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公开(公告)号:US10120020B2
公开(公告)日:2018-11-06
申请号:US15184374
申请日:2016-06-16
Applicant: Cascade Microtech, Inc.
Inventor: Jay Salmon , Roy E. Swart , Brandon Liew
Abstract: Probe head assemblies and probe systems for testing integrated circuit devices are disclosed herein. In one embodiment, the probe head assemblies include a contacting structure and a space transformer assembly. In another embodiment, the probe head assemblies include a contacting structure, a suspension system, a flex cable interface, and a space transformer including a space transformer body and a flex cable assembly. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, and a planarization layer. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, a suspension system, a platen, a printed circuit board, a first plurality of signal conductors configured to convey a first plurality of signals external to the space transformer, and a second plurality of signal conductors configured to convey a second plurality of signals via the space transformer. The probe systems include the probe head assemblies.
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公开(公告)号:US20170330677A1
公开(公告)日:2017-11-16
申请号:US15152177
申请日:2016-05-11
Applicant: Cascade Microtech, Inc.
Inventor: Jay Salmon , Roy E. Swart , Brandon Liew
CPC classification number: H01F27/2804 , G01R1/07378 , G01R3/00 , G01R31/2889 , H01F41/041 , H05K3/368 , H05K3/4007 , H05K2201/10378
Abstract: Space transformers, planarization layers for space transformers, methods of fabricating space transformers, and methods of planarizing space transformers are disclosed herein. In one embodiment, the space transformers include a space transformer assembly including a first rigid space transformer layer, a second rigid space transformer layer, and an attachment layer that extends between the first rigid space transformer layer and the second rigid space transformer layer. In another embodiment, the space transformers include a space transformer body and a flex cable assembly. The planarization layer includes an interposer, a resilient dielectric layer, a planarized rigid dielectric layer, a plurality of holes, and an electrically conductive paste extending within the plurality of holes. In one embodiment, the methods include methods of fabricating the space transformer assembly. In another embodiment, the methods include methods of planarizing a space transformer.
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