PROBE HEAD ASSEMBLIES WITH CONSTRAINED INTERNAL MOTION AND PROBE SYSTEMS INCLUDING THE PROBE HEAD ASSEMBLIES

    公开(公告)号:US20170212166A1

    公开(公告)日:2017-07-27

    申请号:US15007459

    申请日:2016-01-27

    Inventor: Brandon Liew

    CPC classification number: G01R31/2891

    Abstract: Probe head assemblies with constrained internal motion and probe systems including the probe head assemblies are disclosed herein. The probe head assemblies include a contacting structure, an orientation-regulating structure, and a support frame. The contacting structure includes a plurality of conductive probes configured to physically and electrically contact corresponding contact pads on the DUT. The support frame is configured to support the contacting structure and the orientation-regulating structure. The orientation-regulating structure supports the contacting structure and is configured to permit translational motion of the contacting structure relative to the support frame along a contacting axis. The orientation-regulating structure further is configured to resist translational motion of the contacting structure relative to the support frame in any direction that is at least substantially perpendicular to the contacting axis. The orientation-regulating structure may include a compound linear flexure.

    Probe head assemblies and probe systems for testing integrated circuit devices

    公开(公告)号:US10120020B2

    公开(公告)日:2018-11-06

    申请号:US15184374

    申请日:2016-06-16

    Abstract: Probe head assemblies and probe systems for testing integrated circuit devices are disclosed herein. In one embodiment, the probe head assemblies include a contacting structure and a space transformer assembly. In another embodiment, the probe head assemblies include a contacting structure, a suspension system, a flex cable interface, and a space transformer including a space transformer body and a flex cable assembly. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, and a planarization layer. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, a suspension system, a platen, a printed circuit board, a first plurality of signal conductors configured to convey a first plurality of signals external to the space transformer, and a second plurality of signal conductors configured to convey a second plurality of signals via the space transformer. The probe systems include the probe head assemblies.

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