公开(公告)号：US20110303440A1

公开(公告)日：2011-12-15

申请号：US12900226

申请日：2010-10-07

申请人： Chang Hyun LIM ,  Jung Eun KANG ,  Heung Soo PARK ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Joon Seok CHAE ,  Sung Keun PARK

发明人： Chang Hyun LIM ,  Jung Eun KANG ,  Heung Soo PARK ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Joon Seok CHAE ,  Sung Keun PARK

IPC分类号： H05K1/03 ,  H05K3/44 ,  C23C28/00

CPC分类号： H05K3/10 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/108 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2203/0315 ,  Y10T29/4913

摘要： Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.

摘要翻译： 本文公开了包括金属芯层的混合散热基板; 氧化物绝缘芯层，其形成在所述金属芯层的厚度方向上，以形成所述氧化物绝缘芯层与所述金属芯层一体形成的形状;氧化物绝缘层，其形成在所述金属芯层的一个表面或两个表面上 金属芯层，以及被配置为包括形成在氧化物绝缘芯层上的第一电路图案和形成在氧化物绝缘层上的第二电路图案的电路层及其制造方法。

公开(公告)号：US20110303437A1

公开(公告)日：2011-12-15

申请号：US12911620

申请日：2010-10-25

申请人： Chang Hyun LIM ,  Jung Eun KANG ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Joon Seok CHAE ,  Sung Keun PARK

发明人： Chang Hyun LIM ,  Jung Eun KANG ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Joon Seok CHAE ,  Sung Keun PARK

IPC分类号： H05K1/00 ,  H05B3/00

CPC分类号： H05K1/0203 ,  H05K1/053 ,  H05K2201/049 ,  H05K2201/062 ,  H05K2201/10166 ,  H05K2203/0315 ,  Y10T29/49083

摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; and a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by the heat generated from the heat generating element.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括芯层，芯层包括芯金属层和形成在芯金属层上的芯绝缘层，并分成第一区域和第二区域; 形成在芯层的第一区域中的电路层; 以及形成在芯层的第二区域中并包括积聚绝缘层和积聚电路层的堆积层。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱元件被发热元件产生的热量损坏。

公开(公告)号：US20080212336A1

公开(公告)日：2008-09-04

申请号：US12000303

申请日：2007-12-11

申请人： Joon Seok CHAE

发明人： Joon Seok CHAE

IPC分类号： F21V21/00 ,  B60Q1/14 ,  B60Q1/00

CPC分类号： F21V29/763 ,  F21K9/275 ,  F21V23/02 ,  F21V29/507 ,  F21Y2103/10 ,  F21Y2113/13 ,  F21Y2115/10

摘要： Provided is an LED light source including a frame having a V-shaped groove formed in the upper portion thereof and a heat sink formed to extend from the lower portion thereof, the V-shaped groove having a planar bottom surface on which a circuit pattern is formed; a plurality of LEDs disposed on the bottom surface of the V-shaped groove; a diffuser plate coupled to the upper end of the frame so as to diffuse light emitted from the plurality of LEDs; a pair of plugs coupled to both side ends of the frame and receiving alternating-current (AC) power from outside; and a power converter fixed and coupled to the lower portion of the frame and electrically connected to the plugs and the plurality of LEDs, the power converter converting the AC power applied from the plugs into direct-current (DC) power and supplying the DC power to the LEDs.

摘要翻译： 本发明提供一种LED光源，其包括在其上部形成有V形槽的框架和形成为从其下部延伸的散热器，所述V形槽具有平面底面，电路图案为 形成 设置在V形槽的底面上的多个LED; 耦合到所述框架的上端的扩散板，以便扩散从所述多个LED发射的光; 耦合到所述框架的两个侧端并且从外部接收交流（AC）电力的一对插头; 以及功率转换器，其固定并耦合到所述框架的下部并电连接到所述插头和所述多个LED，所述电力转换器将从所述插头施加的AC电力转换为直流（DC）电力并提供所述DC电力 到LED。