Abstract:
Laser weldable compositions are provided which in various examples include a tricyclodecane dimethanol-modified copolymer, a terephthalate-type polyester and an inorganic filler. Compared with compositions without the tricyclodecane dimethanol-modified copolymer, the compositions of the invention have improved, uniform laser transmittance, thereby welded products including the compositions have improved bonding strength and require stronger tensile strength to be torn apart.
Abstract:
The instant disclosure relates to phosphorus-containing compounds that can be used to form flame retardant phosphorus-containing resins, and also can serve as a hardener for a flame retardant epoxy resin compositions. In particular, the phosphorus-containing compounds are modified with acyloxy groups (—O—(C═O)—R), as shown below. Incorporation of the acyloxy groups results in resins that are water resistant and exhibit improved dielectric properties.
Abstract:
A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.
Abstract:
A series of novel phosphorus-containing compounds having the formula: is provided in which R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof, as well as a polymer of formula (PI), and preparation process and use thereof are also provided.
Abstract:
The present invention relates to a phosphinated poly(2,6-dimethy phenylene oxide)oligomer, specifically an unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomer, and processes for producing the same. A thermoset produced from the unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomers according to the present invention exhibits flame retardancy and has a low dielectric constant and dissipation factor and a high glass transition temperature.
Abstract:
The present invention relates to a phosphinated poly(2,6-dimethy phenylene oxide)oligomer, specifically an unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomer, and processes for producing the same. A thermoset produced from the unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomers according to the present invention exhibits flame retardancy and has a low dielectric constant and dissipation factor and a high glass transition temperature.
Abstract:
The subject invention is related to a process for the epoxidation of olefin with peroxide, comprising reacting peroxide with olefin in the presence a solvent, wherein the solvent has Hansen Solubility Parameters (HSPs) of δT,solvent and δH,solvent and the epoxide product has Hansen Solubility Parameters (HSPs) of δT,product and δH,product, and wherein: δT,product−6≦δT,solvent≦δT,product+6, and δH,product−6≦δH,solvent.
Abstract:
Provided are an amino resin composition, a varnish, a coating layer, and a product. The amino resin composition comprises a repeating unit represented by the following Formula (I): A 13C-NMR spectrum of the amino resin composition has a first characteristic peak at 159 ppm to 161 ppm and a second characteristic peak at 70 ppm to 80 ppm. Based on the integral value of the first characteristic peak as 1, the integral value of the second characteristic peak is in the range from 0.01 to 0.25. Adopting the amino resin composition can accelerate the drying of the varnish and ensure the coating layer and the product have high hardness, high gloss and excellent color stability.
Abstract:
The present invention provides a photosensitive resin composition, comprising: (a) photo-polymerizable unsaturated compound, (b) hydroxyurethane compound, and (c) photoinitiator. The photosensitive resin composition can be used as photoresist coating for dry film photoresist to manufacture the electronic components, such as print circuit board and so on. Further, the (b) hydroxyurethane compound having [CC]/[NH2] between 0.5 and 0.9, which increases the resolution, adhesion, and stripping ability of photosensitive resin composition for dry film photoresist, and improves the effectiveness and the quality of dry film photoresist for manufacturing printed circuit board and other electric component.
Abstract:
The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows: and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.