Thermal ink jet printhead with improved ink resistance
    1.
    发明授权
    Thermal ink jet printhead with improved ink resistance 失效
    具有改善油墨阻力的热喷墨打印头

    公开(公告)号:US5729261A

    公开(公告)日:1998-03-17

    申请号:US623081

    申请日:1996-03-28

    IPC分类号: B41J2/05 B41J2/14 B41J2/16

    摘要: An ink jet printhead has improved resistance to the corrosive effects of ink by coating the surface of a photo-imageable polymer with an ink resistant film. In one described embodiment, a thermal ink jet element is formed by bonding together a channel plate and a heater plate. Resistors and electrical connections are formed in the heater plate. A polyimide layer is formed so as to overlie the heater plate to protect the electrical elements while providing pit structure for the heater and for ink flow bypass. A tantalum film is formed on the surface of the polyimide layer to protect the layer from the effects of corrosive ink. In another embodiment, the ink resistant film is amorphous carbon or silicon nitride.

    摘要翻译: 喷墨打印头通过用耐墨膜涂覆可光成像聚合物的表面而改善了对油墨腐蚀作用的抵抗力。 在一个描述的实施例中,通过将通道板和加热器板接合在一起形成热喷墨元件。 电阻器和电气连接形成在加热器板中。 形成聚酰亚胺层以覆盖加热板以保护电气元件,同时为加热器和墨水旁路提供凹坑结构。 在聚酰亚胺层的表面上形成钽膜以保护层免受腐蚀性墨水的影响。 在另一个实施方案中,耐油膜是无定形碳或氮化硅。

    Apparatus for bonding wafer pairs
    3.
    发明授权
    Apparatus for bonding wafer pairs 失效
    用于接合晶片对的装置

    公开(公告)号:US5545283A

    公开(公告)日:1996-08-13

    申请号:US385234

    申请日:1995-02-08

    CPC分类号: H01L21/67144 B29C43/32

    摘要: An apparatus and method for bonding wafer pairs. The apparatus includes a heated platen surrounded by a pressurization vessel. The heated platen includes channels connected to a hole which runs through the heated platen. Wafer pairs are placed on the top surface of the platen, a rubber mat is placed over the top of the wafer pairs, and a vacuum is drawn through the hole and the channels. The rubber mat compresses the wafer pairs. The platen is heated for the bonding process. The pressurization chamber is pressurized supplying additional bonding pressure to the wafer pair. Once sufficiently heated, the heated platen is liquid cooled completing the bonding process.

    摘要翻译: 一种用于接合晶片对的装置和方法。 该装置包括被加压容器包围的加热台。 加热的压板包括连接到穿过加热压板的孔的通道。 晶片对放置在压板的顶表面上,橡胶垫放置在晶片对的顶部上,并且通过孔和通道抽取真空。 橡胶垫压缩晶圆对。 加热压板以进行粘合工艺。 加压室被加压,为晶片对提供附加的结合压力。 一旦被充分加热,加热的压板是完成粘合过程的液体冷却。

    Method for remote plasma deposition of fluoropolymer films
    6.
    发明授权
    Method for remote plasma deposition of fluoropolymer films 失效
    氟聚合物膜的远程等离子体沉积方法

    公开(公告)号:US06444275B1

    公开(公告)日:2002-09-03

    申请号:US09699413

    申请日:2000-10-31

    IPC分类号: C08J718

    CPC分类号: B41J2/1606

    摘要: A thermal ink jet printhead contains, on a front face, a remote plasma deposited fluoropolymer film. The fluoropolymer film has a high fluorine to carbon ratio. The film also possesses excellent mechanical durability. The film may be prepared by forming a remote plasma from precursor gases containing flurocarbons and depositing from the remote plasma onto a front face of a thermal ink jet printhead

    摘要翻译: 热喷墨打印头在正面上包含远程等离子体沉积的氟聚合物膜。 氟聚合物膜具有高的氟碳比。 该膜还具有优异的机械耐久性。 可以通过从含有氟碳的前体气体形成远程等离子体并从远程等离子体沉积到热喷墨打印头的前面来制备膜

    High density remote plasma deposited fluoropolymer films
    8.
    发明授权
    High density remote plasma deposited fluoropolymer films 失效
    高密度远程等离子体沉积氟聚合物膜

    公开(公告)号:US06243112B1

    公开(公告)日:2001-06-05

    申请号:US08673535

    申请日:1996-07-01

    IPC分类号: B41J2135

    CPC分类号: B41J2/1606

    摘要: A thermal ink jet printhead contains, on a front face, a remote plasma deposited fluoropolymer film. The fluoropolymer film has a high fluorine to carbon ratio. The film also possesses excellent mechanical durability. The film may be prepared by forming a remote plasma from precursor gases containing fluorocarbons and depositing from the remote plasma onto a front face of a thermal ink jet printhead.

    摘要翻译: 热喷墨打印头在正面上包含远程等离子体沉积的氟聚合物膜。 氟聚合物膜具有高的氟碳比。 该膜还具有优异的机械耐久性。 可以通过从含有碳氟化合物的前体气体形成远距离等离子体并从远程等离子体沉积到热喷墨打印头的前面来制备膜。