公开(公告)号：US20110127625A1

公开(公告)日：2011-06-02

申请号：US12888185

申请日：2010-09-22

申请人： Casper van der AVOORT ,  Jozef Thomas Martinus van BEEK ,  Johannes van WINGERDEN ,  Joep BONTEMPS ,  Robert James Pascoe LANDER

发明人： Casper van der AVOORT ,  Jozef Thomas Martinus van BEEK ,  Johannes van WINGERDEN ,  Joep BONTEMPS ,  Robert James Pascoe LANDER

IPC分类号： H01L29/84 ,  H01L21/30

CPC分类号： H03H9/02448 ,  H03H3/0076 ,  H03H9/2447 ,  H03H9/2473 ,  H03H9/2489

摘要： A resonator comprising a beam formed from a first material having a first Young's modulus and a first temperature coefficient of the first Young's modulus, and a second material having a second Young's modulus and a second temperature coefficient of the second Young's modulus, a sign of the second temperature coefficient being opposite to a sign of the first temperature coefficient at least within operating conditions of the resonator, wherein the ratio of the cross sectional area of the first material to the cross sectional area of the second material varies along the length of the beam, the cross sectional areas being measured substantially perpendicularly to the beam.

摘要翻译： 一种谐振器，包括由具有第一杨氏模量和第一杨氏模量的第一温度系数的第一材料形成的梁，以及具有第二杨氏模量和第二杨氏模量的第二温度系数的第二材料， 所述第二温度系数至少在所述谐振器的操作条件下与所述第一温度系数的符号相反，其中所述第一材料的横截面积与所述第二材料的横截面面积的比率沿着所述梁的长度变化 横截面面积基本上垂直于梁测量。

公开(公告)号：US20110186941A1

公开(公告)日：2011-08-04

申请号：US12916454

申请日：2010-10-29

申请人： Johannes van WINGERDEN ,  Greja Johanna Adriana Maria VERHEIJDEN ,  Gerhard KOOPS ,  Jozef Thomas Martinus van BEEK

发明人： Johannes van WINGERDEN ,  Greja Johanna Adriana Maria VERHEIJDEN ,  Gerhard KOOPS ,  Jozef Thomas Martinus van BEEK

IPC分类号： H01L29/66 ,  H01L21/02

CPC分类号： B81C1/00293 ,  B81C2203/0136 ,  B81C2203/0145

摘要： Disclosed is a device comprising a substrate carrying a microscopic structure in a cavity capped by a capping layer including a material of formula SiNxHy, wherein x>1.33 and y>0. A method of forming such a device is also disclosed.

摘要翻译： 公开了一种装置，其包括在由包含式SiN x H y的材料的覆盖层封盖的空腔中承载微观结构的基板，其中x> 1.33且y> 0。 还公开了一种形成这种装置的方法。

公开(公告)号：US20110175178A1

公开(公告)日：2011-07-21

申请号：US12953092

申请日：2010-11-23

申请人： Johannes van WINGERDEN ,  Wim van den EINDEN ,  Harold H. ROOSEN ,  Greja Johanna Adriana Maria VERHEIJDEN ,  Gerhard KOOPS ,  Didem ERNUR ,  Jozef Thomas Martinus van BEEK

发明人： Johannes van WINGERDEN ,  Wim van den EINDEN ,  Harold H. ROOSEN ,  Greja Johanna Adriana Maria VERHEIJDEN ,  Gerhard KOOPS ,  Didem ERNUR ,  Jozef Thomas Martinus van BEEK

IPC分类号： H01L29/84 ,  H01L21/20

CPC分类号： B81C1/00476 ,  B81B2201/0271 ,  B81C2203/0136 ,  B81C2203/0145 ,  H03H3/0072

摘要： A method of packaging a micro electro-mechanical structure comprises forming said structure on a substrate; depositing a sacrificial layer over said structure; patterning the sacrificial layer; depositing a SIPOS (semi-insulating polycrystalline silicon) layer over the patterned sacrificial layer; treating the SIPOS layer with an etchant to convert the SIPOS layer into a porous SIPOS layer, removing the patterned sacrificial layer through the porous layer SIPOS to form a cavity including said structure; and sealing the porous SIPOS layer. A device including such a packaged micro electro-mechanical structure is also disclosed.

摘要翻译： 包装微电子机械结构的方法包括在基底上形成所述结构; 在所述结构上沉积牺牲层; 图案化牺牲层; 在图案化的牺牲层上沉积SIPOS（半绝缘多晶硅）层; 用蚀刻剂处理SIPOS层以将SIPOS层转换成多孔SIPOS层，通过多孔层SIPOS去除图案化的牺牲层以形成包括所述结构的空腔; 并密封多孔SIPOS层。 还公开了一种包括这种封装的微机电结构的装置。

公开(公告)号：US20110315654A1

公开(公告)日：2011-12-29

申请号：US12968020

申请日：2010-12-14

申请人： Frederik Willem Maurits VANHELMONT ,  Rensinus Cornelis STRIJBOS ,  Andreas Bernardus Maria JANSMAN ,  Robertus Adrianus Maria WOLTERS ,  Johannes van WINGERDEN ,  Fredericus Christiaan van den HEUVEL

发明人： Frederik Willem Maurits VANHELMONT ,  Rensinus Cornelis STRIJBOS ,  Andreas Bernardus Maria JANSMAN ,  Robertus Adrianus Maria WOLTERS ,  Johannes van WINGERDEN ,  Fredericus Christiaan van den HEUVEL

IPC分类号： H01L41/22

CPC分类号： H03H9/564 ,  H03H3/04 ,  H03H9/02228

摘要： A method of manufacturing a Bulk Acoustic Wave device by providing an active layer formed of an electro-mechanical transducer material, providing a first electrode on the active layer, defining a first electrode portion of the device, whereby a remaining portion of the device is defined around the first electrode, providing a stop-layer on the first electrode, depositing a first dielectric layer on the resultant structure, and planarizing the first dielectric layer until the stop-layer on the first electrode is exposed.

摘要翻译： 通过提供由机电换能器材料形成的有源层来制造体声波器件的方法，在有源层上提供第一电极，限定器件的第一电极部分，从而定义器件的剩余部分 围绕第一电极，在第一电极上提供停止层，在所得结构上沉积第一电介质层，并平坦化第一电介质层，直到第一电极上的停止层露出。