilcke
发明人： Kenneth Richard Fernandez , Claudio Matthias Fleiner , Robert Barton Garner , Harald Huels , Manfred Ries , Winfried Wolfgang Wilcke
CPC分类号： G06F1/20 , G06F2200/201 , Y10T29/49169
摘要： A three-dimensional computer infrastructure cooling system is provided. The three-dimensional computer infrastructure cooling system includes at least one compute, storage, or communications brick. In addition, the three-dimensional computer infrastructure cooling system includes at least one coldrail to facilitate the removal of heat from the at least one compute, storage, or communications brick. Also, the three-dimensional computer infrastructure includes a brick-internal carrier within the at least one compute, storage, communications brick, wherein the brick-internal carrier is attached to the at least one coldrail. Moreover, the three-dimensional computer infrastructure includes a power dissipating electronic element within the at-least-one compute, storage, or communications brick, wherein the power dissipating element is attached to the brick-internal carrier.
摘要翻译： 提供三维计算机基础设施冷却系统。 三维计算机基础设施冷却系统包括至少一个计算，存储或通信砖。 此外，三维计算机基础设施冷却系统包括至少一个冷轨，以便于从至少一个计算，存储或通信砖去除热量。 此外，三维计算机基础设施包括在至少一个计算，存储，通信砖内的砖内部载体，其中砖内部载体附接到至少一个冷轨。 此外，三维计算机基础设施包括在至少一个计算，存储或通信砖内的功率消耗电子元件，其中功率耗散元件附接到砖内部载体。
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公开(公告)号：US09245820B2
公开(公告)日：2016-01-26
申请号：US13583021
申请日：2011-02-04
申请人： Gottfried Goldrian , Erika Goldrian , Manfred Ries
发明人： Gottfried Goldrian , Manfred Ries
IPC分类号： G06F1/20 , H05K7/20 , H01L23/473 , H01L23/467
CPC分类号： H01L23/473 , H01L23/467 , H01L2924/0002 , H05K7/20127 , H05K7/2039 , H01L2924/00
摘要： A liquid cooling device comprises a heat spreader disposed along a plurality of memory modules on a dual in-line memory module (DIMM), a cold rail block extending along the heat spreader and a compressible thermal adapter interleaved between the cold rail block and the memory modules. The thermal adapter is compressible in a direction perpendicular to the plane of the DIMM board, thus allowing the components of the cooling device to be moved and adjusted relative to each other in a direction perpendicular to the plane of the DIMM. In a preferred embodiment, matching smooth surfaces of adjacent components within the cooling device are collated with a lubricant, thus permitting a low-friction gliding of these components relative to each other and allowing the DIMM to be easily removed from the cooling device and to be replaced without effort and without tooling.
摘要翻译： 液体冷却装置包括沿着双列直插存储器模块（DIMM）的多个存储器模块设置的散热器，沿着散热器延伸的冷轨块和在冷轨块和存储器之间交错的可压缩热适配器 模块。 热转接器可在垂直于DIMM板的平面的方向上压缩，从而允许冷却装置的部件在垂直于DIMM平面的方向上相对于彼此移动和调节。 在优选实施例中，将冷却装置内的相邻部件的平滑表面与润滑剂整合，从而允许这些部件相对于彼此的低摩擦滑动，并允许DIMM容易地从冷却装置移除并且成为 更换没有努力，没有工具。
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公开(公告)号：US20130027870A1
公开(公告)日：2013-01-31
申请号：US13583021
申请日：2011-02-04
申请人： Manfred Ries , Eríka Goldrìan
发明人： Gottfríed Goldrìan , Manfred Ries
IPC分类号： G06F1/20
CPC分类号： H01L23/473 , H01L23/467 , H01L2924/0002 , H05K7/20127 , H05K7/2039 , H01L2924/00
摘要： A liquid cooling device comprises a heat spreader disposed along a plurality of memory modules on a dual in-line memory module (DIMM), a cold rail block extending along the heat spreader and a compressible thermal adapter interleaved between the cold rail block and the memory modules. The thermal adapter is compressible in a direction perpendicular to the plane of the DIMM board, thus allowing the components of the cooling device to be moved and adjusted relative to each other in a direction perpendicular to the plane of the DIMM. In a preferred embodiment, matching smooth surfaces of adjacent components within the cooling device are collated with a lubricant, thus permitting a low-friction gliding of these components relative to each other and allowing the DIMM to be easily removed from the cooling device and to be replaced without effort and without tooling.
摘要翻译： 液体冷却装置包括沿着双列直插存储器模块（DIMM）的多个存储器模块设置的散热器，沿着散热器延伸的冷轨块和在冷轨块和存储器之间交错的可压缩热适配器 模块。 热转接器可在垂直于DIMM板的平面的方向上压缩，从而允许冷却装置的部件在垂直于DIMM平面的方向上相对于彼此移动和调节。 在优选实施例中，将冷却装置内的相邻部件的平滑表面与润滑剂整合，从而允许这些部件相对于彼此的低摩擦滑动，并允许DIMM容易地从冷却装置移除并且成为 更换没有努力，没有工具。
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公开(公告)号：US20110013363A1
公开(公告)日：2011-01-20
申请号：US12502547
申请日：2009-07-14
IPC分类号： H05K7/20
CPC分类号： H05K7/20545 , H05K7/20727
摘要： A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material covering the plurality of heat emitting electronic components through heat collecting areas with different heights adapted to the different heights of the electronic components as regard to the PCB surface wherein the heat collecting areas being in thermal contact with the electronic components.
摘要翻译： 公开了一种用于冷却处理器组件的系统，其包括具有多个发热电子部件的印刷电路板（PCB）和具有热收集器的每个PCB的壳体。 热收集器构造成一体式材料，其通过热电收集区域覆盖多个发热电子部件，这些热收集区域具有适合于电子部件相对于PCB表面的不同高度的不同高度，其中集热区域与 电子元件。
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公开(公告)号：US07961465B2
公开(公告)日：2011-06-14
申请号：US12502507
申请日：2009-07-14
CPC分类号： G06F1/20 , H01L23/473 , H01L2924/0002 , H05K7/20772 , H01L2924/00
摘要： A system for cooling processor assembly is disclosed which comprises printed circuit boards (PCB) with a plurality of heat emitting electronic components, and a housing for each PCB with a heat sink covering at least partly the heat emitting electronic components. The housing comprises a base portion to which are transferred heat emitted by the electronic components. Furthermore, the system for cooling processor comprises a cooling plate on which are fixed in series the different PCBs by directly positioning the base portion of the housings onto the cooling plate. The housings for each PCB system include at their base portions clamps to be inserted into corresponding guiding holes of the cooling plate when a PCB together with its housing is positioned onto the cooling plate at a specific therefor dedicated place defined by the guiding holes. Advantageously, the PCB together with its housing is pressed against the cooling plate alongside the base portion when fixed onto the cooling plate allowing thermal coupling between the housing and the cooling plate and a hot plugging of the PCB onto the cooling plate without requiring interrupting the cooling process applied to the cooling plate.
摘要翻译： 公开了一种用于冷却处理器组件的系统，其包括具有多个发热电子部件的印刷电路板（PCB）和用于每个PCB的壳体，其具有至少部分地覆盖发热电子部件的散热片。 壳体包括基部，其被电子部件传输的热量传递到该基部。 此外，用于冷却处理器的系统包括冷却板，通过将壳体的基部直接定位在冷却板上，在冷却板上串联固定不同的PCB。 每个PCB系统的壳体包括在其基部部分处，当PCB与其壳体一起被定位在冷却板上时，插入到冷却板的相应的引导孔中，该特定的导向孔由引导孔限定。 有利地，当固定在冷却板上时，PCB与其壳体一起被压靠在冷却板上，允许壳体和冷却板之间的热耦合，以及PCB在冷却板上的热插拔，而不需要中断冷却 工艺应用于冷却板。
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